Chinese semiconductor thread II

tonyget

Senior Member
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Any links to this 160 layer version? Aliexpress etc?

According to Techinsights,they found it on "ZhiTai TiPlus7100 Black Myth SSD"

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That was using the company’s Xtacking3.0 process. Now TechInsights has found YMTC’s Xtacking4.0 process in a commercial product, the ZhiTai TiPlus7100 Black Myth SSD.
 

Alb

New Member
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Jingce Electronics: Some of the main products have completed 7nm advanced process delivery and acceptance

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"the company signed a formal order with customers for brightfield defect detection equipment for 14nm advanced process nodes, which is scheduled to be delivered to customers this month".

If confirmed this is really big. This tool after lithography is the weakest link in China and one of the most difficult to overcome.
 

sunnymaxi

Captain
Registered Member
"the company signed a formal order with customers for brightfield defect detection equipment for 14nm advanced process nodes, which is scheduled to be delivered to customers this month".

If confirmed this is really big. This tool after lithography is the weakest link in China and one of the most difficult to overcome.
This is indeed a big news but they have achieved this in first quarter of this year. today is just the confirmation news..

1. The first set of brightfield optical defect detection equipment has been delivered and accepted, and orders for more advanced processes have been obtained..

2. darkfield optical defect detection equipment has completed research and development currently under the process of first delivery of machine. and we also started the certification and expansion process..

The company has made , and has obvious technological and product advantages compared with domestic peers. At present, the company's core products cover 1xnm and above processes. Advanced process film thickness products, OCD equipment and electric beam defect review equipment have received orders from leading customers . As the process becomes more and more advanced and the number of process links continues to increase, the industry develops. Higher requirements have been put forward for the level of process control, and the demand for testing equipment and measuring equipment during the manufacturing process will double.
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In 2023, Jingce Electronics achieved sales revenue of 395 million yuan in the entire semiconductor sector, an increase of 116% over the same period last year. Currently, the company has approximately 1.602 billion yuan of orders in hand in the semiconductor field.

in 2024, Jingce expecting more than double revenue as compared to 2023..
 

Quickie

Colonel
how? and what is the logic?

How did you calculate it to get "half of layers" ?
232L against 160L. Anyway, I now recall that the new stacking tech may involve additional logic layers.
Power consumption is lower than previous gen, but not because of the number of layers. It is due to enhancements to the architecture. If there are fewer layers they have to compensate that with die area to get a certain number of bits per chip.
From TechInsights:

My line of logic is that the higher bit density per layer should involve finer feature node sizes leading to lower power consumption per bit.
 

tokenanalyst

Brigadier
Registered Member

Huahai Qingke: 12-inch ultra-precision wafer thinning machine Versatile-GP300 completes first verification work​


Huahai Qingke issued an announcement stating that since the company launched the new generation of 12-inch ultra-precision wafer thinning machine Versatile-GP300 mass production machine in 2023, the company has actively promoted the client introduction work. The model has been sent to clients with different processes such as storage, advanced packaging, and CIS for verification. Recently, the company's 12-inch ultra-precision wafer thinning machine Versatile-GP300 completed the first verification work.

The Versatile-GP300 machine has an innovative layout that integrates ultra-precision grinding, polishing and cleaning units, is equipped with advanced thickness deviation and surface defect control technology, and provides a variety of system function expansion options. It has the advantages of high precision, high rigidity, and flexible process development, and can meet the wafer thinning needs of manufacturing processes such as integrated circuits and advanced packaging.

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tokenanalyst

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Great Wall Motors' "Third Generation Semiconductor Module Packaging and Testing Project" completed​

Xindong Semiconductor's annual production of 1.2 million sets of third-generation semiconductor power module packaging and testing projects was completed in May 2024, and the acceptance of soil and water conservation facilities was completed in the same month. According to the information, Xindong Semiconductor Wuxi "Third-generation Semiconductor Module Packaging and Testing Project" manufacturing base has a total investment of 800 million yuan, a construction area of about 30,000 square meters, and a planned annual production capacity of 1.2 million sets of automotive-grade modules. The project started in February 2023 and was completed in February 2024.

It is reported that in October 2022, Great Wall Motor announced that the company plans to use its own funds to jointly invest with Wei Jianjun and Wensheng Technology to establish Xindong Semiconductor, with a registered capital of 50 million yuan, of which the company will subscribe to 10 million yuan, accounting for 20%; Wensheng Technology will subscribe to 35 million yuan, accounting for 70%.
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