Chinese semiconductor thread II
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More like the accounting firm that is responsible for U-precision's IPO got involved in fraud scandal
It is worth noting that U-precision's IPO was accepted by the Shanghai Stock Exchange as early as June 24, 2020, which is 4 years ago. It was inquired on September 10, 2021, and the listing committee meeting was approved on September 17, 2021. Then the IPO process fell into a 3-year stagnation.
The official website of the Shanghai Stock Exchange shows that Dahua Accounting Firm participated in the audit of U-precision's IPO. Previously, Dahua Accounting Firm was punished for its involvement in the Jintongling fraud case, and the refinancing projects of many related listed companies were affected.
值得注意的是，华卓精科IPO早在2020年6月24日获上交所受理，距离现在已过去长达4年时间，2021年9月10日已问询，2021年9月17日上市委会议通过，随后IPO进程陷入了长达3年的停滞状态。
上交所官网显示，大华会计师事务所参与了华卓精科IPO审计工作。此前，大华会计师事务所因涉造假案收到处罚，相关多家上市公司的再融资项目受到影响。
No. HBM is exclusively used for AI training chips. That kind of data transfer is completely overkill for mobile SoCs.
HPMicro completes a new round of financing of nearly 100 million yuan
Recently, Shanghai Xianji Semiconductor Technology Co., Ltd. (hereinafter referred to as "Xianji Semiconductor"), a domestic high-performance microcontroller manufacturer, announced the completion of a new round of financing of nearly 100 million yuan. This round of financing was led by Paradise Silicon Valley Capital, followed by Tianjin Yongtai Haihe, Hangzhou Yuanyan Equity Investment Fund and Sanwang Qitong.
The funds raised from this round of financing will be mainly used by Pioneer Semiconductor to enrich its product line of high-performance microcontrollers, and to expand and expand its market development in the three major fields of industrial automation, new energy and automotive electronics, especially to accelerate the development of intelligent driving, robotics, edge AI chips and other fields.
HPMicro was founded in June 2020 and is located in Zhangjiang, Shanghai. It is a semiconductor company dedicated to high-performance embedded solutions. It is headquartered in Shanghai and has branches in Tianjin, Suzhou, Shenzhen and Hangzhou. The company's core members are all from world-renowned semiconductor company teams, with R&D personnel accounting for 90%, with more than 15 years of rich R&D and management experience in more than 20 SoC projects.
Chip design capability is one of the core competitiveness of MCU suppliers. In addition, ecosystem construction capability is also the key to building differentiated advantages. In terms of software and hardware ecosystem construction, Pioneer Semiconductor's products cover microcontrollers, microprocessors and peripheral chips, as well as supporting development tools and ecosystems. Its high-performance general-purpose MCU products that have been mass-produced include the HPM6700/6400, HPM6300, HPM6200, HPM5300 and HPM6800 series, all of which have obtained AEC-Q100 certification.
Quectel Communications supports Gosuncn Ruilian in launching the industry's first batch of "satellite + cellular" asset trackers.
Shanghai, June 26, 2024 - During the 2024 Mobile World Congress (MWC Shanghai), Quectel Communications, GosuncnReliant and Qualcomm Technologies jointly released the industry's first asset trackers that support both "NTN satellite communication" and "multi-mode cellular communication" functions. Combining Quectel Communications' highly integrated NTN satellite communication module, Qualcomm Technologies' leading chip technology and GosuncnReliant's innovative design, this product will bring global customers an asset tracking solution that combines powerful functions, long battery life, and small size.
Narrowband non-terrestrial network (NTN) connection is an important supplement to terrestrial cellular communication technology. By integrating satellite communication network and terrestrial network, it can provide ubiquitous low-power coverage capability without being restricted by terrain, as well as global tracking and positioning, connect the multi-dimensional space of air, space, land and sea, form an integrated ubiquitous access network, and realize on-demand access in all scenarios.
Coverage everywhere
Developed by Gosuncn Ruilian, the GL103S asset tracker is equipped with a Qualcomm® 9205S modem and Quectel multi-mode satellite communication module. It supports the S-band (B256/B23) and L-band (B255) of 3GPP R17 IoT-NTN, enabling the tracker to fully support two-way satellite communications and multiple network standards such as Cat M1, Cat NB2, EGPRS, etc., and can achieve "no dead angle" reliable connection in remote areas such as oceans, deserts, and forests, providing a more comprehensive, flexible and industry-leading communication solution for application scenarios such as freight tracking, cold chain logistics and valuable asset monitoring.
Domestic EDA Prologic Electronics officially announced that it has passed Samsung’s 3nm and 4nm process technology certification!
Recently, ProPlus announced that its new generation of large-capacity, high-performance parallel SPICE simulator NanoSpice has passed Samsung Foundry's 3/4nm process technology certification, meeting the needs of both parties' common customers for high-end circuit simulation with high precision, large capacity and high performance.
Samsung's 3/4nm process is designed to increase yield, reduce power consumption and improve performance, which requires higher-precision circuit simulation and verification tools to achieve more advanced IC design.
According to ProLiant Electronics, NanoSpice's certification is part of Samsung Foundry's EDA certification program. The simulator has shown good simulation convergence and accuracy in large-scale post-simulation netlist simulation of analog IP, which can help mutual customers design with confidence and ensure higher accuracy while shortening the design cycle. NanoSpice is designed for the most challenging simulation tasks, such as large-scale post-layout analog circuit simulation that requires large capacity, high speed, and high-precision simulation. It is equipped with superior parallel circuit simulation technology and can efficiently handle circuit simulations of more than 50 million components.
According to Yang Lianfeng, director and president of ProPlus, NanoSpice adopts high-performance and high-precision design. Through its full set of simulation capabilities from smaller modules to full-chip design, it can meet the most stringent performance and accuracy design verification requirements, and its performance in a high-precision state is better than other commercial SPICE simulators.
Samsung is a long-term customer and ecological partner of ProPlus. In October 2022, ProPlus officially announced that its high-performance parallel SPICE simulator NanoSpice has passed the Samsung foundry 5nm process technology certification, meeting the needs of both customers for high-precision, large-capacity and high-performance high-end circuit simulation.
Guangzhou's integrated circuit wafer output increased by 94.3% year-on-year
Recently, the Guangzhou Municipal Bureau of Statistics released the economic operation situation of Guangzhou, showing that from January to May, the output of integrated circuit wafers in Guangzhou increased by 94.3% year-on-year.
Data shows that from January to May, the city's industrial added value above designated size increased by 0.7% year-on-year. High-tech manufacturing industry has a good growth momentum, achieving a 9.9% increase in added value, among which the new generation of information technology products has accelerated growth, with service robots, integrated circuit wafers, and analog chips increasing by 1.1 times, 94.3%, and 47.8% respectively.
Export trade has improved. From January to May, the total value of the city's foreign trade imports and exports was 424.517 billion yuan, down 7.6% year-on-year. In terms of imports and exports, exports were 251.323 billion yuan, down 9.5% year-on-year, 2.7 percentage points narrower than that from January to April; imports were 173.194 billion yuan, down 4.7% year-on-year.
Among the key export products, the export value of high-tech products increased by 5.6% year-on-year, accounting for 12.7% of the total export value. Among them, the export value of high-tech products in optoelectronics, electronics, materials, aerospace and other fields increased by 23.3%, 14.9%, 17.5% and 91.1% respectively.
CVD for semiconducting diamond wafers at semi-e
The molecular beam epitaxy thin film growth equipment MBE has an ultra-high vacuum environment during thin film epitaxial growth. It performs thin film epitaxial growth in an ideal environment. It can eliminate various interference factors during thin film growth and obtain ideal high-precision thin films.
The HFCVD hot wire chemical vapor deposition system solution can be used for the production of micron-crystalline and nanocrystalline diamond wafers, and can also be used to manufacture corrosion-resistant and wear-resistant hard coatings, diamond BDD electrodes, solar thin-film batteries, etc.
The single/double-sided coated hot wire CVD diamond equipment (HFCVD) independently developed and produced can prepare diamond polycrystalline wafer substrates in sizes of: 2 inches, 4 inches, 6 inches, and 8 inches.
Diamond film production line
Application areas: third-generation semiconductors, high-power lasers, 10G communications, micro-nano acoustics, power amplifier devices, filter devices, etc.; can be used for the research and development and production of diamond products at the mechanical level, thermal level, optical level, and acoustic level.
MBE for Quantum tech and semiconductors.
The multi-source large-size MBE equipment solution can realize epitaxial growth process on certain substrates, realize molecular self-assembly, superlattice, quantum well, one-dimensional nanowire, etc. It can carry out process verification of second-generation semiconductors and third-generation semiconductors and growth and manufacturing of epitaxial wafers.The single/double-sided coated hot wire CVD diamond equipment (HFCVD) independently developed and produced can prepare diamond polycrystalline wafer substrates in sizes of: 2 inches, 4 inches, 6 inches, and 8 inches.
Diamond film production line
Application areas: third-generation semiconductors, high-power lasers, 10G communications, micro-nano acoustics, power amplifier devices, filter devices, etc.; can be used for the research and development and production of diamond products at the mechanical level, thermal level, optical level, and acoustic level.
MBE for Quantum tech and semiconductors.
The molecular beam epitaxy thin film growth equipment MBE has an ultra-high vacuum environment during thin film epitaxial growth. It performs thin film epitaxial growth in an ideal environment. It can eliminate various interference factors during thin film growth and obtain ideal high-precision thin films.