I do think the best option for China would be to push US companies and sadly ASML to the leading edge (EUV) so Chinese companies can take over the rest of the market, in that case if US companies are not willing to sell their best then they will not benefit from dumping their worst technology in China, in that case Chinese semiconductor companies and startups can build up enough experience and capital to develop their tech toward the leading edge.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
Tuojing Technology
Tuojing Technology (688072) is a leading domestic company in specialized mass production of PECVD, ALD, SACVD, HDPCVD, ultra-high aspect ratio trench filling CVD and hybrid bonding equipment. As of the end of June 2024, Tuojing Technology has undertaken a total of 9 major national projects (topics) and has been rated as one of the "Top Five Chinese Semiconductor Equipment Companies" by the China Semiconductor Industry Association many times.
Thanks to the fact that Tuojing Technology has always been deeply involved in the field of high-end semiconductor special equipment and focused on the research and development and industrialization of thin film deposition equipment and hybrid bonding equipment, the company's products are highly recognized by domestic customers. "As of the end of June 2024, the company has shipped more than 1,940 reaction chambers and entered more than 70 production lines. It is expected that the company will ship more than 1,000 reaction chambers in 2024, which will set a historical record." said Lv Guangquan, chairman of Tuojing Technology.
Since its establishment in 2010, Tuojing Technology has been focusing on the field of high-end semiconductor equipment. With the two former chairmen as the core, it has established an international technical team of national-level overseas high-level experts, deeply engaged in the field of thin film deposition, and gradually formed three categories of semiconductor thin film equipment product series (PECVD equipment, ALD equipment and trench filling series equipment), and subsequently expanded hybrid bonding equipment.
"At the beginning of the company's establishment, we relied on major national science and technology projects to develop 12-inch PECVD equipment and launched it to the market, realizing the industrial application of PECVD equipment. In this process, the company mastered the core technology of PECVD thin film deposition equipment and accumulated experience from research and development to industrialization of equipment products." Lu Guangquan introduced.
After achieving a breakthrough from "0 to 1" in the field of thin film deposition equipment, Tuojing Technology began to gradually form a product layout from "1 to N". Tuojing Technology has successively developed and launched ALD equipment, SACVD equipment, HDPCVD equipment, and ultra-high aspect ratio trench filling CVD equipment, broadening the company's thin film equipment product types and process coverage. In addition to thin film deposition products, facing new technological trends and market demands, Tuojing Technology has also actively laid out and successfully entered the cutting-edge technology field of high-end semiconductor equipment, and launched a series of hybrid bonding equipment products for wafer-level three-dimensional integration.
After more than ten years of innovative development, the company's PECVD, ALD, SACVD, HDPCVD, ultra-high aspect ratio trench filling CVD, hybrid bonding and other equipment products have successively passed customer verification, entered customer mass production lines, and continuously expanded the scale of mass production. At present, Tuojing Technology has R&D and industrialization bases in Shenyang, Shanghai and Haining. The annual production capacity of the Shenyang No. 1 Plant R&D and production base is about 300-350 sets, the production capacity of the Shanghai Lingang No. 1 Plant R&D and industrialization base is about 80 sets, and the Shanghai Lingang No. 2 Plant (under construction) R&D and industrialization base supports an annual production capacity of about 400 sets. Tuojing Technology is currently planning the construction of the Shenyang No. 2 Plant industrialization base to provide production capacity support for the company's subsequent development. The Shanghai Lingang No. 2 Plant under construction is expected to be put into use in the first half of 2025.
It is particularly worth mentioning that the semiconductor thin film deposition equipment focused on by Tuojing Technology, together with the lithography machine and etching machine, constitute the three main equipment for chip manufacturing. As of the end of June 2024, Tuojing Technology has successively undertaken 9 major national projects (topics) and has been rated as one of the "Top Five Chinese Semiconductor Equipment Enterprises" by the China Semiconductor Industry Association many times.
Hua Hong Wuxi IC R&D and manufacturing base phase II 12-inch production line completed and put into production.
On December 10, the 12-inch production line of Hua Hong Wuxi Integrated Circuit R&D and Manufacturing Base (Phase II) reached the milestone of completion and wafer production. This not only marks the official entry of the project from the engineering construction period into the production and operation period, but also marks that Hua Hong Group's advanced special process capabilities and manufacturing capacity have reached a new level, expanding new development space and injecting new development momentum to accelerate the development of new quality productivity.
Huahong Wuxi Base is an important measure for Huahong Group to thoroughly implement the national strategy of regional integration in the Yangtze River Delta, and it has a symbolic significance in Huahong's new 20-year development strategy. Since the construction started in March 2018, it has undergone two infrastructure constructions and two rounds of expansion, with a total investment of over 10 billion US dollars. The second phase of the project focuses on automotive-grade chip manufacturing and builds a 12-inch specialty process production line with a monthly production capacity of 83,000 pieces. Since the start of construction in June last year, the construction team has promoted the project construction with high standards and high efficiency, and completed it 100 days ahead of schedule, creating a new benchmark for production line construction in the industry. Under the "integration" strategic layout of Dahuahong, Shanghai and Wuxi have achieved flexible sharing of production capacity, iterative upgrades of processes, increasingly improved platforms, and accelerated introduction of new products to better serve the needs of economic and social development.
SJSEMI, mostly the same CoWoS
this is brilliant. Took just 18 months to finish construction of a 83k wpm fab and be put into production.
You mean that Ascend 910C will be packaged by SJ Semiconductor?
Well, that's quite a specific info on a quite undisclosed chip like the Ascend 910C
Mat be you are an expert?
ACM Shanghai plasma enhanced atomic layer deposition furnace tube equipment passed the initial verification, and the atomic layer deposition furnace tube products were further strengthened.
ACM Semiconductor Equipment (Shanghai) Co., Ltd. (hereinafter referred to as "ACM Shanghai") (Sci-Tech Board Stock Code: 688082), as a leading supplier of wafer process solutions for semiconductor front-end and advanced wafer-level packaging applications, announced today that its Ultra Fn A plasma-enhanced atomic layer deposition furnace tube equipment (PEALD) launched in 2024 has initially passed the process verification of a semiconductor customer in mainland China, and is undergoing final optimization and preparation for mass production. ACM Shanghai also announced that its Ultra Fn A thermal atomic layer deposition furnace equipment (Thermal ALD) launched in 2022 has also successfully passed the process verification of another leading mainland China customer, and its performance parameters are comparable to or even better than similar international competitors.
Ultra Fn A Plasma Enhanced Atomic Layer Deposition Furnace Equipment
The Ultra Fn A PEALD equipment of Shengmei Shanghai is currently used to deposit silicon nitride (SiN) films. The machine adopts a double-layer tube design and airflow balancing technology, which can significantly improve the uniformity within the wafer (WIW) and between wafers (WTW). By adopting plasma enhancement technology, the equipment can also effectively reduce the thermal budget of the device. In addition, by fine-tuning the storage and release amount of the precursor in the front unit, the critical size and pattern profile of the device can be controlled.
Ultra Fn A Thermal Mode Atomic Layer Deposition Furnace Equipment
Shanghai Shengmei's Ultra Fn A silicon carbonitride (SiCN) thermal mode atomic layer deposition furnace has been verified by leading domestic integrated circuit manufacturing customers. The equipment can achieve ultra-thin, void-free film deposition, and can precisely control the film thickness to achieve atomic-level deposition accuracy. At the same time, the equipment can also achieve precise carbon doping to improve the hardness and corrosion resistance of the film. In addition, the equipment also has a built-in dry cleaning function to ensure the stability of the particles.
Jiaxing Star plans to invest 1.5 billion yuan to build a 12-inch power production line
According to the announcement on the official website of the Nanhu District Government, the environmental impact assessment document for the construction project of a production line with an annual output of 180,000 12-inch high-performance automotive-grade fast recovery diode chips by Jiaxing Star Microelectronics Co., Ltd. was approved and made public recently.
The document shows that the project is invested and constructed by Jiaxing Star Microelectronics Co., Ltd., with an intended investment of 1.5 billion yuan. It will use the existing factory buildings, implement dust-free workshop renovation, and purchase photolithography machines, coating and developing machines, etchers , ion implanters, chemical plating production lines, annealing furnaces, electron microscopes, thickness gauges, stress testers, and other process and R&D testing equipment to carry out a pilot line project for automotive-grade high-performance fast recovery diode chips. After reaching full production, it will have an annual production capacity of 180,000 high-performance automotive-grade fast recovery diode chips.
"Chinese researchers have developed an on-chip integrated polarization photodetector (pol-PD), drawing inspiration from the unique polarization vision of desert ants. The study was published in the journal Science Advances."