The construction of the CMP material production base of Boline Semiconductor started
Zhejiang Boranarun Electronic Materials Co., Ltd. officially broke ground on the construction of the 107-acre Phase II production base located in the high-tech zone of Quzhou Intelligent Manufacturing New City. After the completion of the project, combined with the production capacity of the already operational Phase I project, Boranarun will achieve its goal of deploying 18,000 tons of nano-silicon oxide, 34,000 tons of semiconductor CMP polishing liquid and 1.15 million square meters of polishing pads in Quzhou. It also allows Boranarun to take a step further in its ideal of "becoming a trusted partner in the field of global planarization materials."
Zhejiang Bolainarun Electronic Materials Co., Ltd. focuses on providing overall solutions for planarization materials in the semiconductor industry, and is committed to the technical research and development and industrialization of electronic-grade nano-silicon oxide abrasives, semiconductor CMP polishing liquids, polishing pads and other products, providing overall process material solutions for the nano-level planarization of semiconductor substrates and other materials. Bolainarun's products are widely used in the CMP process of semiconductor wafers such as large silicon wafers, gallium arsenide, silicon carbide, as well as the CMP process of integrated circuits and other fields (such as LED sapphire substrates, consumer electronics and optical metals, glass, etc.). At present, it has established good cooperative relations with well-known companies in the industry such as Jinruihong, Tianke Heda, Shanxi Shuoke and Crystal Optoelectronics.
Semiconductor Wafer Polishing Liquids
Zhejiang Bolainarun Electronic Materials Co., Ltd. focuses on providing overall solutions for planarization materials in the semiconductor industry, and is committed to the technical research and development and industrialization of electronic-grade nano-silicon oxide abrasives, semiconductor CMP polishing liquids, polishing pads and other products, providing overall process material solutions for the nano-level planarization of semiconductor substrates and other materials. Bolainarun's products are widely used in the CMP process of semiconductor wafers such as large silicon wafers, gallium arsenide, silicon carbide, as well as the CMP process of integrated circuits and other fields (such as LED sapphire substrates, consumer electronics and optical metals, glass, etc.). At present, it has established good cooperative relations with well-known companies in the industry such as Jinruihong, Tianke Heda, Shanxi Shuoke and Crystal Optoelectronics.
Semiconductor Wafer Polishing Liquids
'Semiconductor Wafer Polishing Pads
