Chinese semiconductor thread II

tphuang

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GWM's chip design subsidiary has developed China's first RISC-V auto grade MCU called M100

you can use it for AC control, HCM front light control, ACM compressor control, WPC wireless charging port module and HUD display control.

Looks like they also have M200, M300 and S300 planned. Gets more complex and targeting more important parts with each iteration.
 

tokenanalyst

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more about Tokamak but I could see this tech being used in a lithography.​

Design of sCMOS-based EUV imaging system​


Abstract​
Experimental Advanced Superconducting Tokamak (EAST) employs Extreme Ultraviolet (EUV) spectroscopic diagnostic systems to measure the impurity radiation of the core plasma. However, the sensor chip is significantly affected by the interference from hard X-rays on, resulting in a significant amount of single-pixel noise in the collected spectral image data. This interference presents significant challenges for accurately analyzing the impurity radiation in fusion plasma. To address this issue, hardware algorithms are prepared to be integrated into the detector to optimize the imaging quality. However, since the existing commercial detector could not be modified in terms of hardware and programming, decision to develop an imaging system for EUV spectral diagnosis. This imaging system will be used on EAST for EUV spectral diagnosis and for future research on hardware optimization algorithms. The imaging system is designed with the GSENSE400BSI sensor chip as the photosensitive component and the AC7Z100B board as the control center, and it also includes two high-speed transmission interfaces: USB 3.0 and Camera Link. Finally, to verify the acquisition function and imaging quality of the imaging system, tests were conducted on the established spectral image acquisition platform. The results showed that the imaging system could normally complete the spectral image acquisition with high- quality imaging.​

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FairAndUnbiased

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Would Xenon based be easier and cheaper to implement than Tin (even lower efficacy) ?
from a scientific perspective, it will be harder. it is simply a fact that even with comparable atomic absorption cross section, Sn is a solid, and Xe is a gas. That means atomic density of the Sn target is on the order of 1000x higher.

Nonetheless there are Xe based EUV sources in R&D:

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There was a 20 year old design for liquid Xe jet based LPP EUV:

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This eliminates problems with debris, but presents problems with cryogenic cooling.
 

latenlazy

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In
from a scientific perspective, it will be harder. it is simply a fact that even with comparable atomic absorption cross section, Sn is a solid, and Xe is a gas. That means atomic density of the Sn target is on the order of 1000x higher.

Nonetheless there are Xe based EUV sources in R&D:

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There was a 20 year old design for liquid Xe jet based LPP EUV:

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This eliminates problems with debris, but presents problems with cryogenic cooling.
Yeah I strongly suspected molar density for Xenon was going to be an issue. *That said* the patent which brought up this discussion seems to use a magnetic pinch to help with conversion efficiency and I am extremely curious how effective that method is.
 

interestedseal

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more about Tokamak but I could see this tech being used in a lithography.​

Design of sCMOS-based EUV imaging system​


Abstract​
Experimental Advanced Superconducting Tokamak (EAST) employs Extreme Ultraviolet (EUV) spectroscopic diagnostic systems to measure the impurity radiation of the core plasma. However, the sensor chip is significantly affected by the interference from hard X-rays on, resulting in a significant amount of single-pixel noise in the collected spectral image data. This interference presents significant challenges for accurately analyzing the impurity radiation in fusion plasma. To address this issue, hardware algorithms are prepared to be integrated into the detector to optimize the imaging quality. However, since the existing commercial detector could not be modified in terms of hardware and programming, decision to develop an imaging system for EUV spectral diagnosis. This imaging system will be used on EAST for EUV spectral diagnosis and for future research on hardware optimization algorithms. The imaging system is designed with the GSENSE400BSI sensor chip as the photosensitive component and the AC7Z100B board as the control center, and it also includes two high-speed transmission interfaces: USB 3.0 and Camera Link. Finally, to verify the acquisition function and imaging quality of the imaging system, tests were conducted on the established spectral image acquisition platform. The results showed that the imaging system could normally complete the spectral image acquisition with high- quality imaging.​

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Here is the next phase Thomson scattering diagnostic tool for plasma temperature/density measurement for EUV light source and Tokamak
 

tokenanalyst

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The GoMing semiconductor packaging project will be completed in late October!​


During the Mid-Autumn Festival, families reunite, but at the site of the GoMing Semiconductor Integrated Circuit Packaging, Testing, R&D and Industrialization Project in Tongling Economic Development Zone, the construction team still sticks to their posts. On the morning of September 16, the reporter walked into the project site and saw a scene of bustling construction. The construction teams were busy and orderly, the construction machinery was running in a roar, and the workers were sweating and working hard on the site.
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It is reported that Tongling Chiming Semiconductor Technology Co., Ltd. is a wholly-owned subsidiary of Shenzhen Mingwei Electronics Co., Ltd., a listed company, and entered the Tongling Economic Development Zone in July 2021. The company is a high-tech private enterprise focusing on semiconductor integrated circuit packaging and testing, providing a full range of chip integration packaging one-stop solutions, with more than 30,000 square meters of standardized industrial plants, more than 20,000 square meters of modern dust-free workshops and laboratories, integrating wafer grinding, chip packaging, and test taping, and is committed to building a first-class domestic intelligent manufacturing base.

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oisilener1982

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Intel's market cap is typically in the range of $150 billion to $200 billion, making it one of the largest semiconductor companies. Qualcomm's market cap is generally lower, around $100 billion, which would pose a challenge for a direct acquisition without significant financial maneuvers.
 

OptimusLion

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Huajin Semiconductor "A method for constructing a multi-chip packaging structure and a multi-chip packaging structure" patent announced

Tianyancha shows that Huajin Semiconductor Packaging Pioneer Technology R&D Center Co., Ltd. "A method for constructing a multi-chip packaging structure and a multi-chip packaging structure" patent was announced, the application publication date is September 6, 2024, and the application publication number is CN118613062A

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