Chinese semiconductor thread II
- Thread starter vincent
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SMEC has also committed to building China's first 8-inch SiC Production line and have it be up and running this year
Loongson's 3C6000 has been taped out. It supports 16 core and 32 virtual cores.
In the future, they will package 32 core and 64 core CPUs 3D6000 and 3E6000
They also completed integration on software side by upgrading their translation support from other ISAs.
Compact Modeling of Advanced Gate-All-Around Nanosheet FETs Using Artificial Neural Network
School of Microelectronics, Fudan University, Shanghai 200433, China
National Integrated Circuit Innovation Center, Shanghai 201203, China
Abstract
As the architecture of logic devices is evolving towards gate-all-around (GAA) structure, research efforts on advanced transistors are increasingly desired. In order to rapidly perform accurate compact modeling for these ultra-scaled transistors with the capability to cover dimensional variations, neural networks are considered. In this paper, a compact model generation methodology based on artificial neural network (ANN) is developed for GAA nanosheet FETs (NSFETs) at advanced technology nodes. The DC and AC characteristics of GAA NSFETs with various physical gate lengths (Lg), nanosheet widths (Wsh) and thicknesses (Tsh), as well as different gate voltages (Vgs) and drain voltages (Vds) are obtained through TCAD simulations. Subsequently, a high-precision ANN model architecture is evaluated. A systematical study on the impacts of ANN size, activation function, learning rate, and epoch (the times of complete pass through the entire training dataset) on the accuracy of ANN models is conducted, and a shallow neural network configuration for generating optimal ANN models is proposed. The results clearly show that the optimized ANN model can reproduce the DC and AC characteristics of NSFETs very accurately with a fitting error (MSE) of 0.01.
I wonder if there is a Ship of Theseus situation with some of semiconductor equipment. Parts start getting worn out but foreign replacements can no longer be acquired, so they substitute domestic parts. Over time, is it an imported machine or domestic one?
please note the SiC in the production line. I don't know what domestic equipment has anything to do with things here. They will use equipments that they can get which are best suited for the job
How long Ascend 910B is on the market? When can we expect new Huawei Al chip?
it was released about a year or two ago. Of course we can expect new chip, 910b is based on a 4-year-old design. Huawei should offer something new in late 2024 I think.
I had no idea what this type of chip was but I read a bit about it. Apparently very useful for blockchain. Way over my head but seems to be a novel architecture.
The first zero-knowledge proof SOC chip was successfully released in one taping
Recently, the world's first zero-knowledge proof (ZKP) was developed by Shenzhen Accseal Information Technology Co., Ltd. ) SOC chip (Accseal LEO chip) was successfully taped out once and has completely independent intellectual property rights, breaking the situation of no ZKP accelerator chip in the industry, improving ZKP’s computing efficiency and greatly reducing costs, paving the way for the widespread application of ZKP and the development of the digital economy Development provides underlying computing power support.
Accseal LEO chip is based on 12nm advanced process, can perform complex multi-scalar multiplication (MSM) and number theory transformation (NTT) operations, supports programmable design, and can support accelerated operations of post-quantum cryptography, multi-party secure computing and federated learning. Chip performance It is more than a thousand times faster than traditional CPUs and the cost can be reduced by ten times. Engineering sample testing has been completed and mass production will be launched in the first quarter of 2024.
Academician Yao Qizhi, dean of the Institute of Cross-Information at Tsinghua University and the only Chinese winner of the Turing Award, congratulated the world's first Zero-Knowledge Proof (ZKP) SOC chip for its successful first tape-out. The launch of ZKP acceleration chips provides strong computing power support for the data element market. Government departments or industry alliances can jointly use zero-knowledge proof technology to achieve the coexistence of supervision and privacy, verify the compliance, fairness and other principles of the use of data elements, and ensure Data Privacy and Corporate Confidentiality.
Gao Mingyu, co-founder of Zhixinhuaxi and assistant professor of the Institute of Cross -Information at Tsinghua University, said that the project originated from a scientific research project led by Academician Yao Qizhi and brought together the talents and efforts of many elite students in mathematics and computer science such as Yao Class of Tsinghua University. Today, The successful incubation of Zhixin Huaxi and the completion of the ZKP acceleration chip is a successful case of Tsinghua University's integration of industry, academia and research. At the same time, he will continue to lead the Zhixin Huaxi team to delve into the field of privacy computing, overcome technical difficulties, and provide technical support for the development of the digital economy.