Chinese semiconductor thread II

[european_guy]

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This is some interesting info in the article:

Of course, this does not mean that the domestic chip industry has been affected by this and has become a frightened bird. When the author talked about this matter with many practitioners, most of them said that after the signing of the US "Chip and Science Act" in 2022, for external parties We have been mentally prepared for the gradual tightening of policies.
Amid such industry sentiment, practitioners generally maintain optimistic expectations due to the acceleration of the localization process of the semiconductor industry chain.

For some reason you didn't post the above part...

Since last year, domestic wafer fabs' demand for localized equipment has even reached the point of inspecting the components on the equipment one by one.


"Because among them, some manufacturers have actually experienced equipment shutdowns for half a year due to the inability to obtain imported equipment parts." The semiconductor equipment manufacturer said.

This is very important: fab customers actively require localized equipment sub-components because they have experienced big issues in spare parts servicing. This push alone can help fully wipe out foreign components in Chinese equipment within the very near future. For instance we already know AMEC will be fully localized within end 2024: one thing is a company policy to get rid of supply chain weakness, one thing is the active push by your customer. The latter is way stronger.

the current situation of domestic wafer foundry is that, except for photolithography machines, the localization of semiconductor equipment for 28 nanometer and above processes is relatively high. Although "complete localization" has not yet been achieved, Enough to ensure chip security.

Another confirmation that equipment for 28nm and above is localized now....apart from litho which is still hidden behind fog of (tech) war.

 

[Totoro]

huh? doesn't the last line literally say:

the current situation of domestic wafer foundry is that, except for photolithography machines, the localization of semiconductor equipment for 28 nanometer and above processes is relatively high. Although "complete localization" has not yet been achieved, Enough to ensure chip security.

So, the localization for 28nm process and above processes like 40nm, 60nm, 90nm and whatever, is relatively high but it DOES NOT include photolitography machines. Then it reiterates and states complete localization has not yet been achieved. Which, of course, it can't be, until photolitography machines are included as well.

 

[sunnymaxi]

We all have been waiting for this news ..

Equipment procurement for the Steady-State Microbeam (SSMB) EUV Light Source Laboratory in Xiongan has begun..

our Engineers now don't need to go to Germany for experiments.



@measuredingabens @tokenanalyst ..

 

[gotodistance]

China exports more semiconductor chips than the world's largest exporter of automobiles.

 

[tokenanalyst]

Zhejiang Saijin: Striving to Become a Leader in the SMIF Field and Promote the Localization of Semiconductor Manufacturing Equipment​

As one of the core equipment in the semiconductor manufacturing field, SMIF plays a vital role in ensuring the efficiency and reliability of the semiconductor production process. With the continuous development of the semiconductor industry and the continuous advancement of technology, the SMIF market is also developing.

It is well known in the industry that wafer transportation is crucial to IC manufacturing during the semiconductor manufacturing process. In order to ensure the quality of wafers when they are transferred between different processes and to prevent them from being contaminated by dust particles or other contamination, the standard mechanical interface (SMIF) technology is used. The use of SMIF technology can greatly improve production efficiency. SMIF technology is centered on the concept of "isolation technology" and aims to prevent product contamination by enclosing the wafer in an ultra-clean environment while relaxing the cleanliness requirements outside this enclosed environment, thereby greatly reducing FAB operating costs while ensuring yield.

With the continuous advancement of semiconductor technology and the increasingly stringent market demand, higher requirements are placed on the performance and functions of SMIF. In order to meet these demands, manufacturers represented by Zhejiang Saijin Semiconductor Technology Co., Ltd. (abbreviated as Zhejiang Saijin) have also continued to increase their technology layout and launch innovative products to promote the continuous development and innovation of the semiconductor industry.

Saijin started to develop SMIF products in 2018. From the beginning, it chose the technical direction of independent research and development of software and hardware. Combining the accumulated professional experience of SMIF POD and Cassette, it created a one-stop comprehensive solution of SMIF+SMIF POD+Cassette, which completely solved the problem of unclear division of responsibilities for these three products in FAB. With the good adaptability and innovation of its overall solution, it quickly achieved great success in FAB clients and served many customers including Silan, SMEC and others.

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[tokenanalyst]

Huahai Qingke Tianjin Phase II plant was successfully put into use​

The Tianjin Phase II plant of Huahai Qingke Co., Ltd. (hereinafter referred to as "Huahai Qingke"was officially put into use . Zhang Guoming, director and general manager of Huahai Qingke, and other company leaders and invited guests from China Electronics System Engineering Fourth Construction Co., Ltd. attended the ceremony to witness this exciting moment together.



director and general manager of Huahai Qingke, delivered a speech. First of all, on behalf of Huahai Qingke, he expressed his sincere welcome to all the guests present, and expressed his heartfelt thanks to the construction unit, China Electronics System Engineering Fourth Construction Co., Ltd. He said that the commissioning of the Tianjin Phase II plant is another milestone in the development history of Huahai Qingke, marking that Huahai Qingke has taken another solid step on the road of large-scale, intelligent and diversified development. The completion and opening of this plant is not only a strategic consideration based on the current situation and looking at the long-term, but also an important measure to win the competition and establish a winning advantage. In the future, Huahai Qingke will continue to adhere to the development strategy of giving equal importance to independent innovation and open cooperation, and continue to provide advanced semiconductor equipment and process integration solutions to global semiconductor companies, and contribute our strength to promoting the high-quality development of the semiconductor industry.

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[tokenanalyst]

Anji Technology's 880 million yuan fundraising project registration takes effect, and will invest in the construction of an integrated circuit material base, etc.​

On November 21, 2024, the "Issue of Convertible Corporate Bonds to Unspecified Objects Project" of Anjie Microelectronics Technology (Shanghai) Co., Ltd. (hereinafter referred to as "Anjie Technology") was registered and became effective on the Shanghai Stock Exchange.

According to the disclosure, the total amount of funds that Anjie Technology intends to raise through the issuance of convertible corporate bonds to unspecified objects will not exceed 880 million yuan (including principal). The net amount of funds raised after deducting issuance expenses will be used to invest in the Shanghai Anjie Integrated Circuit Material Base Project (380 million yuan), the Shanghai Anji Integrated Circuit Material Base Automation and Informatization Construction Project (90 million yuan), the Ningbo Anji's new 20,000 tons/year integrated circuit material production project (80 million yuan), the Anjie Technology Shanghai Jinqiao Production Base R&D equipment purchase project (110 million yuan), and to supplement working capital (240 million yuan).

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[tokenanalyst]

huh? doesn't the last line literally say:

So, the localization for 28nm process and above processes like 40nm, 60nm, 90nm and whatever, is relatively high but it DOES NOT include photolitography machines. Then it reiterates and states complete localization has not yet been achieved. Which, of course, it can't be, until photolitography machines are included as well.

MIIT announced the localization of dry lithography machines, if the MIIT announced, that means that those machines already are in mass production and had been used in the high volume wafer manufacturing probably for years on. The immersion lithography machine looks like is already in production and being used in low volume wafer manufacturing.

 

[tokenanalyst]

Invest 3 billion! Another advanced packaging project starts!​

On November 20, the construction of the Green and Low-carbon Semiconductor Industrial Park and Weixin Integrated Circuit Packaging and Testing (Phase II) project in Tianqu New District, Dezhou started. The project plans to invest 3 billion yuan, with a total planned construction area of about 74,800 square meters, and is scheduled to be completed by the end of 2025.

In recent years, Tianqu New District has been unswervingly strengthening, optimizing and distinctive the new generation of information technology industry. In accordance with the path and goal of "mid-end first, high-end later, module first, device later", it has initially formed a complete industrial ecology from substrate epitaxy, chip manufacturing, packaging and testing, device modules to terminal applications. It has been successfully selected as a provincial strategic emerging industry cluster and digital industry cluster, and has built an important national integrated circuit key material base, occupying a place in the national integrated circuit map.

After the completion of the Green and Low-carbon Semiconductor Industrial Park, it will provide an important space for the development of industrial agglomeration. In 2014, Verizon United Semiconductor settled in Dezhou and became the pioneer of Dezhou and even Tianqu New District to enter the integrated circuit industry. Due to the good development, this year, Luxshare Precision, a Fortune 500 company, acquired Verizon's Texas factory. "Verizon mainly produces radio frequency chips for mobile phones and other communication products, and is in the packaging and testing link of the downstream industrial chain. The industrial park is mainly used for new expansion projects planned by Luxshare after the acquisition." Li Tao, member of the Party Working Committee and deputy director of the Management Committee of Tianqu New District, introduced that the expansion project will use 74,800 square meters of high-standard clean workshops and newly install wafer-level and system-level advanced packaging and testing production lines. After all are put into production, the new district will create an integrated circuit packaging base with an annual output value of more than 10 billion yuan.

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[sunnymaxi]

MIIT announced the localization of dry lithography machines, if the MIIT announced, that means that those machines already are in mass production and had been used in the high volume wafer manufacturing probably for years on. The immersion lithography machine looks like is already in production and being used in low volume wafer manufacturing.

one more thing, if you read any Chinese article, they mostly write, 28nm and above tools localization are completed but the fact is, we have majority of Non-Litho tools below 28nm completed too like 14nm/7nm and at least shipped to one customer..