Chinese semiconductor thread II
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Hongxin Gas completes A++ round of financing worth tens of millions of RMB
Electronic bulk gases are the core semiconductor materials second only to silicon wafers. They are the lifeblood of semiconductor production plants and are involved in almost all production processes of semiconductor production lines. They are directly related to the quality and yield of customer products and are an important link in the localization process of materials in the semiconductor industry.
Linde Gas, Air Liquide and Air Products and Chemicals, three major foreign companies, have long dominated the electronic bulk gas supply market with their first-mover advantage. Since 2020, the domestic semiconductor industry has developed rapidly, and the new demand for electronic bulk gases has begun to be localized. As a major supplier of local electronic bulk gases, Hongxin Gas can accurately understand the needs of domestic Fab manufacturers and provide customized services. It is the backbone of achieving independent control of bulk gases, long-term supply chain security, and breaking the monopoly of foreign capital in the development of China's semiconductor industry.
Ruixi Technology completes a new round of financing to accelerate the commercialization of automotive-grade VCSEL chips, etc.
On June 25, Zhejiang Ruixi Technology Co., Ltd. (referred to as "Ruixi Technology") officially announced that it had recently completed a new round of financing. This round of financing was further increased by the company's shareholders. The funds will be used to further accelerate the commercialization of automotive-grade VCSEL chips and the product iteration of optical communication application chips in the AI era.
Ruixi Technology was founded in September 2017 and is headquartered in Hangzhou, Zhejiang. It focuses on the research and development and design of VCSEL and is committed to becoming a leader in the optical chip industry. Ruixi Technology's products mainly cover three major areas: automotive, data communications, and consumer electronics. Its application scope mainly covers automotive smart cockpits and lidar smart driving, data centers and cloud computing, face recognition consumer electronics products, and smartphone rear AR.
In recent years, with the booming development of smart car applications such as Lidar, smart cockpits, and in-vehicle optical communications, VCSEL, as a core optical device with potential for large-scale automotive-grade applications, is about to usher in a new wave of demand in the sensing application market.
Zhongsi Technology launched a new Electrochemical Mechanical Polishing tool.
Hangzhou Zhongsi Electronic Technology Co., Ltd. (hereinafter referred to as "Zhongsi Technology"), which focuses on the field of high-end chemical mechanical planarization (CMP) equipment, participated in the semiconductor enterprise exhibition and demonstrated its new generation of 6-inch and 12-inch CMP equipment and ECMP equipment to semiconductor peers.
Zhongsi Technology has developed the first 12-inch CMP equipment (TTAIS ® 300 CMP) that can support both 3-disk and 2-disk processes through independent innovation. It can be applied to all high-end processes below 90nm. In the process of chip production, it provides advantages such as high maintainability, high production efficiency, and low comprehensive use cost. In addition to IC processes, TTAIS ® 300 CMP also supports chemical mechanical polishing of 12-inch large silicon wafers.
In addition, for silicon carbide substrates, Zhongsi Technology has also launched the ECMP equipment (TNTAS ® ECMP), the first electrochemical polishing technology, which has achieved more than 50% improvement in time and cost compared with traditional polishing equipment, and no longer uses polishing liquid containing highly corrosive oxidants such as potassium permanganate. The process conditions are mild and environmentally friendly.
At present, Zhongsi Technology's CMP equipment and ECMP equipment have achieved a phased breakthrough: the 6-inch equipment TENMS® ECMP150S electrochemical polishing equipment newly launched in 2024 has obtained orders and intentions from many third-generation semiconductor material process device production lines; at the same time, TTAIS® 300 12-inch equipment has also been gradually introduced into integrated circuit manufacturing and large silicon wafer production companies for various process verifications, and has been recognized by large silicon wafer manufacturers and has received repeat orders.
A person familiar with the matter, who asked not to be named for security and privacy reasons.
Feel free to quote me on this.
Which makes it all the more amusing that they can't do their jobs right even when the intelligence is being handed to them on a silver platter. Truly hopeless.
Not to mention that in the real world, one can only stay ontop of the cutting edge by accepting all information, rumor or not, and separating the wheat from the chaff gradually as numerous tangentially related pieces begin to take on similar trajectories. By only accepting the most proven and citeable information, one will always remain years behind.
It's kind of like how sometimes you run an experiment and the data is not what you predicted. You don't outright reject the data as this clown did. Instead you just need to investigate it more deeply. And even then you may fail. It takes time and diligence to put the pieces together.
This only further reinforces that their institutions would be in a much better position if they hired people with real science education. Not this social science, humanities, international relations, political science, liberal arts nonsense.
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