According this SCMP article that also came out today, Huawei took China's top spot for mobile handset sales. So I'd say they're managing production demand fairly well.
Chinese semiconductor thread II
- Thread starter vincent
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According this SCMP article that also came out today, Huawei took China's top spot for mobile handset sales. So I'd say they're managing production demand fairly well.
Guangdong Province 3D Integrated Engineering Research Center to research and develop three-dimensional integration using relatively "backward equipment" without need EUV lithography to achieve <7nm equivalent nodes.
They have never been reliable and unbiased. They were just better at getting away with omissions, distortions, or straight lies.
The equipment that will power this technology in the future will be Highly Selective etching tools, Atomic Layer Deposition tools and thermal dissipation compounds materials and arquitectures.
EUV is resulting not as easier as many people thought it was going to be, so I think Moore's law will probably continue from 3D ICs and advance packaging.
The problem with High NA EUV is that ASML decided not to increase the size of the mask to cut on cost. It basically means you have an expensive machine with less output capacity than had they designed it otherwise.
SMIC did a good job with 7nm process and HiSilicon provided an excellent core design with SMT. Combined with packaging this means it has similar performance to 5nm chips. But replicating this achievement in the future will become increasingly difficult.
Huawei will have trouble competing once GAA transistors come out. It will be a massive bump in lowering power consumption.
SMIC did a good job with 7nm process and HiSilicon provided an excellent core design with SMT. Combined with packaging this means it has similar performance to 5nm chips. But replicating this achievement in the future will become increasingly difficult.
Well GAA is already out, the yields are not great to say the least but is already out. Huawei, SMIC, Imecas and Shanghai ICRD are working hard to get their Gate All Around manufacturing process out, like I said before, for the 3D transistors the critical technology is ALD and selective ALE but for the high density wiring is still lithography, EUV or SA DUVi.
Power remains an issue on EUV, that is why its seems that ASML is rushing their HiNA tools, EUV is not cutting cost comparable with DUVi. It remains to see if the high power research like Tsinghua SSMB or Shenzhen in FELs would solve the power issue on EUV.
Huawei and SMIC are both heavily involved in the EUV effort, which is occurring on a parallel track to the 7/5nm DUVi effort. There will undoubtedly be some delay, but I expect Huawei will remain competitive even while its technology lags the cutting edge because (1) the gap won't grow too wide and (2) sales will be buoyed by patriotic sentiment.
If this is what Huawei could do with slowing production, imagine what would happen when things are back to normal.
and don't forget CIOMP/SIOMP along with Harbin institute too. first EUV prototype coming soon. so by the time GAA tech will become normal i believe. domestically produced EUV will be in final stages of verification..