Chinese semiconductor thread II

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tokenanalyst

Brigadier
Registered Member
CFMEE launched a new litho machine for advance packaging.​

PLP 3000 Direct Write Lithography Machine​


It adopts advanced DMD digital lithography technology, without mask, and can directly transfer layout information to a substrate coated with photoresist. It is mainly used in the board-level back-end field, including FC CSP, FC BGA, Fan-In PLP, Fan-Out PLP and 2.5D/3D and other back-end packaging forms. It can support copper-clad laminates, composite materials, and glass substrates. The system adopts multi-optical engine parallel scanning technology, with automatic edge alignment, automatic focus tracking, intelligent deviation correction, and WEE/WEP functions, and has obvious advantages in RDL, UBM, TSV and other process technologies.

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broadsword

broadsword

Brigadier
tokenanalyst said:
CFMEE launched a new litho machine for advance packaging.​

PLP 3000 Direct Write Lithography Machine​


It adopts advanced DMD digital lithography technology, without mask, and can directly transfer layout information to a substrate coated with photoresist. It is mainly used in the board-level back-end field, including FC CSP, FC BGA, Fan-In PLP, Fan-Out PLP and 2.5D/3D and other back-end packaging forms. It can support copper-clad laminates, composite materials, and glass substrates. The system adopts multi-optical engine parallel scanning technology, with automatic edge alignment, automatic focus tracking, intelligent deviation correction, and WEE/WEP functions, and has obvious advantages in RDL, UBM, TSV and other process technologies.

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gotodistance

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TSMC R&D Director Yang Guanglei: Mainland China will develop its own semiconductor market and crush the world's mature process market, and cannot eat the high-end market
Taiwan doesn't have to worry about mainland semiconductors. It's very embarrassing to compete with someone with two broken legs.
Taiwan doesn’t have to worry about competition from Samsung, so why should it worry about the development of mainland semiconductors?

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curiouscat

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gotodistance said:
TSMC R&D Director Yang Guanglei: Mainland China will develop its own semiconductor market and crush the world's mature process market, and cannot eat the high-end market
Taiwan doesn't have to worry about mainland semiconductors. It's very embarrassing to compete with someone with two broken legs.
Taiwan doesn’t have to worry about competition from Samsung, so why should it worry about the development of mainland semiconductors?

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His analysis isn’t wrong. China is severely disadvantaged in high end nodes so there’s not gonna be any competition to TSMC from the mainland in high end for a long time if ever. In the low end and midrange China has big advantages in comparison.
 
Wrought

Wrought

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Registered Member
Oldschool said:
That's assuming China cannot develope its EUV..
ASML high NA scanner cost $380M each..
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No, even assuming all goes smoothly and the EUV prototype is delivered next year, the necessary testing, validation, integration, mass production, ramp up, and so on will take many years to complete. It is perfectly correct to say that genuine competition with TSMC at the leading edge is a long ways off.

That's not to say domestic development is not happening quickly, but there is still plenty of room for improvement.
 
O

Oldschool

Junior Member
Registered Member
Wrought said:
No, even assuming all goes smoothly and the EUV prototype is delivered next year, the necessary testing, validation, integration, mass production, ramp up, and so on will take many years to complete. It is perfectly correct to say that genuine competition with TSMC at the leading edge is a long ways off.

That's not to say domestic development is not happening quickly, but there is still plenty of room for improvement.
Click to expand...
Government listed goal is by 2030 it should be production using its EUV.

The window cannot stretched too long...
For example, 20 years would be unacceptable
 
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