Chinese semiconductor thread II

BoraTas

Captain
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MEMS microarray e beam blanker for multi beam EBL. Multi beam EBL is the only viable method to produce masks below 5nm.
I am still waiting for China to spin an electron beam tool industry. There has been good developments since 2020. E-beam litho, e-beam inspector, scanning electron microscopes, etc... These all have uses.
 

interestedseal

Junior Member
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I am still waiting for China to spin an electron beam tool industry. There has been good developments since 2020. E-beam litho, e-beam inspector, scanning electron microscopes, etc... These all have uses.
The ebeam industry is still in early stage with over 30 startups competing with each other. My guess is HW will help coordinate/consolidate the semicon e beam industry.
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tokenanalyst

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Ceramic material parts manufacturer Kema Technology listed on the ChiNext today with a surge of 349.25%.​


Suzhou Kema Materials Technology Co., Ltd. officially landed on the Shenzhen Stock Exchange's Growth Enterprise Market today, with an issue price of 8.0 yuan/share and an issue price-earnings ratio of 44.9 times. On the first day of listing, the stock price rose 386.25% to 38.9 yuan/share at the opening. As of press time, the stock price still rose 349.25% to 35.94 yuan/share.

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BRIANLEUNG

Just Hatched
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View attachment 134333
Huawei is now publicizing the kirin chips it is using on different mobile handsets. Seems like a good sign of supply chain stability.
I'm wondering if this is an offical poster or not, the use of words on it seems like a fake fan-made poster. No way official materials would directly label it as 'Comparable to Qualcomm 8Gen1'. Usually they won't bring up competitors, and all the wordings seem a bit odd and informal. But yeah maybe it's just my stereotype. As staff members are able to publically speak about the chipsets in store.
 

tokenanalyst

Brigadier
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Major breakthrough in China's storage technology!​



Recently, teams from Fudan University and Tsinghua University have made new breakthroughs in memory chips. The Fudan team developed an ultrafast flash memory integration process that can achieve ultrafast programming in 20 nanoseconds and non-volatile memory for 10 years; the Tsinghua University team proposed a new logic device based on magnetic oscillators, which is expected to reconstruct logic memory.

Fudan team develops ultra-fast flash memory integration technology, breaking the storage speed limit
Non-volatile memory refers to computer memory that can save data even when the power of the memory chip is turned off. Common non-volatile memories include flash memory, read-only memory (ROM), and some new technologies such as magnetic random access memory (MRAM), ferroelectric random access memory (FeRAM), phase change memory (PCM), etc. Among them, flash memory is the dominant non-volatile memory technology at present, but it is limited in speed.

According to the official news from the School of Microelectronics of Fudan University, recently, the paper "A scalable integration process for ultrafast two-dimensional flash memory" by the team of Zhou Peng and Liu Chunsen of Fudan University was published in the top international journal Nature Electronics. The team reported a scalable ultrafast 2D flash memory integration process that can be used to integrate 1,024 flash memory devices with a yield of over 98%.​

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huemens

Junior Member
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I'm wondering if this is an offical poster or not, the use of words on it seems like a fake fan-made poster. No way official materials would directly label it as 'Comparable to Qualcomm 8Gen1'. Usually they won't bring up competitors, and all the wordings seem a bit odd and informal. But yeah maybe it's just my stereotype. As staff members are able to publically speak about the chipsets in store.
You are probably right. In the listings on official website the CPU and mobile network information is not even mentioned.
 
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