SMIC applies for patents related to focus monitoring of lithography machines, enabling online focus monitoring with minimal impact on product wafer graphics
Information from the National Intellectual Property Administration shows that Semiconductor Manufacturing International Corporation (Shanghai) has applied for a patent titled "Photolithography machine focus monitoring method, focus monitoring mask and formation method thereof", publication number CN 118818885 A, and application date April 2023.
The patent abstract shows a focus monitoring method for a lithography machine, a focus monitoring mask and a method for forming the same, wherein the focus monitoring mask structure includes: a light-transmitting substrate, the substrate including a chip area and a plurality of monitoring areas, the substrate having a reference surface; a shading structure located on the substrate, each monitoring area having at least one monitoring mark group, each monitoring mark group including a plurality of mark grooves located between adjacent shading structures, the plurality of mark grooves being arranged along a first direction, the bottom of the mark grooves exposing the substrate surface, different mark grooves in the same monitoring mark group having the same size in the first direction, adjacent mark grooves in the same monitoring mark group having the same spacing, different mark grooves in the same monitoring mark group having different depths, the depth of the mark groove being the size of the bottom surface of the mark groove relative to the reference surface in a direction perpendicular to the substrate surface, thereby realizing online focus monitoring with less impact on the pattern of the product wafer.