Chinese semiconductor thread II

sunnymaxi

Major
Registered Member
I'm still not sure how come Etching tools have higher localization then Deposition tools (CVD, PVD). I always thought Etching tools are more complicated than Deposition tools
we have two industry giants in Etching field, AMEC and NAURA .. NAURA also released mother Etching machine for next generation process..

btw this list is incomplete but overall a decent chart for Non-Chinese person..

localization percentage is incorrect and they have missed many top players in different category like ion implantation , measurement , Lithography , ALD
 

tokenanalyst

Brigadier
Registered Member

Amy Instruments received tens of millions of yuan in Pre-A round of financing​


Amy Instrument announced that it has completed tens of millions of yuan in Pre-A round of financing. The financing will be mainly used to enhance the company's domestic substitution capabilities for high-precision measurement equipment used in advanced semiconductor processes, enrich product categories, and increase market development efforts.

Founded in 2022, Amy Instruments focuses on the localization of domestic precision 3D measurement equipment and the mastery of core technologies. The company's products are mainly used for microstructure measurement and defect detection in chip manufacturing processes, aiming to solve technical problems in related fields. At present, Amy Instruments' products and technologies have been recognized by leading domestic chip manufacturers, which is of great significance to promoting the development of domestic advanced processes, improving chip manufacturing yields, and shortening process R&D cycles. The company's founder, Dr. Yang Jianfei, has many years of experience in the research and development of advanced measurement and packaging equipment. He leads a strong R&D team and has established close cooperative relations with domestic and foreign research institutes and institutions such as Nanjing University, Shandong University, and Nanjing Institute of Optoelectronics.

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Wafer Measurement AFM


Measurement equipment plays an important role in the semiconductor equipment market, accounting for about 15% of the market share. Measurement equipment can monitor, identify, locate and analyze process defects in production, and plays a vital role in helping wafer fabs to promptly discover problems, improve processes and increase yields. As integrated circuits continue to become more multi-layered and complex, the importance of measurement equipment is becoming increasingly prominent.

Amy Instruments has launched a variety of measuring equipment and continues to launch new equipment. Its online industrial-grade atomic force microscope has completed the formal delivery of products to a leading chip company. In terms of technology, Amy Instruments has built technical barriers by applying for patents. At present, the company has obtained more than 20 patent authorizations. The relevant patents cover atomic force microscopes and optical measuring equipment, involving optoelectronic devices, precision machinery, positioning systems, electrical design, etc. Lu Yuanhao, the project leader of Bojiang Capital, said that measuring equipment will develop in parallel with lithography equipment in the future and play a vital role. As the most accurate measuring equipment, atomic force microscopes are becoming the main equipment for quantitative detection in advanced processes. Amy Instruments has successfully developed the first online industrial-grade atomic force microscope in China in just two years since its establishment and has delivered it to a leading chip customer. At the same time, the company will greatly expand the application areas of traditional atomic force microscopes by promoting high-throughput AFM, hybrid measurement and other methods to make up for the limitations of traditional AFM machines in terms of detection speed.

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tokenanalyst

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Semiconductor parts supplier Torrance Precision completes RMB 100 million Series C financing​

Torrance Precision, a precision manufacturing supplier of key semiconductor components in China, completed a C round of financing of 100 million yuan, with investors including Dongfang Jiafu and Guoxin Fund. Founded in 2004, Torrance Precision is a leading precision manufacturing supplier of key components in the semiconductor etching, thin film deposition equipment and laser equipment segments in China. The goal of this financing is to use the platform provided by the lead investor to actively seek strategic collaboration and industrial chain empowerment with central enterprises.

Torrens Precision is a national-level specialized "little giant" enterprise, and has developed into a major supplier of many leading domestic semiconductor equipment manufacturers, providing a solid foundation and strong guarantee for the independent control of my country's semiconductor industry and maintaining international competitiveness. Torrens Precision will take this round of financing as an opportunity to continue to increase R&D investment, comprehensively improve the technical level, steadily expand the production scale, and provide customers with better products and services.

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tokenanalyst

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Tailing Microelectronics: China's first chip company to obtain Zigbee PRO R23 + Zigbee Direct certification.​


Recently, the Zigbee protocol stack based on Telink Microelectronics TLSR9 series SoC officially obtained the Zigbee PRO R23 + Zigbee Direct compatible platform certification issued by the CSA Alliance, becoming the first chip company in China to obtain this certification. It is worth mentioning that the protocol stack used in this certification was fully independently developed by Telink, which means that Telink can provide highly optimized overall solutions with independent intellectual property rights.

Zigbee PRO R23, the latest version of the technical specification released by the CSA Alliance, introduces a number of security enhancements, ensuring and improving security from a technical architecture perspective to meet changing market demands. As another new technical specification, Zigbee Direct enables users to seamlessly interact with the Zigbee network through smartphones or other Bluetooth low-power devices without the need for a gateway, thereby simplifying the design and development process, reducing system complexity, and shortening the time to build solutions.

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tokenanalyst

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Zhenghe Microchip released a new generation of 4uA 24G millimeter wave sensor SoC chip.​


Zhuhai Zhenghe Microchip Technology Co., Ltd. (hereinafter referred to as "Zhenghe Microchip"), which has continuously made breakthroughs and innovations in the field of millimeter waves, announced today the launch of its latest ultra-low power 24G millimeter wave sensing SoC chip RS2111, marking another major leap forward for the company in the field of millimeter wave sensing. Following the successful mass production of three millimeter wave smart sensing SoC chips (RS6130, RS6240, RS7241) in 2024, the advent of RS2111 will further accelerate the popularization of millimeter wave sensing technology in smart lighting, smart door locks, smart security, smart homes and other fields, bringing a more intelligent life experience to the public.

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tokenanalyst

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Sinovation launches a new generation of high-performance FPGA prototyping system​


Xinhuazhang, founded in 2020, achieved its first-stage goal last year and realized the research and development of the full-process tool chain of digital verification EDA. The HuaPro P3 launched this time is the third-generation product of the FPGA verification system. It can be seen that with the market introduction, Xinhuazhang is more pragmatic than ever. The new generation of products that will be unveiled in ICCAD focuses on customized high-performance application chips for various heterogeneous processor architectures such as RISC-V. It has improved flexibility and ease of use, and provides flexibility and scalability with 1/2/4 chips.
The continuous development of SoC and Chiplet chip innovation, especially customized high-performance application chips based on various heterogeneous processor architectures such as RISC-V, has put forward higher requirements on the performance, capacity, high-speed interface, and debugging capabilities of the hardware verification platform. Therefore, as a domestic EDA company, Xinhuazhang Technology is also constantly improving the corresponding solutions and product capabilities of hardware verification.
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HuaPro P3 is the third-generation FPGA verification system product of Xinhuazhang. It adopts the latest generation of programmable SoC chips and combines with the self-developed HPE Compiler tool chain to support user chip designs with larger capacity, faster speed and more latest high-speed interfaces. At the same time, HuaPro P3's hardware and software systems can support automated and intelligent implementation processes, support flexible modular expansion and cloud deployment, provide high-performance hardware verification, reduce user manual input, shorten chip verification cycle, and take into account the verification performance and deep debugging requirements, providing a new generation of intelligent pre-silicon verification hardware platform for large-scale chip development such as CPU, GPU, AI, HPC, communications, and intelligent driving.

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Weaasel

Senior Member
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The United States has increased its control over semiconductors in China, and domestic substitution of RF power supplies has accelerated​


U.S. sanctions on technology blockades have promoted the accelerated verification of domestic RF power supplies. The replacement of RF power supplies has a great impact on the process. Customers have previously had little willingness to replace, but the "semiconductor manufacturing" end-use restrictions introduced by the United States in October 2022 further restricted the development of domestic semiconductors. RF power supplies have become one of the "neck" links, and the demand for domestic substitution is urgent. Domestic equipment companies are facing an increasingly close risk of supply interruption, prompting equipment-end customers to accelerate domestic substitution. RF power supply is one of the semiconductor equipment components with high technical barriers. To achieve high power and high efficiency, manufacturers need to have a deep technical accumulation of internal circuit and structural design, and cooperate with customers to continuously debug.​

View attachment 140376
Any item and I mean absolutely any item of technology worth making, China should be able to produce domestically. That way the United States will not be able to bully any third country into not supplying China even if the United States does not produce the item itself or possess any rights to the technology of, because the United States could even in such a case threaten that country with sanctions of any type.
 

LanceD23

New Member
Registered Member
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Huawei AScend 910C chip using what type of packaging technology? Is it Similar to TSMC's CoWoS?
SMIC has this packaging technology?

How about the Kirin SOC for phone? What type of packaging technology its using?

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