Shengmei Shanghai: When purchasing photolithography machines, KrF-line is the primary target
Question: Is the construction of the company's "R&D and process testing platform project" mainly aimed at Track?
Answer: The company currently has cleaning equipment, copper plating equipment, furnace tube equipment, PECVD, Track and other products. The company hopes to conduct combined and consistent tests. First, the silicon wafer is cleaned, and then the coating is completed through the furnace tube and PECVD. Then, through the docking of the Track and the photolithography machine, the glue coating, exposure, and development are completed, and then it is entered into the etching equipment of the experimental line for dry etching, and then Remove glue and clean.
Q: What considerations does the company have in selecting lithography machine models?
Answer: The company does not give priority to advanced lithography machines in purchasing lithography machines. KrF-line is the company’s primary goal. However, the final model selected has not yet been determined.
Both domestic and international models are acceptable. The main reasons for choosing KrF-line are the following: 1) KrF-lineTrack equipment has the largest market because it has the largest number of process steps, including advanced and mature processes; 2) A foreign company will launch the next generation of 400WPH at the end of this year KrF-line lithography machine, which requires Track to achieve a high output rate of 450WPH; 3) The 300WPH KrF-line model Track equipment is the company’s first product to enter the market, and t
his year the company will also develop an immersion type ArFTrack device. Therefore, the company's current strategy is to start with KrF-line and 300WPH, and then gradually develop 400WPH. In addition, the company's Track equipment aims not only to solve the problem of localization, but also hopes to enter the global market.
Question: Can the leader describe the company's iterative R&D project for high-end semiconductor equipment?
Answer: The first is the cleaning equipment. At this stage (as of the end of last year), the company has successfully mastered 95% of the equipment for the cleaning process steps. The company’s cleaning equipment includes the front side of the single chip, the back side of the single chip, edge etching, high-temperature sulfuric acid, Tahoe Single-chip tank combined cleaning, megasonic cleaning, advanced IPA drying technology and supercritical CO2 cleaning and other products cover a wide range of processes. At this stage, the company's goal is to make the company's products more practical and better.
Question: Can you share the specific progress of several important overseas customers of the company?
Answer: 1) At present, a large customer in the United States has given good feedback on the product, and there is a high chance that repeat orders can be negotiated in the future; 2) The European customer's equipment entered the market in September last year and is currently being installed. The process is relatively smooth. Follow-up will follow this After the verification of a piece of equipment by this major European customer is completed, there will be repeated orders in the future; 3) The company is also focusing on developing some major customers in Singapore and surrounding areas. Singapore will be a hot spot for semiconductors in the future, and the company will closely follow this market; 4) In terms of the Taiwan market, the company has been actively exploring and currently has customers, especially in electroplating equipment. Many customers are using the company's equipment. This area will also be a highlight of the company in the future; 5) South Korea, South Korea Sea Lux has been a customer of the company since 2011.
At this stage, the company is also cooperating with it in many aspects, not only cleaning equipment, but also several other existing product companies are actively promoting cooperation with it. To sum up, in terms of internationalization, the company has made certain achievements in recent years. This year and next will be the company's focus. It can be the first to launch the company's cleaning and electroplating equipment into the market, and then bring the furnace tube equipment in China. , ALD, PECVD, and Track were successively launched into the international market after verification. Thanks!
Q: Could you please tell me about the company’s current product progress and plans for high-end applications?
Answer: In terms of high-end applications, the company has mass-produced cleaning and electroplating equipment and received batch orders. In terms of electroplating equipment, Shengmei equipment can currently meet customer needs on the production line. In addition, furnace tube equipment, Track, PECVD and other parts, furnace tube equipment is currently progressing relatively quickly, because ALD has been successfully developed and has been produced at the client for verification, and the number of customers will expand significantly this year.
Q: The company’s current layout of advanced packaging equipment and its current progress?
Answer: The company has been laying out advanced packaging for a long time. Around 2013 and 2014, the company started to make cleaning equipment and glue coating and development equipment. At present, the company is an enterprise with the most complete line of advanced packaging wet equipment in the world, such as cleaning, wet etching, glue coating, development, glue removal, electroplating and polishing equipment (such as electropolishing), etc., which have been used in many clients. Big production line.
Question: Currently, the company has a comprehensive range of equipment for advanced packaging layout. Which equipment is the company making faster progress at the moment?
Answer: The company mainly cooperates with international customers in advanced packaging. In the next 5 to 10 years, advanced packaging will become more and more important in the chip industry. Its depth, dimension, and technical difficulty are all increasing. The company's future strategy will further increase its focus on advanced packaging. In terms of R&D investment and market development in packaging equipment, an important direction for the company's international market development in the future is to introduce copper plating equipment into global markets such as South Korea, Taiwan, the United States, and Europe.
Question: Does the company have any order goals for 2024?
Answer: The company is relatively optimistic about the prospects for 2024, especially the Chinese market will be better than last year. The company is confident about the development of the Chinese market in the next few years. In 2024, the company's furnace tube series products will join the sales ranks. In 2025, the company's Track and PECVD will also join the sales ranks to support the company's rapid growth in the next 5 to 8 years. At present, the company has set strategic goals to achieve domestic sales accounting for 50%, overseas sales accounting for 50%, and total sales reaching 35 billion yuan, thereby entering the first echelon of global semiconductor equipment;
