5N is higher purity than the 4N8 that's produced by Sibelco
3000t initially is not bad, but it's a fraction of what's produced in North Carolina IIRC
Chinese semiconductor thread II
- Thread starter vincent
- Start date
3000t initially is not bad, but it's a fraction of what's produced in North Carolina IIRC
do you recall what other level of purity they've achieved before this? I remember seeing some other quartz mines which weren't at this level of purity.
Tonoshi Technology completes angel round financing, focusing on gallium oxide epitaxial film preparation, etc.
According to the Hong Kong University of Science and Technology's Fok Ying Tung Institute, Tonoshi Technology has recently completed its angel round of financing. This round of financing of several million yuan was led by Lihe Technology. Tonoshi Technology will use this financing to introduce advanced equipment and increase the production capacity of MOCVD and mist-CVD technology routes to meet the rapidly growing market demand.
In 2022, in order to fill the gap in gallium oxide technology in China, Guangzhou Tonoshi Technology Co., Ltd. was established in Nansha, Guangzhou. Tonoshi Technology was initiated and established by Professor Chen Ziqiang, and all team members are PhD talents from HKUST (Guangzhou).
It is reported that Tonoshi Technology focuses on the preparation of gallium oxide epitaxial thin films and the research and development of high-performance semiconductor devices. Relying on the technology and research platform of HKUST (Guangzhou), it is committed to promoting the application of gallium oxide in the next generation of semiconductor technology. Through continuous technological innovation and research and development, Tonoshi Technology provides high-quality epitaxial growth services and device structure design and preparation services for downstream industries.
The core products provided by Tonoshi Technology include high-performance gallium oxide Schottky diodes (SBDs) and other new semiconductor devices. The company adopts the dual technology routes of MOCVD and mist-CVD, which can prepare gallium oxide films in various phases (β phase , α phase, ε phase) and realize precise alloying and doping processes. It has reached the international advanced level in key indicators such as uniformity, surface roughness, film thickness, doping concentration, etc.
KRE Technology (KRE) received investment from CRRC Transformation and Upgrading Fund
Changzhou Core Technology Co., Ltd. , a power semiconductor core packaging equipment manufacturer, recently announced that it has received investment from CRRC Transformation and Upgrading Fund. The investment amount was not disclosed.
KRE is a rare target in the industry that has both the ability to design automated production lines for IGBT modules and the ability to develop single-station core equipment. Its main products have been recognized by most of the top ten power semiconductor module manufacturers at home and abroad. It has built an intelligent automated packaging production line for IGBT modules. Its core equipment, the automotive-grade IGBT power module split micron pin insertion machine, has won the industry honor of "the first set" in Jiangsu Province in 2023 and has served several well-known domestic module manufacturers. The company has the ability to design automated solutions for IGBT packaging and testing lines, and independently develops key equipment for medium and high-power IGBT/SiC module packaging, including high-precision placement machines, fully automatic micron-level pin insertion machines, SiC flip-chip bonding equipment, dispensing terminal forming machines, rib cutting forming machines, chip sorting machines, KDG testing equipment, AMB testing equipment, welding assembly machines and more than a dozen other core equipment.
Visitors enter the Huawei booth at the 21st China International Semiconductor Expo in Beijing on Nov 18, 2024. [Photo/VCG]
The 21st China International Semiconductor Expo opened in Beijing on Nov 18. The three-day event showcases the entire semiconductor industry chain, including integrated circuit design, manufacturing, packaging and testing, equipment materials while also highlighting applications in 5G, industrial Internet, artificial intelligence, intelligent connected vehicles and more. The expo features eight specialized exhibition areas, encompassing all crucial aspects of the semiconductor industry chain.
A staff member presents a mobile manipulator robot, which is used for semiconductor manufacturing automation, at the 21st China International Semiconductor Expo in Beijing on Nov 18, 2024. [Photo/VCG]
A staff member displays a long-range communication chip at the 21st China International Semiconductor Expo in Beijing on Nov 18, 2024. [Photo/VCG]
A tape and reel machine on display at the 21st China International Semiconductor Expo in Beijing on Nov 18, 2024. [Photo/VCG]
Visitors marvel at the power modules on display at the 21st China International Semiconductor Expo in Beijing on Nov 18, 2024. [Photo/VCG]
Laser products for machine vision exhibited at the 21st China International Semiconductor Expo in Beijing on Nov 18, 2024. [Photo/VCG]
Professionals learn about the performance of a gaming console at the 21st China International Semiconductor Expo in Beijing on Nov 18, 2024. [Photo/VCG]
Visitors examine the semiconductor wafers at the 21st China International Semiconductor Expo in Beijing on Nov 18, 2024. [Photo/VCG]
Recently, the first 6-inch gallium arsenide wafer production line of Zhuhai Huaxin Microelectronics Co., Ltd. was officially commissioned and successfully produced the first 6-inch 2um gallium arsenide HBT wafer. It will achieve large-scale mass production in the first half of 2025. .
Guoxin Technology successfully launched a new product of automotive electronic drive-by-wire chassis drive control chip, creating a complete drive-by-wire chassis chip package solution
Recently, after the hard work of R&D personnel, the new product " CCL2200B " , an integrated automotive electronic drive-by-wire chassis drive control chip developed by Guoxin Technology, has been successfully tested internally, and all performance indicators have been tested to meet the R&D design goals. The new product CCL2200B developed this time and the high-performance MCU chip CCFC3008PC launched by the company can jointly form a complete chip set solution in the field of drive-by-wire chassis . The innovation of this solution is that it is compatible with NXP Semiconductors SC900719 (BE13), and has added 2-way current regulating valve drive, PWM frequency enhancement support to 20Khz, and two-way CANFD interface support specific frame wake-up, etc., which improves the integration of the drive-by-wire chassis system and optimizes the cost structure of the solution in the field of drive-by-wire chassis.
Focus on the MCU+ strategy implemented in the application field to improve the competitiveness of system BOM
Guoxin Technology's multi-core high-end MCU chip CCFC3008PC has demonstrated its strong strength. The chip has a built-in CPU 3007 core running at a frequency of up to 300MHz and a lock-step core, with a computing power of up to 1.94DMIPS/MHz, which fully meets the computing power requirements of chassis applications. The chip is also equipped with abundant storage space, including 256KB SRAM memory, 3MB program storage Flash and 256KB data storage Flash, all of which support ECC verification to ensure data security and reliability. In addition, CCFC3008PC also integrates a variety of communication modules and peripheral interfaces to meet the functional safety ISO 26262 ASIL-D standard, and has passed the automotive-grade quality certification AEC-Q100, providing solid technical support for the control of automotive electronic stability systems.
Combining CCFC3008PC and CCL2200B , NationalChip Technology has launched a complete and efficient integrated solution for wire-controlled chassis braking.
In this solution, CCFC3008PC, as the core of the chassis braking system, is responsible for key tasks such as information processing, calculation, drive control and communication to ensure the accuracy and timeliness of braking response; CCL2200B, as the execution unit, collects wheel speed information through the wheel speed sensor interface, provides a variety of power supply systems, executes the instructions issued by the MCU to drive the solenoid valve and motor, and also performs functions such as safety monitoring to ensure the efficient and stable operation of the control actuator.
fyi, GaA HBT is commonly used for power amplifiers in phones and anything else with transceivers. But realistically speaking, just making wafer production isn't that big of a deal. We need the Chinese chip makers to actually make the PA chips and PA modules. Cut the Taiwanese fabs out of business.