Chinese semiconductor thread II

[tokenanalyst]

Aien Semiconductor achieves breakthrough in Si-SiC ion implantation machine development​

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According to Dazhong Daily, the first generation of silicon carbide ion implanters independently developed by Ain Semiconductor has entered the market verification stage. In addition, the company is accelerating the development of the second generation of silicon carbide ion implanters that are benchmarked against international leading technology and are expected to be launched in September this year. In June this year, Ain Semiconductor will also launch a silicon-based medium-beam ion implanter, and its silicon carbide large-beam ion implanter is planned to be launched on the market at the end of the year, which is expected to fill the gap in domestic equipment in this field.​

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[tokenanalyst]

ACM Research Reports First Quarter 2025 Results​

“Our first quarter results mark a good start to 2025. We delivered 13% year-over-year revenue growth, solid profitability, and positive cash flow from operations,” said Dr. David Wang, President and Chief Executive Officer of ACM. “We achieved several strategic milestones: including the qualification of our high-temperature SPM tool by a leading logic customer in China, customer acceptance for our backside/bevel etch tool from a U.S. customer, and we received the 2025 3D InCites Technology Enablement Award for our proprietary Ultra ECP ap-p tool, which we believe is the world’s first to utilize horizontal plating for panel applications. These achievements highlight ACM’s technology leadership in both front-end processing and advanced packaging applications, which we believe will allow us to play a key role as the global industry demands innovation to advance the ever-evolving semiconductor requirements for AI.”
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Operating Highlights and Recent Announcements

• Shipments. Total shipments in the first quarter of 2025 were $157 million, compared to $245 million for the first quarter of 2024. This decrease is due in part to customer pull-ins in the fourth quarter of 2024, which contributed to stronger total shipments for that period. For reference, combined total shipments for the fourth quarter of 2024 and the first quarter of 2025 grew by 8.9% versus the prior year periods. We anticipate a return to year-on-year growth in total shipments for the second quarter of 2025. Total shipments include deliveries for revenue in the quarter and deliveries of first tool systems awaiting customer acceptance for potential revenue in future quarters.
• Qualification of High-Temp SPM Tool in China. ACM’s single-wafer high-temperature SPM tool was qualified by a key logic device manufacturer in mainland China. Featuring a proprietary nozzle that reduces acid mist and maintenance needs, the tool enhances particle control and system uptime. It supports wet etching and wafer cleaning for technology nodes at 28nm and below. ACM has now delivered SPM tools to 13 customers.
• Recognized for Innovation in High-Volume Fan-Out Panel-Level Packaging Solutions. ACM won the 2025 3D InCites Technology Enablement Award for its Ultra ECP ap-p tool, the first commercially available high-volume copper deposition system for the large panel market. This innovative system supports advanced panel sizes and delivers high uniformity through ACM’s proprietary horizontal plating approach, which we expect to help address integration challenges in advanced semiconductor packaging.

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[tokenanalyst]

Sinocera Materials: Researching and developing the next generation of 2.5D/3D packaging technology​

Recently, Shandong Guoci Functional Materials Co., Ltd. (hereinafter referred to as: Guoci Materials) stated in response to investors' questions that the company's alumina, aluminum nitride, silicon nitride, zirconium oxide, etc. as important materials can be widely used in LED, radio frequency, IGBT, logic chip packaging and other fields. Based on its material advantages, the company is developing and deploying the next generation of 2.5D/3D packaging technology .

Ceramic substrates have excellent thermal properties, microwave properties, mechanical properties and high reliability, and can be widely used in electric vehicles, electric locomotives, semiconductor lighting, aerospace, satellite communications and other fields. Ceramic substrates have a long history of application, and in recent years they have been increasingly used in the consumer market.

Sinoceramic Materials is a new material platform enterprise, established in April 2005 and listed on the Shenzhen Growth Enterprise Market in January 2012. Headquartered in Dongying City, Shandong Province, it has established production, R&D and service agencies in North China, Northeast China, the Yangtze River Delta, the Pearl River Delta, Europe, America, Southeast Asia and other regions, and customer service centers around the world. With one generation of materials and one generation of industries, the company is mainly engaged in the R&D, production and sales of various high-end ceramic materials and products, forming six major business segments: electronic materials, catalytic materials, biomedical materials, new energy materials, precision ceramics and other materials . Its products are widely used in electronic information and communications, automotive and industrial catalysis, biomedicine, new energy vehicles, semiconductors, architectural ceramics, solar photovoltaics and other fields.​

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[LanceD23]

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this is china most impressive analog chip company. dc/dc, ac/dc, synchronous rectifier, power driver,

 

[LanceD23]

I wonder if China should ban mainland companies from using TSMC at taiwan.
SMIC 's profit dropping alot because TSMC is waging a price war at 7nm/14nm . That's TSMC strategy to counter China's mature chip price war. By banning SMIC can charge higher price at 7nm, 14nm domestically.

 

[tokenanalyst]

Jiangling Technology completed hundreds of millions of yuan in financing, breaking through the bottleneck of semiconductor high-end measurement​

The domestic production and measurement equipment manufacturer Jiangling Technology has successively completed the B and B+ rounds of strategic financing. The B round of financing was led by Stonebrook Capital, and the co-investors were Hefei Industrial Investment Guozheng and Jucheng Capital; the B+ round of financing was led by Qiming Venture Partners, and the co-investors were Oriza Puhua, Chaos Investment, Chaoyue Venture Capital, Lingang Digital Fund, Hengqin Hanrui, Kaifeng Yongxiang, and the old shareholder Fengyuan Capital made additional investments in multiple rounds . The new financing funds will be mainly used for new product research and development and large-scale production capacity layout.
Multiple breakthroughs to meet the urgent needs of local scarce processes for high-end measurement
After long-term deep cultivation and continuous innovative breakthroughs in the field of high-tech barriers, Jiangling Technology has successfully achieved domestic substitution of a number of high-end mass testing equipment, filling the domestic technological gap in this field.
In front-end process control, critical thin film thickness measurement and optical critical dimension measurement have extremely high systematic technical thresholds. The continuously iterative process platform places higher requirements on the performance of measurement equipment, and the localization support of high-end measurement equipment is imminent.
Jiangling Technology has long been investing in the field of high-end semiconductor front-end measurement. Through continuous technology accumulation and solid customer practice, its core products, key thin film measurement equipment and optical key dimension measurement equipment, have been able to support the stable mass production of scarce processes in local wafer fabs, effectively filling the supply chain gaps in local advanced logic and high-end memory chip manufacturing, and significantly improving the local semiconductor industry chain's independent and controllable capabilities in key measurement links .​

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[tokenanalyst]

 

[tokenanalyst]

Suzhou RISC-V Open Source Chip Industry Innovation Center Launched​

The Suzhou RISC-V Open Source Chip Industry Innovation Center Launch Ceremony and RISC-V Industry Salon event was officially held yesterday at the Suzhou Integrated Circuit Innovation Center.
According to relevant persons in charge, after the launch of the corresponding innovation center, it will focus on three key directions: RISC-V core technology research, industrial ecosystem cultivation, and application scenario implementation. It will widely gather national innovation resources and strive to promote technological breakthroughs and industrial applications of open source chips.
The corresponding innovation center strives to achieve the goal of "authorizing more than 300 customers and promoting the mass production of more than 1,000 RISC-V chips" within five years, helping Suzhou to build a domestic RISC-V industry highland with a complete product line, a wide range of application scenarios, and a superior industrial ecology, and continuously injecting momentum into the development of the domestic chip industry.
As an open source instruction set architecture (ISA), RISC-V has rapidly risen around the world in recent years and is expected to reshape the semiconductor industry. From chip design companies to software developers, from academic research institutions to industry giants, they are all actively exploring the application and innovation of RISC-V.

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[tokenanalyst]

Jiangsu semiconductor equipment parts manufacturer launches IPO, with China Micro participating in the investment.​

Torrance Precision, a supplier of core components for semiconductor equipment in Jiangsu, has completed the registration for guidance with the Jiangsu Securities Regulatory Bureau and officially started the A-share listing process. The guidance institution is China International Capital Corporation Limited.

Jiangsu Torrance Precision was established on January 23, 2017. It is a leading precision manufacturing supplier of key components in the semiconductor etching, thin film deposition equipment and laser equipment segments in China. Its registered capital is 139 million yuan and its legal representative is Qian Ke. Its controlling shareholder is Torrance Precision Machinery (Shanghai) Co., Ltd., which holds 43.9880% of the shares.

As a national-level specialized "little giant" enterprise, the company has developed into a major supplier of many leading domestic semiconductor equipment manufacturers. Its main products are used in the core links of semiconductor equipment integrated circuit manufacturing, such as etching, thin film deposition, photolithography and coating development, chemical mechanical polishing, and ion implantation. Its partners include Yitong Semiconductor, Shengmei, Chenwei, MKS, North Huachuang, LEUVEN, and AMEC.



According to official introduction, Torrance was founded in Shanghai in September 2004. It is a leading high-end assembly OEM supplier in China. It has developed into a production base integrating gantry milling, CNC turning center, argon arc welding, brazing, ultrasonic chemical cleaning line, precision assembly and other processing technologies. The construction of Torrance's new Qidong plant took more than ten months and trial production began in January 2020.

The Qidong new factory is located in Qidong Economic Development Zone, Nantong City, Jiangsu Province. It has nearly 100 advanced machining equipment such as five-axis machining centers, gantries, vertical machining centers, CNC lathes, turning centers, and electrical machining. It is equipped with complete testing equipment, including three-coordinate measuring machines, high-power measuring microscopes, hardness testers, surface roughness testers, etc., and is capable of providing high-precision and high-cleanliness products.

Torrance's core technical capabilities cover machining, surface treatment, welding, and system assembly. Torrance Precision Manufacturing (Jiangsu) Co., Ltd. has more than ten years of assembly and engineering service experience in the semiconductor industry, and can provide module assembly, system assembly, electromechanical testing, pressure and vacuum testing, helium leak detection and other engineering and technical professional services.

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[tokenanalyst]

The world's first! "Made in Chengdu" gallium nitride quantum light source chip released​

On the evening of May 9, the China Brand Day Sichuan event "Charming Tianfu Brand Night" was held in Chengdu, and the world's first gallium nitride quantum light source chip made its debut and was officially released .

Zhou Qiang, director of the Quantum Internet Frontier Research Center of Tianfu Jiangxi Laboratory, attended the event and revealed that quantum products including gallium nitride quantum light source chips are expected to achieve multi-scenario technical verification in 2026 .

Gallium nitride quantum light source chip can be generally understood as the 'heart' of quantum Internet. "Just like the current Internet needs servers and optical fibers to transmit data, quantum Internet also needs quantum light sources to generate and transmit quantum information . Our chip is the 'heart' of the quantum information network, providing the information source for the entire system."

"Gallium nitride materials are widely used in LED lights. We combined the existing gallium nitride light source technology to make a scientific exploration and breakthrough in quantum light sources."

The traditional Internet mainly relies on mathematical encryption algorithms to ensure security, but the physical encryption method brought by quantum light source chips fundamentally solves this problem.

“ Quantum non-cloning ensures that any attempt to eavesdrop or tamper with transmitted information will be discovered immediately, which builds the highest level of protection for information security .”

Professor Zhou Qiang said, "In terms of quantum communication, its unique physical properties can elevate the level of information security to the quantum dimension, building a 'quantum moat' for sensitive data transmission in finance, government affairs, etc. In terms of computing power support, the quantum resources contained in gallium nitride materials enable chips to carry more complex quantum algorithms, providing a possible breakthrough for computing power bottlenecks in fields such as artificial intelligence and biomedicine ."

He particularly pointed out that just as the development of artificial intelligence relies on the three major infrastructures of communication, computing power and sensing, the quantum Internet will achieve technological iteration in each link - quantum communication ensures information security, quantum computing breaks through the computing power bottleneck, and quantum sensing improves the accuracy of information acquisition , forming a new generation of information infrastructure with a trinity.

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