Those machines are already planned because using euv for all layer is financially impossible. 3nm for example only uses 16-20 layers of euv. MOL and BEOL is all duv.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
I had to shake my head at that quote. The impact of sanctioning software companies like this can be disruptive but far different from sanctioning companies that rely on physical supply chains to make things.
And no, they don't actually decide to put companies on the entity list depending on how much they're impacted by it. At best, it's a signaling mechanism even if the specific impact is more of an inconvenience after the disruption or they're just going down the list regardless.
I swear that was an answer you'll get if you plug a question into chatgpt.
Words put together that don't make much sense in context if you have a passing familiarity with the topic....
Well we an example man, Huawei, who is a software company and a hardware company, I would said that Hardware sanctions have a bigger impact on Huawei than software sanctions, call me crazy man, you can download the Android kernel and make you own OS and your own store, but if you don't have the processor to run that OS you are pretty much cooked, you can even pirate the EDA software, you wont receive updates but you can't pirate your way into TSMC fab. Before Huawei started making their own SOCs with SMIC, they were surviving making money with software because was easier to circumvent the sanctions than hardware.
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Why would Chinese EDA firms use American Cloud? Programming languages are not closed source. Neither are compilers. Software development tools are all widely available and are seriously easy to write.
there is no real obstacles and I would be shocked if Chinese EDAs can be inconvenienced that easily
I am going to cut off this line of discussion now since we are going entirely off topic.
anything more along this line will be deleted!
Jincheng Semiconductor Headquarters Project Settled in Wuxi High-tech Zone with Investment of Over 200 Million Yuan
On July 31, Wuxi High-tech Zone, Jincheng Semiconductor and Wuxi Venture Capital signed a cooperation agreement in Wuxi, marking the official launch of the Jincheng Semiconductor probe card project in Wuxi High-tech Zone.
According to Wuxi High-tech Zone Online, Jincheng Semiconductor Headquarters Project has invested over 200 million yuan and is located in Xingang Integrated Circuit Equipment Parts and Materials Industrial Park in Wuxi High-tech Zone. The company uses a relatively advanced technology route to develop and produce integrated circuit probe cards. The project team is composed of senior experts from the probe card industry, all of whom have worked for well-known overseas companies and have an average of more than 15 years of industry experience. At present, the company has completed financing in June 2024.
Tianyancha news shows that Jiangsu Jincheng Semiconductor Co., Ltd. was established on March 15, 2024. The company completed a number of industrial and commercial changes on June 27, 2024, adding shareholders such as Suzhou Shanhai Growth Venture Capital Partnership (Limited Partnership), and at the same time increased its registered capital to 34.0909 million yuan, an increase of 13.64%.
New progress of CR Micro's 12-inch production line projects in Chongqing and Shenzhen
According to the Semiconductor Industry Network, CR Microelectronics recently disclosed a record of its investor relations activities, which mentioned that both of CR Microelectronics' 12-inch projects are progressing as expected: the Chongqing 12-inch wafer manufacturing production line focuses on power devices, and is currently fully loaded with materials, and is expected to achieve full production in the second half of the year; the Shenzhen 12-inch specialty process integrated circuit production line focuses on 40-90nm power ICs and MCUs and other products, and has entered the equipment installation and commissioning stage, with R&D work being promoted simultaneously, and is expected to be put into operation by the end of the year.
It is understood that China Resources Microelectronics Chongqing 12-inch wafer manufacturing production line was put into production at the end of 2022 with a total investment of 7.55 billion yuan. After the project is completed, it is expected to have a monthly production capacity of 30,000 to 35,000 12-inch mid-to-high-end power semiconductor wafers, and will also build supporting 12-inch epitaxial and thin-film process capabilities.
The construction of China Resources Microelectronics' Shenzhen 12-inch wafer project was announced on October 29, 2022. The total investment scale of the first phase of the project is about 22 billion yuan, focusing on analog special processes above 40 nanometers. After completion, it will have an annual production capacity of 480,000 12-inch power chips. Its products are mainly used in automotive electronics, new energy, industrial control, consumer electronics and other fields.
Guangzhou Micro-Nano's Yang Zhenyu: From mass production of photoresist to next-generation photolithography materials.
In order to accelerate the localization of Arf photoresist and solve the problem of the country being stuck in this regard, we established Guangzhou Micro-Nano Photolithography Materials Technology Co., Ltd. in Guangzhou in April 2020, focusing on the localization and internationalization of high-end photolithography materials, led by Arf photoresist .
Advantages of Guangzhou Micro-Nano:
Independent raw material technology: Complete photoresist research and development without a photolithography machine!
Performance beyond commercial standards: 193 nm dry photoresist product performance indicators
It completely surpasses commercial photoresists in Europe, the United States and Japan, fills the domestic gap and has international competitiveness.
Light asset operation: light asset model and low operating costs.
Deep customer resources: The team includes many senior lithography experts with more than ten years of experience. They have worked in well-known companies such as Intel and SMIC and have extensive customer resources and industry connections.
Strong supply chain: Complete OEM supply chain to ensure product quality and supply.
In the year our company was founded, we were fortunate to be surveyed by Shiyin and were listed, along with Nanjing University of Science and Technology Optoelectronics and Bokang, as one of the earliest companies in China to achieve technological breakthroughs in Arf photoresist.
Guangweinano industry chain: Guangweinano mass-produces photoresist + Zhuhai Yatian mass-produces photoresist resin (exclusive supply)
That is to say, from the core raw materials of photoresist to the formula of photoresist, we have independent intellectual property rights developed independently.
The layout of Guangweinano's independent intellectual property rights covers photoresist resins, photoresist photosensitizers, photoresist formulas, etc.
At present, Guangweinano's Arf photoresist products have covered lithography patterns such as lines and holes from 90 nanometers to 28 nanometers. Compared with some international commercial photoresists from Europe, the United States and Japan, some performance of the photoresist is also fully on par with or even surpasses them.
The results obtained from the customer's product line prove that the OPC and Pattern Defect performance of Guangweinano's products are basically consistent with those of POR glue.
Advantages of Guangweinano ArF photoresist technology:
Technical advantage 1: High resolution - 80/80 nm and dense Line/Space patterns can be easily imaged under annular illumination, reaching the limit requirements of dry ArF lithography, and the highest resolution of wet ArF lithography is pushed to 40/40 nm.
Technical advantage 2: Large process window - DOF is the most important performance indicator of lithography. A large DOF means a wider process window and potentially better yield performance for customers.
Technical advantage three: Large aspect ratio - the aspect ratio can be as high as 4. With the same thin line width, the film thickness is thicker without collapse, and the etching resistance is stronger, which brings customers greater process flexibility.
Technical advantage 4: Good storage stability - at least 10 months of storage stability, compared with the 6-month shelf life of common photoresists, an increase of more than 50%.
Research and development of next-generation photoresist materials : After ArF photoresist, Guangweinano has actively deployed in the EUV and DSA fields to develop the next-generation photoresist. For 5 nm resolution fast DSA materials, it has carried out close industry-university-research cooperation with Fudan University to jointly promote technological innovation.
The results of the industry-university-research cooperation include 5 nm resolution fast DSA materials, which are characterized by the ability to quickly form lithography patterns with a resolution of less than 5 nanometers under low temperature conditions.
For the aforementioned photoresists and advanced material products, we have adopted a QC quality management system that meets industry requirements to ensure that all aspects of their production meet the industry and customer requirements.
So basically China imports twice as many chips as it exports. Claims of the imported chips being more valuable also seem to be bunk.
I mean just check out the ratio between value in dollars and number of units moved.
I think once the next fab expansion is over the import/export balance will switch to the opposite way around with more exports than imports. SMIC is basically doubling its capacity. And the other major fabs like YMTC, CXMT, Hua Hong seem to be doing the same.
The claim that guy Jordan Schneider is doing of the expansion being top down planned is just bunk. Like you said the government throws money at promising chip projects but they are originally demanded by the private sector. One good example is Nexchip which was made to produce DDICs for BOE.
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