BYD invested in advanced packaging company that was found just in 2022. Sintered silver die bonding tech seems to be the prize here.
Chinese semiconductor thread II
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BYD invested in advanced packaging company that was found just in 2022. Sintered silver die bonding tech seems to be the prize here.
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Changdian Technology and Allegro MicroSystems reach strategic cooperation
Recently, Changdian Technology, a world-leading integrated circuit finished product manufacturing and technology service provider, announced that it has reached a strategic cooperation with Allegro MicroSystems, a leading manufacturer in the field of magnetic sensor ICs and power ICs. The two parties will further strengthen the stability and efficiency of the supply chain to better serve the needs of Chinese customers.
The strategic cooperation between JCET and Allegro MicroSystems is an important part of the extensive efforts of the two companies to strengthen their position in the semiconductor industry ecosystem. The two parties will focus on establishing localized packaging and testing capabilities for high-precision magnetic sensors and power management solutions. The related products can be widely used in automotive electronics, industry and other fields, and are committed to providing Chinese customers with faster response times and more customized solutions.
As a leading supplier of magnetic sensor IC solutions and power ICs, Allegro MicroSystems' innovations can increase the mileage of electric vehicles, provide reliable and compact power conversion systems, and improve the safety and efficiency of motor and power management systems. Changdian Technology integrates the group's advantageous resources in the automotive market, sales, technology, and production, and actively establishes strategic partnerships with Tier1/OEM manufacturers, and is committed to providing customers with more diversified and competitive automotive chip packaging and testing solutions. In recent years, it has achieved rapid expansion in the automotive electronics field.
Zheng Gang, vice president of Changdian Technology and general manager of the automotive electronics business unit, said that with the continuous advancement of related technologies such as smart cars and smart manufacturing, Changdian Technology will make full use of its deep manufacturing expertise and footprint to create greater value for customers.
The strategic cooperation between JCET and Allegro MicroSystems is an important part of the extensive efforts of the two companies to strengthen their position in the semiconductor industry ecosystem. The two parties will focus on establishing localized packaging and testing capabilities for high-precision magnetic sensors and power management solutions. The related products can be widely used in automotive electronics, industry and other fields, and are committed to providing Chinese customers with faster response times and more customized solutions.
As a leading supplier of magnetic sensor IC solutions and power ICs, Allegro MicroSystems' innovations can increase the mileage of electric vehicles, provide reliable and compact power conversion systems, and improve the safety and efficiency of motor and power management systems. Changdian Technology integrates the group's advantageous resources in the automotive market, sales, technology, and production, and actively establishes strategic partnerships with Tier1/OEM manufacturers, and is committed to providing customers with more diversified and competitive automotive chip packaging and testing solutions. In recent years, it has achieved rapid expansion in the automotive electronics field.
Zheng Gang, vice president of Changdian Technology and general manager of the automotive electronics business unit, said that with the continuous advancement of related technologies such as smart cars and smart manufacturing, Changdian Technology will make full use of its deep manufacturing expertise and footprint to create greater value for customers.
Study of interferometric signal correction methods in ultra-precision displacement measurement.
Abstract
The measurement of critical dimensions in the field of integrated circuits has moved from 7 nm to 5 nm. The existing chromium atomic lithography grating has a pitch period of 4700 l mm−1 and uniformity of picometer, and the interferometric signal period based on the above grating is as small as 106.4 nm, which brings new problems and challenges to the accurate processing of the signal. This paper investigates the error characteristics of ultra-high precision grating interferometric signals, establishes a Heydemann correction mathematical model for high inscribed line density grating interferometric signals, corrects the grating interferometer signals based on the random sample consensus (RANSAC), and verifies the effectiveness of the algorithm through simulation. By comparing the repeatability and linearity of the original algorithm and the self-traceable grating interferometric displacement measurement data processed by RANSAC, the conclusion that the standard deviation of the self-traceable grating interferometer repeat measurement after RANSAC is 1.60 nm in a 10 000 nm travel is obtained, and the purpose of improving the stability and uniformity of the signal solution with the algorithm of this paper is achieved, which is important for the study of laser interferometer and grating interferometer The results show that the stability and uniformity of the signal solution can be improved by the algorithm of this paper, which is of great significance for the study of the displacement solution of laser and grating interferometers.
AMEC opens Shanghai Lingang industrialization base
On August 2, China's semiconductor equipment company AMEC announced that its Shanghai Lingang Industrialization Base was officially opened. It is reported that the base covers an area of about 157 acres and a total construction area of about 180,000 square meters. It adopts an advanced factory management system and is equipped with an intelligent three-dimensional warehouse, which realizes the tracking of manufacturing resources and the monitoring of the production process, which can improve production quality and efficiency, reduce production costs, and lay the foundation for ensuring the supply of global customers.
With the full commissioning of the Lingang industrialization base, AMEC's future development blueprint is slowly unfolding. In July 2023, AMEC's production and R&D base in Nanchang, Jiangxi Province was completed and put into use; the AMEC Lingang headquarters and R&D building located on the shore of Dishui Lake in Shanghai is also under construction, covering an area of about 100,000 square meters after completion. In the future, the total area of AMEC's production and R&D base will reach about 450,000 square meters.
Since its development, AMEC has continuously developed market-competitive equipment with high-end semiconductor equipment as its core. The company is also integrating upstream and downstream of the industry chain and related resources to promote faster development of the company. AMEC expects that in the next five to ten years, it will cover 50% to 60% of the equipment in the key fields of integrated circuits through independent research and development and cooperation with industry partners.