Urepu officially announced that it had recently completed a new round of financing of tens of millions of yuan, led by Clivia Capital, followed by Jingcheng Capital, Zhuoshi Investment, Nantong Haihong Jinsu, etc. This round of financing will be used for the mass production of multiple equipment such as wafer edge detection equipment SICE200, wafer resistivity measurement equipment SICV200, wafer dislocation and micro-pipe detection equipment SICD200, and film thickness measurement equipment Eos200DSR for various semiconductor materials, as well as the research and development of new layout products and the expansion of the team.
Founded in 2021, URP was led by a PhD who has been working in the semiconductor industry for a long time, and co-founded with a senior domestic semiconductor front-end process measurement equipment technology team, committed to creating high-quality semiconductor front-end measurement equipment. In August 2022, URP announced the completion of tens of millions of yuan in Pre-A round of financing, led by Hongzhuo Capital, followed by Yinzhu Capital, Nanjing Xinda Chenghui and Hefei Zhongyu. The funds will be mainly used for the mass production of semiconductor-specific FTIR measurement equipment Eos200/Eos300, Selene series products and the development of new equipment.
In July 2023, Urepu officially announced the completion of nearly 100 million yuan in Series A financing, led by Jishi Pujiang, followed by Hunpu Investment, Galaxy Capital, Zhongnan Venture Capital, Honghu Capital, Hangzhou Menghe, Jingning Lingan and others. The funds will be used for the research and development and mass production of new products. It is reported that Urepu's SICE200 equipment has achieved edge defect detection of compound semiconductors such as silicon carbide, as well as silicon substrates and epitaxial wafers.