It seems that Nikkei has picked up on it as well.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
The Pentagon on Wednesday labelled more than a dozen Chinese tech firms, including memory-chip maker Yangtze Memory Technologies Corp (YMTC), as “military companies” that pose a national security risk to the US.
Artificial intelligence companies Yitu Technology and Beijing Megvii, drone maker Chengdu JOUAV, lidar maker Hesai Technology and tech company NetPosa are also entities that operate in the United States but have ties to the Chinese military, according to the US Defence Department.
Artificial intelligence companies Yitu Technology and Beijing Megvii, drone maker Chengdu JOUAV, lidar maker Hesai Technology and tech company NetPosa are also entities that operate in the United States but have ties to the Chinese military, according to the US Defence Department.
Huamei New Materials has received over 100 million yuan in financing and is one of the earliest domestic companies engaged in the manufacturing of SiC special ceramic materials.
Recently, Shandong Huamei New Materials Technology Co., Ltd. (hereinafter referred to as: Huamei New Materials) completed an industrial round of financing exceeding 100 million yuan, led by Chaoxi Capital, Zaishi Capital, SMIC Juyuan, Runzhang Venture Capital, Gimpo Intelligent, etc. Institutions follow the investment.
Founded in 1995, Huamei New Materials is one of the earliest companies in China engaged in the manufacturing of silicon carbide special ceramic materials . Its main products are widely used in photovoltaic solar energy, lithium batteries, liquid crystal displays, aerospace, semiconductors, energy conservation, environmental protection, heat treatment and other industrial fields.Chaoxi Capital news shows that since its establishment, Huamei New Materials has led the formulation and revision of 4 national standards and 12 industry standards, and has 49 patents. It has become one of the largest silicon carbide ceramic manufacturers in China and has Won the honorary title of National Specialized New Little Giant.It is reported that Huamei New Materials has developed products such as cantilever paddles, boat supports, fluidized bed linings, and roller rods for emerging fields such as photovoltaics and lithium batteries; it has continued to make breakthroughs and innovations in the fields of semiconductors, liquid crystal glass substrates, military aerospace, etc., and has achieved national breakthroughs. Level "stuck" key projects rely on domestic substitution to penetrate the huge market space.In addition, based on the demand for complex-shaped silicon carbide ceramic components in the high-end field, Huamei New Materials has made breakthroughs in the research and development of silicon carbide 3D printing molding processes through technological research and development and process exploration of silicon carbide ceramic materials, and has launched mass production, complementing the silicon carbide ceramics market. The final piece of the puzzle in the area of molding.
Naura Semiconductor Equipment enter the top ten equipment manufacturers for the first time surpassing ASM and Teradyne. Once the Chinese equipment makers have enough capacity to serve the entire Chinese market I think most of the big ones will enter the top ten list. AMEC, Jingce, ACM Shanghai and so on.
The Chinese semiconductor-IT market is huge.
The Chinese semiconductor-IT market is huge.
Domestic memory chips! Longsys releases its first self-developed 2DMLC NAND Flash!
Following the large-scale mass production of self-developed SLC NAND Flash series products, Longsys' first self-developed 32Gb 2D MLC NAND Flash has also been launched recently. The product is packaged in BGA132, supports Toggle DDR mode, and has a data access bandwidth of up to 400MB/s. It is expected to be applied to eMMC, SSD and other products, bringing more possibilities to the company's storage product portfolio.
Longsys has invested a lot of energy and resources in the independent research and development of memory chips in recent years. The company has introduced a group of high-end talents with more than 20 years of experience in memory chip design. In terms of product testing, Longsys' self-developed NAND Flash products achieve efficient production testing by embedding on-chip DFT circuits and cooperating with the company's self-developed test platform. Currently, Longsys has the design capabilities for SLC NAND Flash, MLC NAND Flash, and NOR Flash products.
In addition to continuing its efforts in the field of NAND Flash chips, Longsys has also conducted in-depth research and exploration in DRAM chips.
In 2023, the company has launched composite storage nMCP, and has also successfully built a complete ATE test platform and SLT system-level test platform. From chip design, productization to production testing, Longsys has built complete vertical integration capabilities for memory chips. With the help of the packaging and testing manufacturing capabilities of Yuancheng Suzhou and Zilia, it has further enhanced its competitiveness in the field of memory chips.
Hesai Announces Two Revolutionary New ADAS Lidar Products and Completion of Its State-of-the-Art R&D Center for Manufacturing
- Introducing the world’s most advanced, highest performance ADAS lidar, Hesai AT512, boasting the industry’s longest range and transformative highest ever resolution
- Displaying Hesai’s new super thin 25 mm ET25 lidar with super long range and ultra-fine resolution, and designed to be mounted behind the windshield
- Announce completion of our new 740,000 sq ft. “Maxwell” Innovation Center, combining R&D and high-volume manufacturing lines, and equipped with the world's most advanced lidar testing lab
The global leader in lidar technologies for autonomous mobility systems, ADAS and industrial robotics applications, today announced a series of high-profile product releases and business developments, seeking to advance intelligent driving systems to improve the efficiency and safety of global transportation and save lives. Today’s announcements illustrate the company’s unmatched prowess in the areas of lidar innovation, advanced manufacturing and rapid commercialization.
The first announcement of the day is the launch of Hesai’s new flagship AT512 ultra long-range ADAS lidar. The AT512 is Hesai’s top-of-the-line, category killer product and represents a leapfrog advancement in lidar innovation in a trim, compact form factor, targeting automotive OEMs who demand the very best in performance, reliability and safety. The AT512 offers an industry leading range of 300 meters at 10% reflectivity with a maximum range of over 400 meters, and an industry record 12.3 million points per second point-rate, multiples ahead of the ADAS competitors, resulting in the highest resolution point cloud among any lidar manufacturer at 2400x512. The product's sleek physical design measures just 160x100x45mm while offering a 120-degree horizontal field of view and a 25.6-degree vertical field of view. The AT512 is designed to greatly enhance ADAS systems by improving the vehicles perception capabilities by providing world class 3D environmental scans at ultra high resolution which greatly improves a vehicle's ability to detect objects at long range. This game-changing lidar means AT512 equipped ADAS systems will have 40% more reaction time to avoid dangerous road conditions and significantly improve transportation safety.
“The AT512 represents a tremendous breakthrough in lidar technology and provides unprecidented performance improvements in all of the key areas our customers care about such as range, resolution, thermal, power consumption and form factor," said David Li, Co-founder and CEO of Hesai. "Our core belief that intelligent manufacturing needs to be part of our R&D efforts has helped us move beyond traditional 1550 nanometer laser-based lidar to more advanced 905 nanometer technology as borne out by the superior performance, quality and reliability of our AT512."
The second announcement of the day is the public reveal of the new ultra-thin ET25 ADAS lidar designed to be installed behind a vehicle’s windshield which makes it much easier to integrate, helps maintain the vehicle aerodynamics and keeps the lidar clear of dirt and debris. The ET25 provides powerful performance combined with a revolutionary design that makes vehicle integration easier than ever. The ET25 provides 250 meters of range at 10% reflectivity and received a 2024 CES Innovation Award for best new product.
“The ET25 is a revolutionary product that provides an ultra-thin design without sacrificing performance,” said Li. “We're already working with leading OEMs to integrate the ET25 into series production vehicles with the start of production planned for Q1 of 2025.”
Continuing the wave of new business developments is the news Hesai has completed construction on a new 740,000 square foot state-of-the-art R&D center for manufacturing, named “Maxwell” after Scottish physicist James Maxwell’s famous equations which form the foundation of electromagnetism, optics, electric and magnetic circuits. The new cutting-edge facility includes the world's most advanced lidar testing lab and will utilize many smart industrial robots allowing for the automation of over 100 production processes with an automation rate of 90% and a 45 second cycle time per lidar unit. The new facility uses a proprietary smart cloud manufacturing execution system (MES) capable of precisely tracking the entire production chain and allows for any problem to be traced back to the source, precisely located and promptly controlled.
“Our new Maxwell facility is not a traditional manufacturing facility but an advanced R&D center where we design and build automated lidar production lines, which can then be easily replicated across our global network of manufacturing facilities,” said Li. “With Hesai's commercial engine now in full swing, we expect to drive lidar adoption forward for everyone.”
Today's news comes on the heels of Hesai winning a lidar design contract with a leading global OEM for an upcoming fully electric series production program. The company also recently surpassed 300,000 accumulative units delivered including a new high of 50,000 units in the month of December alone. To date Hesai automotive lidar have been selected by 15 leading OEMs and tier-1 suppliers, covering over 50 series production models and growing.
Huahai Qingke's integrated circuit high-end equipment research and development and industrialization project capped
the capping ceremony of the integrated circuit high-end equipment research and development and industrialization project of Huahai Tsingke Co., Ltd. (referred to as "Huahai Tsingke") was held.
It is reported that Huahai Qingke’s integrated circuit high-end equipment research and development and industrialization project is located in Yizhuang New Town, Beijing, with a planned total construction area of approximately 70,000 square meters and a total investment of 820 million yuan. Construction officially started on June 28, 2023. After the completion of the project, Huahai Qingke (Beijing) Technology Co., Ltd. is responsible for carrying out research and development and industrialization of high-end semiconductor equipment, and promoting the research, development and production of semiconductor equipment such as wet equipment, thinning equipment, and chemical mechanical polishing equipment.
It is reported that Huahai Qingke’s integrated circuit high-end equipment research and development and industrialization project is located in Yizhuang New Town, Beijing, with a planned total construction area of approximately 70,000 square meters and a total investment of 820 million yuan. Construction officially started on June 28, 2023. After the completion of the project, Huahai Qingke (Beijing) Technology Co., Ltd. is responsible for carrying out research and development and industrialization of high-end semiconductor equipment, and promoting the research, development and production of semiconductor equipment such as wet equipment, thinning equipment, and chemical mechanical polishing equipment.
Yaco Hongyu and Jingwei have established in-depth cooperation. The VeriTiger series FPGA prototype verification tools accelerate the system-level verification and software and hardware collaborative development of domestic FPGA chips.
Recently, digital front-end EDA tool supplier Yaco Hongyu has established in-depth cooperation with Jingwei, a leading domestic FPGA chip supplier. Based on the Yaco Hongyu VeriTiger series FPGA prototype verification tools, Jingwei Qili is able to conduct efficient functional verification and debugging iterations that are highly close to real usage scenarios in the early architecture development, module function development, system-level development and other stages of its high-performance FPGA chips. , greatly reducing development time, and carrying out advance development and application optimization of drivers and software after the logical functions are complete, significantly shifting the development cycle to the left.
In recent years, the strong development of new application fields such as data centers, artificial intelligence (AI) and edge computing has driven the market demand for FPGA chips. Jingwei Qili is a well-known domestic FPGA cutting-edge supplier. It is one of the earliest companies in China to enter independent research and development, large-scale production, and mass sales of general FPGA chips and new generation heterogeneous programmable computing chips. It provides extensive services with cost-effective system solutions. In cutting-edge fields such as consumer electronics, video imaging, industrial control, and communication infrastructure.
Based on the YACO Hongyu VeriTiger series FPGA prototype verification tools, Jingwei Qili can conduct system-level verification of FPGA chip functions and performance that is highly close to real usage scenarios, and perform simultaneous driver and software development during the design development and tape-out manufacturing phases. development to achieve earlier collaborative development of software and hardware, thereby improving project development efficiency, shortening the chip development cycle, and strengthening market advantages.
SMEC reported 2023 numbers where their income went up to 5.3B RMB, up 718m YoY
still losing 1.95B
they are expanding very quickly with a lot of capex and depreciation, so that's large part of the losses
They are drastically expanding MEMS, IGBT, SiC MOSFET production. Expecting to generate 1B in SiC in 2024.
Recently just signed up to provide 1200V SiC modules for NIO. They lso have other customers including BYD.
silan also recorded losses for 2023
It's also expanding power chips, analog IC, MEMS and SiC MOSFET
Currently has 3000 6-inch wpm of SiC-MOSFET. Looking to expand to 12k wpm by end of 2024
The article also says that localization rate has gone up from 30% in 2022 to 47% in 2023. Seems like a significant increase.