Chinese semiconductor thread II
- Thread starter vincent
- Start date
It would not count on it. Most capacity coming online in China is doing immersion lithography. SMEE still is not commercializing their machine. Also, I would not be surprised if these claims of China reducing its orders by ASML and Nikon turned out to be pure lies.
Samsung was expecting a LOT of revenue from Chinese AI hardware OEMs, these plans went off track when the stooges in D.C. increased their export controls on AI chips.
Most import are stockpiling, but China is definitely increasing capacity for lithography components and subsystems which implies they are at the edge of mass producing lithography machines, which is not good news for ASML, not good news at all.
Tatian polynomial-based annular pupil wavefront optimization method for high-NA extreme ultraviolet lithography.
Abstract
The advanced technology node has an exact error tolerance. The effect of projection objective aberration on imaging cannot be neglected. In order to reduce the effect of aberration, considering the central obscuration of the high-NA extreme ultraviolet projection objective, we propose a Tatian polynomial-based annular pupil wavefront optimization (TBAPWO) method. An active pupil consisting of 64-term Tatian polynomials is incorporated into the imaging model. The suitable coefficients of the Tatian polynomials are solved using the gradient iteration method. The optimized active pupil can improve lithographic imaging quality. Simulation results show that the TBAPWO method can effectively reduce the pattern error of imaging by more than 30%, which indicates that the effect of aberration on imaging is controlled.
What make you think China will disclose what machines are used and who's using them during a death-match tech war? All that matters is Huawei has no shortage of high end chips and non-Chinese fabs are closing down, the less the enemy knows what's happening the better.
SiC-DCM mass production by Xizhi Technology, already installed in Lotus, Zhiji, and Xiaomi.
Xizhi Technology's official Weibo account announced that their self-developed high-end electric drive SiC-DCM plastic-encapsulated power module products have been successfully mass-produced and have exceeded the production milestone of 10,000 units . This achievement marks that Xizhi Technology has made significant progress in the localization process of high-end electric drive SiC plastic-encapsulated power modules.
It is reported that this product has won the recognition and trust of many well-known OEM manufacturers at home and abroad with its excellent performance and stable quality reliability. It is revealed that SiC-DCM is mainly aimed at high-performance cars. Currently, Lotus, Zhiji, and Xiaomi SU7 Ultra are all using this module solution.
Xizhi Technology has made independent innovations in electrical circuit design, thermal circuit design, stress structure design, process path design, etc., and has applied for nearly 10 domestic and foreign patents . After testing and verification by mass production customers, the electrical performance, thermal performance, and mechanical performance indicators of Xizhi SiC-DCM plastic-encapsulated power modules are better than those of international competitors, fully demonstrating Xizhi Technology's strong strength in power module packaging technology.
Lantu 5C rate super charging pile equipped with Zhizhan SiC module
The second model jointly developed by Dongfeng Lantu and Huawei , Lantu Zhiyin, was officially launched. Lantu Zhiyin attracted attention with its ultra-long range of 901km and full-range 800V platform technology. The core competitiveness of the car lies in its industry-leading level in the three-electric field, luxury intelligence, mechanical quality and interior space.
It is particularly worth mentioning that Lantu Zhiyin adopts the self-developed 800V silicon carbide platform and 5C supercharging technology , which enables the vehicle to achieve a range of more than 500 kilometers within 15 minutes of charging.
According to "Experts Talk about Three and a Half Generations", Lantu's 5C supercharging technology also uses SiC products, using high-power liquid-cooled supercharging SiC power modules provided by Zhizhan Technology . So far, Zhizhan Technology has launched a number of world-leading SiCTeX™ series silicon carbide advanced electric drive systems and ZiPACK™ high-performance silicon carbide power modules, which have been widely used in new energy vehicles and EV supercharging. Zhizhan Technology has become a long-term partner of mainstream vehicle manufacturers and new energy customers including Xiaomi Auto, Huawei, BYD, and SAIC Group .
Huawei expects that by the end of 2024, more than 100,000 fully liquid-cooled super/fast charging cables will be deployed in more than 340 cities and major highways across the country, meeting the 200-1000V charging range, matching all vehicle models, and achieving a charging speed of "one second per kilometer."
Ruili Scientific Instruments completed strategic financing of nearly 500 million yuan to build China's "KLA"
According to Haiwang Capital, Ruili Scientific Instruments (Shanghai) Co., Ltd. ("Ruili Scientific Instruments") recently announced the completion of a strategic financing of nearly 500 million yuan. This round of financing was jointly led by Jinshi Investment and China Merchants Zhiyuan, and followed by Henan Assets, Jinxin Capital, Dingqing Investment, etc. The funds raised will be mainly used to further enhance the domestic substitution capacity of optical measurement equipment used in advanced semiconductor processes, enrich product categories, and increase market development capabilities.
It is reported that Ruili Scientific Instruments was established in 2015 and is committed to the development, production and sales of integrated circuit chip process testing equipment with independent intellectual property rights and core technologies. Its products have been industrialized and are widely used in integrated circuit chip manufacturing, LED, OLED, optical communications and other fields. As a leading enterprise in process testing equipment, Ruili Scientific Instruments' independently developed series of products such as thin film measurement, optical key dimension measurement, and optical defect detection have filled the gap in China in this field, helping production lines improve production efficiency, increase yield, and reduce equipment ownership costs, and have been recognized and praised by customers.
Lv Tongxin, the founder of Ruili Scientific Instruments , was once a research and development scientist at the world's largest mass testing equipment company, with rich industry experience and technical accumulation. Under his leadership, Ruili Scientific Instruments has brought together a professional technical team from international giants and domestic optical technology companies, dedicated to developing optical mass testing equipment with independent intellectual property rights and core technologies .
According to Haiwang Capital, Ruili Scientific Instruments has ushered in a new round of rapid development since 2019. Its product line layout in the field of front-end optical measurement equipment is in a leading position among domestic manufacturers, especially in the field of film thickness, OCD, and defect detection equipment. So far, Ruili Scientific Instruments is still the only domestic equipment manufacturer that has entered Samsung's semiconductor production line, and it is also the only domestic equipment company that provides batch pattern optical defect detection equipment for semiconductor chip manufacturing yield control.
It is reported that Ruili Scientific Instruments was established in 2015 and is committed to the development, production and sales of integrated circuit chip process testing equipment with independent intellectual property rights and core technologies. Its products have been industrialized and are widely used in integrated circuit chip manufacturing, LED, OLED, optical communications and other fields. As a leading enterprise in process testing equipment, Ruili Scientific Instruments' independently developed series of products such as thin film measurement, optical key dimension measurement, and optical defect detection have filled the gap in China in this field, helping production lines improve production efficiency, increase yield, and reduce equipment ownership costs, and have been recognized and praised by customers.
Lv Tongxin, the founder of Ruili Scientific Instruments , was once a research and development scientist at the world's largest mass testing equipment company, with rich industry experience and technical accumulation. Under his leadership, Ruili Scientific Instruments has brought together a professional technical team from international giants and domestic optical technology companies, dedicated to developing optical mass testing equipment with independent intellectual property rights and core technologies .
According to Haiwang Capital, Ruili Scientific Instruments has ushered in a new round of rapid development since 2019. Its product line layout in the field of front-end optical measurement equipment is in a leading position among domestic manufacturers, especially in the field of film thickness, OCD, and defect detection equipment. So far, Ruili Scientific Instruments is still the only domestic equipment manufacturer that has entered Samsung's semiconductor production line, and it is also the only domestic equipment company that provides batch pattern optical defect detection equipment for semiconductor chip manufacturing yield control.
Jingsheng Electromechanical: 8-inch silicon carbide epitaxial equipment and optical measurement equipment have been successfully sold, and the 12-inch three-axis thinning and polishing machine has been expanded to domestic leading packaging customers
The company actively deploys the research and development of equipment such as large silicon wafer manufacturing, chip manufacturing, and packaging. Gradually achieve breakthroughs in the localization of 8-12-inch semiconductor large silicon wafer equipment, and related products have achieved mass sales and are widely recognized by downstream customers, leading the market share in domestic semiconductor crystal growth equipment. The fully automatic single crystal silicon growth furnace products were selected into the "Leader" list of national enterprise standards in the field of special equipment for semiconductor devices, and the company's monolithic silicon epitaxial growth equipment won the 15th China Semiconductor Equipment Innovation Product.
In the field of advanced processes, the company has developed 8-12 inch decompression silicon epitaxial equipment, LPCVD and ALD equipment, and has developed a number of 12-inch wafer thinning equipment for advanced packaging. Relying on the industry development trends and opportunities of domestic substitution of semiconductor equipment, the company will continue to leverage the company's core advantage of strong innovation capabilities, accelerate the layout of core equipment in the semiconductor industry chain, and seize the domestic substitution market for semiconductor equipment.
The company's original 8-12 inch large silicon wafer equipment market has been further improved, and it has quickly achieved market breakthroughs in power semiconductor equipment and advanced process equipment. The company's 8-inch silicon carbide epitaxial equipment and optical measurement equipment have been successfully sold, and the 12-inch three-axis thinning and polishing machine has been expanded to domestic leading packaging customers. The 12-inch silicon decompression epitaxial growth equipment has achieved sales and shipments and expanded new customers, and orders for related equipment continue to grow.
In the field of advanced processes, the company has developed 8-12 inch decompression silicon epitaxial equipment, LPCVD and ALD equipment, and has developed a number of 12-inch wafer thinning equipment for advanced packaging. Relying on the industry development trends and opportunities of domestic substitution of semiconductor equipment, the company will continue to leverage the company's core advantage of strong innovation capabilities, accelerate the layout of core equipment in the semiconductor industry chain, and seize the domestic substitution market for semiconductor equipment.
The company's original 8-12 inch large silicon wafer equipment market has been further improved, and it has quickly achieved market breakthroughs in power semiconductor equipment and advanced process equipment. The company's 8-inch silicon carbide epitaxial equipment and optical measurement equipment have been successfully sold, and the 12-inch three-axis thinning and polishing machine has been expanded to domestic leading packaging customers. The 12-inch silicon decompression epitaxial growth equipment has achieved sales and shipments and expanded new customers, and orders for related equipment continue to grow.
Two headquarters bases settled in Hefei
The signing ceremony of the semiconductor key components R&D and production base and the pan-semiconductor industrial equipment R&D headquarters was held at the Baohe District Government Affairs Center in Hefei City. Baohe District signed a cooperation agreement with Goxin Zhongke Semiconductor Co., Ltd. (hereinafter referred to as Goxin Zhongke) and Anhui Jinyike Intelligent Equipment Co., Ltd. (hereinafter referred to as Jinyike).
Gaoxin Zhongke is a high-tech enterprise in the semiconductor industry, focusing on the manufacturing of core components of vacuum chambers, special precision coating technology, and the research and development and production of core coating materials. Gaoxin Zhongke plans to invest in the construction of a localized research and development production base for key semiconductor components in Baohe Economic Development Zone. The project is mainly engaged in the construction of production lines for the production of semiconductor core components and raw materials such as high-purity ceramic components for semiconductors, precision-processed silicon components for semiconductors, key components for LCD panel equipment, plasma special coatings, vacuum robots and valves.
