Chinese semiconductor thread II

tokenanalyst

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Xinhuazhang's (XEPIC) ecological strategy debuted at DAC, released the full-process agile verification manager FusionFlex, and jointly launched a digital-analog hybrid simulation solution with HuaDa JiuTian (EMPYREAN EDA)​


On June 24, at the annual global electronic design automation event DAC 2024, China's leading system-level verification EDA solution provider, Xinhuazhang, and China's leading EDA company HuaDa JiuTian jointly demonstrated the latest joint solutions of both parties in the field of mixed digital and analog simulation.
In addition, Xinhuazhang grandly launched the EDA full-process agile verification manager Zhaorui FusionFlex, which is aimed at top EDA companies and chip and system manufacturers from all over the world, demonstrating the joint strength and innovative vitality of the Chinese ecosystem.
This tool innovatively proposes a professional management solution for the challenges of multiple tools, multiple resources, and multiple demands in the chip design and verification process. It provides strong technical support for integrating the current scattered point tools of domestic EDA and building a complete full-process domestic EDA ecosystem. It will also help chip design companies reduce their cost investment in hardware, software, and process management, and achieve a more flexible and efficient application innovation cycle.

At the scene, the joint solution of HuaDa Empyrean and Xinhuazhang in the field of digital-analog hybrid simulation also aroused great interest among professional users.

Based on the technology of GalaxSim, the simulation tool of Xinhuazhang, and Empyrean ALPS, the simulation tool of Huada Jiutian, the digital-analog hybrid design simulation solution jointly created by the two parties can support any hybrid simulation scenario dominated by digital simulation and analog simulation, and can also provide digital-analog hybrid simulation based on Real Number Modeling.
At the same time, Fusion Debug, the debugging system of Xinhuazhang, can support the waveform format of Empyrean ALPS of Huada Jiutian, allowing users to intuitively see the waveform results generated by different tools.

This joint solution starts from the user's pain points and deeply integrates the technologies that both parties are good at. It breaks down the technical barriers between different departments for customers and provides more efficient and smooth project collaboration efficiency. It is an innovative example of China's EDA ecological alliance.

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tokenanalyst

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An Automatic Insertion Scheme of Extra Via for DSA-MP Hybrid Lithography​

EDA Center, Institute of Microelectronics of the Chinese Academy of Sciences; University of Chinese Academy of Sciences, China

Abstract​


With the continuous shrinking of feature size, directed self-assembly (DSA) has gradually become one of the leading candidates for extending the resolution of optical lithography to sub-7 nm and beyond, a DSA-based extra via (EV) insertion scheme is the key to guarantee the reliability of integrated circuit when applying DSA during manufacturing. In this paper, we proposed an automatic insertion algorithm of extra via taking the manufacturing cost of the guiding template in DSA into consideration in the EV insertion process, which makes the total cost of subsequent DSA-MP hybrid lithography controllable, while maintaining a high insertion rate of EV. The simulation results show that, with the same experimental patterns, the insertion rate of EVs is increased by about 10% compared with the previous integer linear programming method.​


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tphuang

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A New U.S. Crackdown Is Crippling China’s Best Hope to Rival Nvidia​


I'm just going to comment once on why i deleted it. The issue of Ascend production capacity being limited by HBM access is well known and I have written about it previously. Worldwide, HBM capacity is a major issue for AI industry, including Nvidia. It shouldn't be a surprise to anyone that Ascend may have capacity limitation due to availability of HBM. I don't think there is any evidence that it would be due to any new US crackdown or anything like that. And I get very suspicious anytime the source is "according to people in supply chain". Anyone can make that up.

I do think that it's quite plausible that if Huawei is having trouble sourcing HBM3, it might turn to domestic HBM2E options.

As usual, this kind of topic has nuanced answers and unfortunately many articles are just looking for clicks and don't have any kind of nuance.

And these are the type of articles that cause unhelpful discussions on this thread. So please be careful when you post stuff like this.
 

tokenanalyst

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A New U.S. Crackdown Is Crippling China’s Best Hope to Rival Nvidia​

"The issues related to the Ascend 910B began in the past few weeks. Huawei and Semiconductor Manufacturing International had estimated they would soon be able to produce around 500,000 Ascend chips per year. However, because the chip fabrication machines were developed for older generation chips, repurposing them to make more-advanced ones, like Ascend 910B, causes parts to break down faster, the report noted."

I don't know if this is true because you have to take these articles with a truck load of salt, but if is true the Stooges sanctions are doomed to fail. We had been saying this for quite a while, there is not a lot of difference between equipment used for advance nodes and more or less older nodes. An etching machine can be use for a 65nm down to 5nm process node. That means that China domestic wafer processing equipment is already filling the gaps of US made equipment for 7nm nodes. Different from US equipment, Domestics tools can be maintained and upgraded without restriction and the best of all is with domestic tools Chinese fabs can maintain a level of secrecy that was not possible with US tools.
 

huemens

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Shanghai Stock Exchange terminated U-precision IPO application

It says they withdrew the application themselves
Huazhuo Precision Technology and its sponsor Dongxing Securities Co., Ltd. submitted to the Shanghai Stock Exchange the "Application of Beijing Huazhuo Precision Technology Co., Ltd. to withdraw its application documents for the initial public offering and listing on the Science and Technology Innovation Board" and "Application of Dongxing Securities Co., Ltd. to withdraw its application documents for the initial public offering and listing on the Science and Technology Innovation Board", respectively.
 
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