It's in the early stages. It will take CXMT some time to ramp up to meet domestic demand. China still needs to stockpile some HBM2/3 in the event of an export ban. HBM2 is slower than HBM3 but existing AI accelerators from HUAWEI and other companies are too slow to take full advantage of HBM3 right now anyway so it's not a big deal.
Chinese semiconductor thread II
- Thread starter vincent
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It's in the early stages. It will take CXMT some time to ramp up to meet domestic demand. China still needs to stockpile some HBM2/3 in the event of an export ban. HBM2 is slower than HBM3 but existing AI accelerators from HUAWEI and other companies are too slow to take full advantage of HBM3 right now anyway so it's not a big deal.
Huazhuo Precision Technology has achieved a key technological breakthrough in heterogeneous bonding.
It is reported that Huazhuo Precision Technology recently successfully delivered a 6/8-inch heterogeneous bonding equipment to a customer, indicating that the low-temperature plasma activation bonding equipment and process developed by Huazhuo Precision Technology has made great progress in the field of heterogeneous bonding and has been recognized by customers.
Huazhuo Precision Technology provides a variety of bonding equipment and a full set of process solutions. The high-precision Hybrid Bonding equipment, Fusion Bonding equipment, SOI bonding equipment, thermal compression bonding equipment and temporary bonding equipment developed successively are widely used in 3D DRAM, CIS, Micro LED, MEMS, advanced packaging and other fields.
In response to the localization problem of POI process, Huazhuo Jingke revealed that the key process to obtain POI substrate is to achieve heterogeneous bonding, and heterogeneous bonding needs to overcome material mismatch and thermal mismatch to achieve permanent bonding between the insulating layer and the piezoelectric layer. In addition, heterogeneous bonding also requires strict control of the subsequent annealing temperature, which is closely related to key indicators such as bonding strength and post-bonding warpage.
After many process debugging and relevant software and hardware adjustments, Huazhuo Jingke has solved the matching problem between annealing temperature and bonding strength and post-bonding warpage, and achieved the bonding strength, post-bonding warpage and other parameters under low-temperature annealing conditions to meet customer needs .
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Do you know if the Sino DDR5 went into production? That is one of my primary expectations from the Sino semiconductor industry this year. The HBM2E will follow the DDR5 fast.
I have no idea. My best guess is that it’s probably safe to assume that at the minimum they’re working on it. My guess is DDR5 hasn’t ranked as highly of a priority to replace with domestic substitutes since it would be incredibly difficult to sanction.
HBM 2 actually is older technology released in 2016. Currently the most advanced HBM is HBM3 produced by Micron, Samsung and SKHynix.
Longtu Optical Mask is listed on the Science and Technology Innovation Board of the Shanghai Stock Exchange.
Longtu Opto-Mask was listed on the Shanghai Stock Exchange Science and Technology Innovation Board, an issue price of 18.5 yuan per share, and an issue price-earnings ratio of 30.2 times. As of press time, Longtu Opto-Mask's stock price soared 94.59% to 36 yuan per share, with a total market value of 4.806 billion yuan.
Longtu Photomask's main business is the research and development, production and sales of semiconductor masks. It is a rare independent third-party semiconductor mask manufacturer in China. The company closely follows the development route of domestic specialty process semiconductors, continuously conducts technical research and product iterations, and the process nodes of semiconductor masks corresponding to downstream semiconductor products have been gradually improved from 1μm to 130nm. The products are widely used in power semiconductors, MEMS sensors, IC packaging, analog IC and other specialty process semiconductor fields, and terminal applications cover new energy, photovoltaic power generation, automotive electronics, industrial control, wireless communications, Internet of Things, consumer electronics and other scenarios.
At present, Longtu Photomask has mastered the key technology of semiconductor mask production at 130nm and above nodes, forming a core technology system covering the entire process of CAM, lithography, and inspection. In the field of power semiconductor masks, the company's process nodes have covered the needs of the mainstream global power semiconductor processes.
After years of development, Longtu Mask has established long-term and stable cooperation with many well-known customers and formed a high-quality customer structure, such as: SMIC, Silan Microelectronics, Jetta Semiconductor, Hua Hong Semiconductor, Nuvoton Technology, BYD Semiconductor, Liang Microelectronics, Yandong Microelectronics, CanSemi, Changfei Advanced, Yangjie Technology, Ingenic, Xinpeng Microelectronics, Star Semiconductor, Tsinghua University, Shanghai Jiaotong University, etc. Customers include not only chip manufacturers, MEMS sensor manufacturers, advanced packaging manufacturers, chip design companies, but also well-known universities and research institutes conducting basic technology research.