That China would immediately capitulate and sign Plaza Accord 2.0
Anglo hegemony for the next 100 years... or more... End of History kind of stuff...
Chinese semiconductor thread II
- Thread starter vincent
- Start date
Anglo hegemony for the next 100 years... or more... End of History kind of stuff...
What impress me is the target capacity of 50K 12" wafers per month. Of course this is target capacity, i.e. it will be reached in the next 1/2 years, currently they are still setting up the line.
What it means 50K wpm?
- The die size of HBM is generally than DDR5 of the same process and capacity
- SK Hynix DDR5 is (2GB), the others manufacturers have better densities, this is worst case.
- So for HBM memory we can assume a die of 75,21x1,45 = 109mm2 for 2GB
- Assuming an almost square die of 10.4X10.3 around 540 dies per wafer, i.e. 1080GB per wafer
- The key parameter is the yield. We don't know it. SK Hynix achieved , here we can assume a much more conservative 60% yield. With this we have 1080*0.6 = 650GB per wafer
- Ascend 910 seems of memory,
- So assuming 64GB per AI GPU we have that each memory wafer is enough for 10 Ascend AI GPU.
- Finally, target capacity of 50Kwpm of HBM memory is enough for 6 million Ascend 910B AI chips per year!
My final comment is that with 50K wpm of HBM memory China will be well above self-sufficiency.
Given the above, they need to stockpile for at least 12 months, possibly 24 months production. After that CXMT will provide the needed memory.
The Foreign Direct Product Rule or other technical thresholds are just a thin layer of legalese veneer that covers the real elephant in the room: US can enforce these unilateral, long arm jurisdiction rules only because on the other side there are "allied" nations. Instead, for nations with full sovereignty all these unilateral, not negotiated, whimsical rules are just garbage.
For instance US cannot prevent Chinese firms to sell to other Chinese firms, no matter what's in the product, simply because the Chinese government does not bow to US pressure. Not only that, if US goes directly against a local company, the Chinese government will do all it can to support the company under attack. Huawei is a clear poster-child here. Huawei maybe would have not survived without huge government behind-the-scene support: national contracts, assured support by local suppliers, etc..
A counterexample is Japan, that decided to stop export of advanced equipment although it is already 100% de-americanized, just because Japan government was asked to do so.
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But profit drops 59% to $164.6 million
Semiconductor equipment demand continues to be strong, Shengmei Shanghai's revenue in the first half of the year increased by 49.33% year-on-year.
Shengmei Shanghai released its semi-annual report stating that in the first half of 2024, the company achieved operating income of 2.439 billion yuan, a year-on-year increase of 49.33%; net profit attributable to shareholders of the parent was 443 million yuan, a year-on-year increase of 0.85%; non-net profit was 435 million yuan, a year-on-year increase of 6.92%.
Shengmei Shanghai said that the substantial increase in revenue was mainly due to the continued strong demand for equipment in China's semiconductor industry. The company's revenue continued to grow by leveraging its core technology and product diversification advantages. The company has achieved remarkable results in new customer expansion and new market development, successfully opened up new markets and developed multiple new customers, increasing overall operating income. The company's new products have gradually gained recognition from customers, and revenue has grown steadily.
In the first half of this year, Shengmei Shanghai has achieved positive results in R&D innovation, intellectual property system construction, production and operation, epitaxial growth, etc. The company's in-depth cooperation with global first-tier semiconductor companies has helped the company to gain a deeper understanding of market demand and develop innovative solutions in a targeted manner. It has also enhanced the company's understanding of new products, new technologies, and new markets, and improved the competitiveness of the company's technology and products.
At the same time, the company continues to cooperate with existing customers and has established extensive cooperation with new customers at home and abroad. In March 2024, Shengmei Shanghai achieved product iteration upgrades and new breakthroughs, and 4,000 cavities of wet equipment were successfully delivered; as a supplier of technologically differentiated high-end semiconductor equipment, the company's team appeared at the SEMICON CHINA exhibition to provide the latest technologies and solutions to new and old customers on site. In May, the company launched framed wafer cleaning equipment for advanced packaging, which can effectively clean semiconductor wafers during the cleaning process after debonding, reduce the use of chemicals in the production process, and has significant environmental and cost benefits.
Hua Hong Semiconductor's capacity utilization rate increased to 97.9% in the second quarter, and 12-inch wafers continued to increase in volume
On August 8, Hua Hong Semiconductor disclosed its second quarter performance report. Data showed that the company achieved sales revenue of US$478.5 million and gross profit margin of 10.5% in the second quarter, both of which achieved month-on-month growth. Sales revenue was in line with guidance, and gross profit margin was better than the previous guidance. Thanks to the increase in customer collections, the company's net cash flow from operating activities in the second quarter was US$96.9 million, up 138.3% month-on-month.
Tang Junjun, president and executive director of Hua Hong Semiconductor, commented in the financial report that the semiconductor market is experiencing a slow recovery from the bottom. After several quarters of continuous weakness, the market has shown signs of stabilization and recovery driven by some consumer electronics and other fields.
As the downstream market gradually recovers, benefiting from the increased demand for CIS, logic products, and other power management products, the sales revenue of some products of Hua Hong Semiconductor achieved steady growth in the second quarter of 2024. Among them, the sales revenue of logic and RF was US$63.5 million, a year-on-year increase of 11.0%. The sales revenue of analog and power management was US$101.1 million, a year-on-year increase of 25.7%. The sales revenue of 55nm and 65nm process technology nodes was US$98.6 million, a year-on-year increase of 16.1%.
ACM Shanghai launches new panel-level electroplating equipment to further expand fan-out panel-level packaging product line.
ACM Semiconductor Equipment (Shanghai) Co., Ltd. (hereinafter referred to as "ACM Shanghai"), as a leading supplier of wafer process solutions for semiconductor front-end and advanced wafer-level packaging applications, today launched the Ultra ECP ap-p panel-level electroplating equipment for fan-out panel-level packaging (FOPLP). The equipment uses the horizontal electroplating independently developed by ACM Shanghai to ensure that the panel has good uniformity and precision.
Dr. Hui Wang, Chairman of Shengmei Shanghai, said:
“Advanced packaging is increasingly important to meet the demand for low-latency, high-bandwidth and cost-effective semiconductor chips. Fan-out panel-level packaging has greater development potential because it can provide high-bandwidth and high-density chip interconnects. Fan-out panel-level packaging saves a lot of cost for packaging large graphics processors (GPUs) and high-density high-bandwidth memory (HBM) by redistributing chips on larger rectangular panels. Our Ultra ECP ap-p panel-level horizontal plating equipment leverages our extensive technical expertise in wafer plating and copper processes for traditional advanced packaging to meet the market’s growing demand for fan-out panel-level packaging. With this technology, we can achieve sub-micron advanced packaging in the panel.”
Shanghai Shengmei's Ultra ECP ap-p panel-level electroplating equipment can process panels up to 515x510 mm in size, and a 600x600 mm version is also available. The equipment is compatible with organic and glass substrates and can be used for through-silicon via (TSV) filling, copper pillars, nickel and tin-silver (SnAg) plating, solder bumps, and high-density fan-out (HDFO) products using copper, nickel, tin-silver and gold plating layers.
Ultra ECP ap-p panel-level electroplating equipment uses technology independently developed by Shengmei Shanghai to accurately control the electric field of the entire panel. This technology is applicable to various manufacturing processes and can ensure consistent electroplating effects across the entire panel, thereby ensuring good uniformity within and between panels.
In addition, the Ultra ECP ap-p panel-level electroplating equipment adopts a horizontal (planar) electroplating method, which can control the contamination between tanks caused by the panel transmission process, effectively reducing the cross-contamination between different plating solutions, and can be used as an ideal choice for large panels with sub-micron RDL and micro-columns.
Cuizhan Microelectronics' 1 millionth IGBT module rolled off the production line.
Cuizhan Microelectronics is facing unprecedented development opportunities. As a Chinese automotive-grade power device and analog integrated circuit design and sales company, the company is determined to break the import monopoly and achieve import substitution. The launch of the 1 millionth IGBT module further consolidates Cuizhan Microelectronics' position as a leader in the local power device industry.
Jingsheng Co., Ltd.'s 8-inch silicon carbide crystal growth equipment starts mass delivery
Jingsheng Co., Ltd. stated on the investor interaction platform that its first batch of 8-inch silicon carbide crystal growth equipment had been delivered in Chongqing in July 2024. This means that Jingsheng Co., Ltd.'s 8-inch silicon carbide crystal growth equipment has been verified and the batch delivery process has started.
From the timeline of product development-customer verification-mass delivery, Jingsheng's 8-inch silicon carbide crystal growth equipment has made rapid progress in industrialization. In January this year, Jingsheng introduced the price and research and development progress of its silicon carbide crystal growth equipment in the investor relations activity record sheet. At that time, Jingsheng's 8-inch silicon carbide crystal growth equipment had passed mass verification at the customer's place.
The completion of this batch delivery means that Jingsheng Co., Ltd.'s 8-inch silicon carbide crystal growth equipment-related business has entered a new stage of development. Under the trend of 8-inch transformation, Jingsheng Co., Ltd. is comprehensively deploying equipment related to 8-inch silicon carbide production lines. In addition to crystal growth equipment, Jingsheng Co., Ltd. has also made certain progress in equipment for epitaxy, slicing and other process flows.
Among them, Jingsheng Electromechanical released 8-inch silicon carbide equipment such as 8-inch double-wafer silicon carbide epitaxial equipment and 8-inch silicon carbide measurement equipment during the SEMICON China 2024 Shanghai International Semiconductor Exhibition in March this year, which means that Jingsheng Electromechanical is deepening its layout of the 8-inch silicon carbide equipment industry chain from the aspects of crystal growth and testing.Then in May, Lianke Semiconductor released a new generation of 8-inch silicon carbide crystal growth furnace, officially realizing the full supply of large-size silicon carbide substrate equipment.