Chinese semiconductor thread II

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Loongson Technology: Plans to release 3C6000 series server chips in 2025​


Loongson Technology said on an interactive platform that there is no product release in 2024 and plans to release the 3C6000 series server chips in 2025. The 9A1000 code is scheduled to be frozen at the end of this year and delivered next year.
It is reported that Loongson Zhongke server chip is a general chip. Because it belongs to the Loongson incremental market, it will focus on some aspects in the early stage of market development, such as breakthroughs in the storage server market. The server chip products currently on sale are mainly 16-core 3C5000 and 32-core 3D5000. The next-generation server chip 3C6000 series is in the sample stage. During the productization process, the self-test performance of the 16-core version is roughly equivalent to that of Xeon 4314, and the self-test performance of the 32-core version is roughly equivalent to that of Xeon 6338. The 64-core version is expected to be packaged before the end of the year. It is expected that the 3C6000 series will be completed and officially released in Q2 2025. Because Loongson is independently developed and has cost advantages, it is expected that the Loongson 6000 series products will have certain price advantages compared to market products with the same performance.
The positioning of Loongson Zhongke GPU is first to form a self-matching with the CPU to reduce system costs. The 9A1000 currently under development is positioned as an entry-level graphics card and terminal AI reasoning acceleration (32TOP). The graphics card performance is benchmarked against AMD RX550. It is expected that the code will be frozen by the end of 2024 or before the Spring Festival, and it will strive to tape out in the first half of next year. The performance of the 9A2000 planned to be developed later is 8-10 times that of the 9A1000. On this basis, more advanced processes are used to strive for leapfrog development of 9A3000.

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AMEC was named one of the 2024 Forbes China's Top 50 Most Innovative Companies​


Recently, AMEC (Shanghai) Co., Ltd.was listed in the Forbes China's Top 50 Most Innovative Companies list for the fourth time. In the past three years, the update rate of this list has gradually increased, reaching 80% this year. AMEC has become one of the very few companies that have been on the list for three consecutive years with its outstanding innovation capabilities and continuous technological progress.

As one of the six semiconductor companies on the list, AMEC has won this honor for the fourth time, following 2020, 2022 and 2023. The 50 Chinese local innovative companies on the list this year cover 12 active innovation fields, including semiconductors, new energy, large models, commercial aerospace, robots, autonomous driving, low-altitude economy, and quantum computing.

Focusing on high-end semiconductors and pan-semiconductor equipment, AMEC continues to promote the implementation of a high-quality growth strategy driven by R&D innovation, maintains a high level of R&D investment, and makes continuous innovations and breakthroughs in the R&D of products such as etching and thin films. In the first three quarters of 2024, the company invested 1.544 billion yuan in R&D, a year-on-year increase of 95.99%, and R&D investment accounted for 28.03% of operating income. AMEC's new products continue to gain market recognition, and it continues to strengthen its R&D capabilities to accelerate the expansion of its product lines. At present, the company's research projects cover six types of equipment, and more than 20 development projects have been launched and executed. As of the end of September 2024, AMEC has a number of independent intellectual property rights and core technologies, and has applied for 2,744 patents, of which 1,716 have been authorized.

In the process of product development, design and manufacturing, AMEC continues to practice the " Ten Principles of Product Development " among the "Four Tens", always emphasizing innovation and differentiation . Through continuous breakthrough innovation, its technological capabilities have reached the international leading level. The series of etching equipment and MOCVD equipment developed by the company have reached the international advanced level in performance, and some products are global leaders in their segments. Among them, the technical capabilities of etching equipment have reached 5 nanometers and more advanced process levels, and MOCVD equipment has a far-leading market share in the field of Mini LED gallium nitride-based equipment. At the same time, the research and development of many new products such as thin-film deposition equipment such as LPCVD and ALD are progressing smoothly. The LPCVD equipment achieved its first sale in 2024, with new orders of 300 million yuan in the first three quarters.

The comprehensive competitive advantage of AMEC has been continuously enhanced, and various operating KPI indicators have reached and in some aspects exceeded the level of international advanced semiconductor equipment companies. Over the past decade, the company's operating income has continued to grow at an average annual growth rate of more than 35%. In the third quarter of 2024, the company's performance continued to maintain rapid growth, with operating income increasing by 35.96% year-on-year to 4.041 billion yuan, and net profit attributable to shareholders increasing by 152.63% year-on-year to 396 million yuan .

The evaluation dimensions of Forbes China's top 50 innovative companies in 2024 include innovation capability (corporate R&D investment and core independent intellectual property rights), corporate governance (corporate digitalization and management level), corporate growth (core financial indicators performance in the past three years), innovation-driven market advantages (core product market share and product substitutability) and corporate social image. For many years, AMEC has continuously strengthened and improved its competitive advantages in innovation capability, corporate governance, corporate growth, and innovation-driven market advantages, winning wide recognition from the industry and the market.

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Shanghai Integrated Circuit Equipment and Materials Industry Innovation Center has obtained a patent for the support edge ring structure and heat treatment device for supporting wafers, reducing the risk of adhesion between the wafer and the support edge ring.​


Information from the National Intellectual Property Administration showed that Shanghai Integrated Circuit Equipment Materials Industry Innovation Center Co., Ltd. obtained a patent called "A supporting edge ring structure and heat treatment device for supporting wafers", with authorization announcement number CN 222015384 U and application date of December 2023.
The patent abstract shows that the utility model discloses a supporting edge ring structure and a heat treatment device for supporting wafers, which relates to the field of rapid thermal treatment technology of wafers, and includes: a supporting edge ring body, the supporting edge ring body includes a first edge ring and a second edge ring sleeved on the outside of the first edge ring, the first edge ring and the second edge ring are connected by a connecting portion, the first edge ring is provided with a supporting surface for supporting the wafer, and a protrusion is provided on the supporting surface of the first edge ring, and the protrusion is used to contact the wafer. The supporting edge ring structure for supporting wafers provided by the utility model effectively reduces the contact area between the wafer and the first edge ring by providing a protrusion on the supporting surface of the first edge ring of the supporting edge ring body, and placing the wafer on the protrusion of the first edge ring, thereby reducing the risk of adhesion between the wafer and the supporting edge ring, and preventing the robot arm from colliding with the supporting edge ring when grabbing the wafer, causing damage to the robot arm, the supporting edge ring, the lifting mechanism and the wafer.

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