Paixin Semiconductor Packaging and Testing Equipment Headquarters Project Signed with Suzhou High-tech Zone
The Paixin Semiconductor Packaging and Testing Equipment Headquarters Project was signed and landed in Suzhou High-tech Zone.
According to news released by Suzhou High-tech Zone, Suzhou Paixin Semiconductor Technology Co., Ltd. focuses on the research and development, manufacturing and sales of advanced chip packaging and testing equipment. Its main products include advanced packaging flip-chip equipment, advanced placement machines, mass testing machines and third-party testing machines. Third generation semiconductor wafer inspection equipment, etc. The newly launched Paixin Semiconductor Packaging and Testing Equipment Headquarters will introduce advanced technology and production lines to create a company headquarters integrating production and research and development.
In recent years, the integrated circuit industry in Suzhou High-tech Zone has developed rapidly. It has institute platforms such as the East China Branch of the Fifth Electronics Institute of the Ministry of Industry and Information Technology, the national-level Suzhou Semiconductor Laser Innovation Center, and the Jiangsu Provincial Board Integrated Circuit and Component Adaptation Verification Center. The scale of the industry continues to grow, with more than 250 related companies such as Guoxin Technology gathered together, and a total of 8 listed companies have been cultivated, with the industry scale exceeding 22 billion yuan. The industrial ecology has been continuously optimized. An industrial fund of funds with a total scale of 10 billion yuan and a science and technology angel fund with a total scale of 2 billion yuan have been established. It has more than 2 million square meters of specialized carriers such as the Suzhou Integrated Circuit Innovation Center.
According to news released by Suzhou High-tech Zone, Suzhou Paixin Semiconductor Technology Co., Ltd. focuses on the research and development, manufacturing and sales of advanced chip packaging and testing equipment. Its main products include advanced packaging flip-chip equipment, advanced placement machines, mass testing machines and third-party testing machines. Third generation semiconductor wafer inspection equipment, etc. The newly launched Paixin Semiconductor Packaging and Testing Equipment Headquarters will introduce advanced technology and production lines to create a company headquarters integrating production and research and development.
In recent years, the integrated circuit industry in Suzhou High-tech Zone has developed rapidly. It has institute platforms such as the East China Branch of the Fifth Electronics Institute of the Ministry of Industry and Information Technology, the national-level Suzhou Semiconductor Laser Innovation Center, and the Jiangsu Provincial Board Integrated Circuit and Component Adaptation Verification Center. The scale of the industry continues to grow, with more than 250 related companies such as Guoxin Technology gathered together, and a total of 8 listed companies have been cultivated, with the industry scale exceeding 22 billion yuan. The industrial ecology has been continuously optimized. An industrial fund of funds with a total scale of 10 billion yuan and a science and technology angel fund with a total scale of 2 billion yuan have been established. It has more than 2 million square meters of specialized carriers such as the Suzhou Integrated Circuit Innovation Center.
