Chinese semiconductor thread II

tokenanalyst

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Bona Semiconductor, a domestic equipment manufacturer for temporary bonding and temporary debonding, received tens of millions of yuan in A+ round financing​


Recently, Zhejiang Bona Semiconductor Equipment Co., Ltd. (Bona Semiconductor), a manufacturer of temporary bonding and debonding equipment used in advanced packaging production, received tens of millions of RMB in A+ round financing from Xiaomiao Langcheng, Caitong Capital, and Dongfang Fuhai. The funds will be mainly used for equipment R&D iteration, new production line construction and market expansion. Dumu Capital serves as the exclusive financial advisor for the project and continues to provide support to the company.

At present, Bona Semiconductor has launched a number of equipment including temporary bonding, temporary debonding equipment, and temporary debonding and cleaning all-in-one machines. The company's current mass-produced products include 12-inch fully automatic temporary debonding and cleaning integrated equipment and 12-inch fully automatic temporary bonding equipment. Based on the official launch of related wafer-level fan-out mass production lines in 2023, the number of equipment deliveries has continued to expand this year, and has obtained recognition and repeat purchase orders from many domestic 2.5D/3D, wafer-level fan-out and other advanced packaging production lines including Changdian Technology and Xinde Semiconductor.
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The independent research and development rate of Bona Semiconductor's related product components has exceeded 85%. The products are more independent and controllable, and can also be developed in accordance with the specific needs of customers, and provide super cost-effective process and equipment services. The company's products are highly advanced and in a leading position in China. Compared with imported equipment, they have the advantages of high cost performance, light weight and small size.

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tokenanalyst

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With a total investment of 500 million yuan, Zhongshun Integrated Circuit Project officially started​


According to "Microlongyou": On the morning of December 12, the Zhejiang Zhongshun Integrated Circuit Co., Ltd. project with a total investment of about 500 million yuan held a groundbreaking ceremony in Longyou Economic Development Zone. The project was successfully started, marking a solid step forward in the development of Longyou's integrated circuit industry.

Zhejiang Zhongshun Integrated Circuit Co., Ltd. is located between Qiming Road and Mintai Road in Longyou Economic Development Zone. It focuses on the research, development, production and sales of double-sided and multi-layer high-density rigid circuit boards. Its products are widely used in automotive electronics, industrial control, consumer electronics, medical equipment, new energy and other fields, and the market prospects are very broad. The project covers an area of about 40 acres. After completion, it is expected to produce 2 million square meters of integrated circuit boards annually, with an annual output value of about 800 million yuan and an annual tax payment of 24 million yuan.

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LanceD23

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Comparison of cost building a 65nm Fab in China versus in India.
For 65nm node, all equipments can be localized in China. the cost of building such at china is maybe around $3billion to $5 billion.



Taiwan PSMC partnered up in China built Nexchip.
It also partners up with tata to build india first fab at 65nm . This would cost $11billion. That would double or triple the cost compared to China.
They will have touble to recoup their investment.
They have buy all brand new equipments since the refurbished ones mostly got snatched up already.


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  • Several Guangdong-Based 12-Inch Fabs Set to Start Production in 2024
According to a local official report from Zengcheng, Guangdong, ZenSemi held a lithography machine introduction ceremony for the project of 12-inch advanced intelligent sensors and characteristic process wafers mass production lines, marking that the project has smoothly entered the debugging and production preparation phase.

It is reported that the first phase of the project covers an area of 370 acres, with a planned investment of CNY 37 billion. It is expected to start production in June 2024, with the first batch of high-yield products scheduled to be completed in late December and delivered to customers.

According to official information from CanSemi, the third phase of CanSemi’s project will establish a 12-inch integrated circuit analog characteristic process production line with a capacity of 40,000 wafers per month. Currently, the first and second phases have been put into production successively, and the company are accelerating the construction of the third phase project, striving to achieve a fixed asset investment of over CNY 4 billion in 2024 and ensure the third phase to complete construction and start production in 2024.

According to the Wechat Account “Binhai Baoan”, Huahong’ 12-inch characteristic process integrated circuit production line project is also expected to start production this year.

It is reported that the first phase of Huahong’ 12-inch power chip production line project has a total investment of CNY 22 billion, with a total construction area of 238,000㎡, and an annual production capacity of 480,000 wafers after completion. The products will mainly be used in automotive electronics, new energy, industrial control, consumer electronics, and other fields.

As per stats from Wechat Account “Global Semiconductor Observation”, there are currently 31 operating 12-inch fabs in China (Inclusive of under-construction 12-inch fixed-capacity fabs), with a total monthly capacity of approximately 1.189 million wafers.

Compared with the planned monthly capacity of 2.17 million wafers, the capacity utilization rate of these fabs is close to 54.48%, indicating significant expansion potential. Considering construction and future planning, it is estimated that China will add 24 new 12-inch fabs in the next five years, with a planned monthly capacity of 2.223 million wafers.

Assuming all planned 12-inch foundries achieve full production, the total monthly capacity of 12-inch wafers in China will exceed 4.14 million wafers in late 2026, representing a 248.19% increase in capacity utilization compared to the present.
 

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tphuang

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Comparison of cost building a 65nm Fab in China versus in India.
For 65nm node, all equipments can be localized in China. the cost of building such at china is maybe around $3billion to $5 billion.



Taiwan PSMC partnered up in China built Nexchip.
It also partners up with tata to build india first fab at 65nm . This would cost $11billion. That would double or triple the cost compared to China.
They will have touble to recoup their investment.
They have buy all brand new equipments since the refurbished ones mostly got snatched up already.


Please, Log in or Register to view URLs content!


  • Several Guangdong-Based 12-Inch Fabs Set to Start Production in 2024
According to a local official report from Zengcheng, Guangdong, ZenSemi held a lithography machine introduction ceremony for the project of 12-inch advanced intelligent sensors and characteristic process wafers mass production lines, marking that the project has smoothly entered the debugging and production preparation phase.

It is reported that the first phase of the project covers an area of 370 acres, with a planned investment of CNY 37 billion. It is expected to start production in June 2024, with the first batch of high-yield products scheduled to be completed in late December and delivered to customers.

According to official information from CanSemi, the third phase of CanSemi’s project will establish a 12-inch integrated circuit analog characteristic process production line with a capacity of 40,000 wafers per month. Currently, the first and second phases have been put into production successively, and the company are accelerating the construction of the third phase project, striving to achieve a fixed asset investment of over CNY 4 billion in 2024 and ensure the third phase to complete construction and start production in 2024.

According to the Wechat Account “Binhai Baoan”, Huahong’ 12-inch characteristic process integrated circuit production line project is also expected to start production this year.

It is reported that the first phase of Huahong’ 12-inch power chip production line project has a total investment of CNY 22 billion, with a total construction area of 238,000㎡, and an annual production capacity of 480,000 wafers after completion. The products will mainly be used in automotive electronics, new energy, industrial control, consumer electronics, and other fields.

As per stats from Wechat Account “Global Semiconductor Observation”, there are currently 31 operating 12-inch fabs in China (Inclusive of under-construction 12-inch fixed-capacity fabs), with a total monthly capacity of approximately 1.189 million wafers.

Compared with the planned monthly capacity of 2.17 million wafers, the capacity utilization rate of these fabs is close to 54.48%, indicating significant expansion potential. Considering construction and future planning, it is estimated that China will add 24 new 12-inch fabs in the next five years, with a planned monthly capacity of 2.223 million wafers.

Assuming all planned 12-inch foundries achieve full production, the total monthly capacity of 12-inch wafers in China will exceed 4.14 million wafers in late 2026, representing a 248.19% increase in capacity utilization compared to the present.
you are not comparing apples to apples here.

50k wpm 65nm plant does not use immersive tools. Cost goes up significantly once you get to 40nm capacity.

If you are going to do comparison in the future, please at least find a Chinese fab that is also fabbing 65nm. You may want to start with Yandong semi.
 

LanceD23

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you are not comparing apples to apples here.

50k wpm 65nm plant does not use immersive tools. Cost goes up significantly once you get to 40nm capacity.

If you are going to do comparison in the future, please at least find a Chinese fab that is also fabbing 65nm. You may want to start with Yandong semi.
According to available information, the cost to build a SMIC 14nm fab is estimated to be around $8.87 billion. This figure comes from reports about a "GigaFab" project by SMIC, which is designed to produce 14nm chips and is estimated to cost nearly $8.87 billion

So India's 65nm for $11 billion is costly. more costly than SMIC's 14nm fab.

My educated estimate for China's 65nm Fab is $3 to $5billion.
 
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