Chinese semiconductor thread II

[tokenanalyst]

New progress in Hubei Puyuan Quartz's annual production of 20,000 tons of semiconductor single crystal silicon quartz crucible materials (Phase I) project​

On August 21, the pile foundation project of Hubei Puyuan Quartz Technology Co., Ltd.'s annual production of 20,000 tons of semiconductor single crystal silicon quartz crucible materials (Phase I) project was successfully started.
The 100,000-ton annual production of semiconductor single crystal silicon quartz crucible project is located in the north of Juxing Avenue and the east of No. 4 North Road in the Economic Development Zone of the Railway Station in Huangzhou District, Huanggang City, Hubei Province. It is invested and constructed by Hubei Puyuan Quartz Technology Co., Ltd., with a planned total construction area of about 9329.62m² and a total investment of 200 million yuan. The first phase of the project is an annual production of 20,000 tons of semiconductor single crystal silicon quartz crucible materials. After the project is put into production, it can achieve an annual sales revenue of about 160 million yuan, an annual tax of 20 million yuan, and can provide employment for 120 people. Quartz crucible materials are irreplaceable multifunctional key materials in strategic emerging industries such as semiconductor integrated circuits, aerospace, and national defense. The start of the project fills the gap in Huanggang's semiconductor single crystal silicon production, and has positive significance for the efficient utilization of Huanggang's quartz resources and economic development.
Hubei Puyuan Quartz Technology Co., Ltd. is affiliated to Hubei Bohong Energy Co., Ltd. It was established in 2021 and is located in Huanggang City, Hubei Province. It is an enterprise mainly engaged in non-metallic mineral products industry.

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[Topazchen]

What do you think of this FT article/headline? I think the article is locked?

View attachment 135141

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FT says that Huawei's GPUs have issues. Also says CANN is buggy.

FT in the same article also says that Huawei's GPUs are in great demand and that it has got fantastic customer support.
FT is schizophrenic.

 

[chgough34]

The FT article is reporting on operational friction as if it’s something permanent. Stupid framing

 

[tphuang]

Alright, let's move on from FT article. We need to get past this habit of over-stating the important of an article by someone who clearly doesn't understand technology and reacting to them. This is not healthy behavior.

 

[BlackWindMnt]

If you have trouble reading the article use this link.

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The article was clearly written by someone who does not get the technology.

It is normal that the software support is raw because this Huawei platform has been in development for less time than Cuda. But support will improve with time.

They are also wrong in that NVidia has a huge software team and they frequently allocate their own engineers to help customers modify or write their software to work in their Cuda platform. They have done this for like a decade and a half that is why their platform is better. That Huawei is bothering to do the same though is a vast improvement over the situation with the other vendors in the market.

The main problem I see with Huawei's approach is that I think China should have made a unified software platform for all their AI vendors. The current situation risks fragmentation and duplication of effort.

IMHO China should have adopted OpenCL and built on top of that. OpenCL 3.0 basically solves all the major issues people had with initial versions. The main issue is lack of libraries built on top of it. But this could have been collaboratively by all the Chinese vendors.

Maybe fork OpenCL, but to move really fast it probably better Chinese manufacturers come together and create a domestic open standard. Just to be save and prevent western stakeholder to dictate which direction, features etc are accepted. The same for graphics standards, i'm sure Huawei can create one like apple did with Metal and make it something open on OpenHarmony as a graphics API.

 

[tokenanalyst]

Gallium nitride laser chip manufacturer GaRuiXinGuang completes angel round financing​

According to Qichacha data, on August 29, Suzhou GaRuiXingguang Technology Co., Ltd. (hereinafter referred to as GaRuiXingguang) completed its angel round of financing. The investors were Shenzhen Shuimu No. 1 Venture Capital Partnership (Limited Partnership), Suzhou Huatai Huaxin Taihu Photonics Industry Investment Fund Partnership (Limited Partnership) and Shenzhen Yili Ruiguang Technology Development Co., Ltd. GaRuiXingguang was established in May 2023 and is a R&D and manufacturing company of gallium nitride-based lasers.It is understood that gallium nitride laser chips have high energy conversion efficiency and long-term stable performance. They are new high-efficiency semiconductor light sources that are indispensable for strategic emerging industries such as laser display, high-brightness lighting, non-ferrous metal processing, 3D printing and digital lithography.

Gallium nitride lasers have the advantages of direct light emission, high efficiency, and high stability. Among them, gallium nitride laser products in the blue and green light bands have been widely used in laser processing (non-ferrous metal processing, laser direct writing), laser display (laser large-screen TV, XR micro-projection), laser lighting (car headlights), special communications and other fields.At present, Everlight Huaxin, the parent company of Gallium Ruixin Optoelectronics, is focusing on the field of gallium nitride-based lasers. Its wholly-owned subsidiary Suzhou Everlight Huaxin Semiconductor Laser Innovation Research Institute Co., Ltd. and the Suzhou Institute of Nanotechnology of the Chinese Academy of Sciences have established a "GaN Laser Joint Laboratory" to expand the application of gallium nitride materials in the blue and green laser direction.​

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[tokenanalyst]

Huahai Qingke: The development of equipment + service platform brings growth opportunities to the advanced packaging field​

　Huahai Qingke released its 2024 semi-annual report: In the first half of 2024, the company achieved operating income of 1.497 billion yuan, a year-on-year increase of 21.23%; achieved a net profit attributable to shareholders of the listed company of 433 million yuan, a year-on-year increase of 15.65%; achieved a net profit attributable to shareholders of the listed company of 368 million yuan after deducting non-recurring gains and losses, a year-on-year increase of 19.77%.

Advanced packaging core equipment welcomes opportunities, and operating performance steadily improves In the first half of 2024, the global semiconductor industry showed a warming trend. With the rapid development of AI and HPC, the requirements for chip performance and power consumption continue to increase. Chiplet and 2.5D/3D promote HBM and other advanced packaging technologies to become the main direction. The company's main products CMP and thinning equipment are the core equipment of chip stacking/advanced packaging technology, which is an important opportunity for the company's development. With the expansion of the company's new products and the gradual enhancement of its competitiveness, the company's operating performance has also steadily improved.

　　Extensive deployment of CMP/thinning/cleaning/chemical cutting and other equipment, new product development to build the company's moat

　　In the first half of 2024, the company's new polishing system architecture CMP machine Universal H300 has achieved small-scale shipments; the 12-inch ultra-precision wafer thinning machine Versatile-GP300 has obtained batch orders from leading companies in multiple fields and has been highly recognized by customers; the 12-inch wafer thinning and film bonding all-in-one machine Versatile-GM300 has been sent to domestic leading packaging and testing companies for verification; the 12-inch wafer edge cutting equipment Versatile-DT300 that meets the manufacturing processes of integrated circuits, advanced packaging, etc. has been sent to multiple customers for verification; the brush cleaning equipment used for 4/6/8-inch compound semiconductors has achieved the first acceptance. The layout of new technologies and new products has been smoothly expanded, and the company's competitiveness is expected to be further enhanced.

　　Actively promote the construction of new bases, increase R&D investment to enhance competitiveness. The Beijing subsidiary and Tianjin Phase II projects are progressing smoothly. Among them, Tianjin Phase II is mainly used to expand CMP and wafer regeneration equipment; the Beijing base mainly carries out the production of high-end equipment such as thinning and wet method, further promoting the company's platform strategic layout. In addition, the company increased its investment in innovation. In the first half of 2024, the company invested 175 million yuan in R&D, a year-on-year increase of 26.43%. In terms of core technology, it has made breakthroughs in higher performance and more advanced processes. The core technology has formed a high-intensity patent portfolio and technical barriers. The company actively conducts R&D/expansion to build the company's core competitiveness, which is expected to promote performance improvement.​

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[supersnoop]

So today's news is that Intel is having problems with their 18A production (2nm or 3nm, whatever you want to call it)

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Samsung has no major customers for 3nm
TSMC has had heat issues with 3nm
Looks like even with EUV there is a major roadblock

On a lighter note is this funny news from the Taiwan regional authorities

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When you make hiring of Taiwanese by mainland companies illegal, then of course it is "breaking the law".

 

[tokenanalyst]

Shenghejing Microsemiconductor (Jiangyin) applied for a patent for 3D vertical interconnect packaging structure and its preparation method to achieve high-density packaging​

Tianyancha intellectual property information shows that Shenghejing Microsemiconductor (Jiangyin) Co., Ltd. applied for a patent called "3D vertical interconnect packaging structure and its preparation method", publication number CN202410659699.6, and the application date is May 2024.
The patent abstract shows that the present invention provides a 3D vertical interconnect packaging structure and a preparation method thereof, wherein dielectric layers and metal layers are stacked in parallel in sequence by a lamination method and a 3D interconnect structure with spaced and parallel metal layers is prepared after cutting, and the 3D interconnect structure is vertically arranged during bonding to form a 3D vertical interconnect structure, so that the spacing between metal layers in the 3D vertical interconnect structure can be controlled by controlling the thickness of the dielectric layer in the 3D interconnect structure, the height of the metal layer in the 3D vertical interconnect structure can be controlled by controlling the length of the metal layer in the 3D interconnect structure, and the size of the contact point of the metal layer in the 3D vertical interconnect structure can be controlled by controlling the thickness of the metal layer in the 3D interconnect structure; the present invention can realize high-density packaging, and has a flexible process technology and a wide range of applications, and can avoid metal deviation to ensure product quality.

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[tphuang]

So today's news is that Intel is having problems with their 18A production (2nm or 3nm, whatever you want to call it)

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Samsung has no major customers for 3nm
TSMC has had heat issues with 3nm
Looks like even with EUV there is a major roadblock

On a lighter note is this funny news from the Taiwan regional authorities

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When you make hiring of Taiwanese by mainland companies illegal, then of course it is "breaking the law".

hmm, TSMC doesn't have real issue with 3nm. Intel is just crashing and burning. The problem is that Intel has to compete commercially against TSMC. No amount of subsidies is enough for them to overcome their own cultural issues.

SMIC on the other hand does not have to compete against TSMC so it can grow in advanced sectors.

Intel is also incompetent at getting other customers for its non leading edge product, so all that 10nm is sitting idle