Looks like Pengcheng Laboratory in Shenzhen is working toward EUV and also the Institute of Advance Science Facilities in Shenzhen is seems to be working on FEL EUV according to some sources.
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Chinese semiconductor thread II
- Thread starter vincent
- Start date
Increasing power may not necessarily increase throughout.But will increase power without increasing cost too much increasing throughput. In fact, it could also reduce stochastic, I think the biggest with ASML EUV machines is that they are underpowered to achieve enough contrast in the photoresist and ASML has to do this delicate balance between throughput and pattern quality as seen in some research done using synchrotron EUV radiation.
Apart FEL offer other advantages like they could power multiple EUV machines, don't require collector mirrors, reduce the needs of EUV optics, reduce the need of hydrogen infrastructure.
One the reason is because most FEL are built for multiple experiments in mind they have more hardware that would be required for EUVL, reducing unnecessary hardware would reduce size and cost. Also the same could have been said about mercury vapor lamps and excimer lasers which are notoriously difficult to make, expensive and very unreliable <Compared to others light sources> when they started to be used in lithography and still today to the point that only three companies can make excimer lasers for lithography, US Cymer, Japan Gigaphoton and China RSLaser.
FEL may not require collector optics but will require beam expander and beam splitter optics. Synchrotron may drive a hole in the mirrors. Also hydrogen is also there for hydrogen on the projection optics. The wafer is in a hydrogen ambient. The synchrotron and the lithography machine will be in two different vacuum which is not possible.
Well if you have a slower wafer stage, slower overlay and a crappy photoresist, of course, but all things equal is entirely possible.Increasing power may not necessarily increase throughout.
China has EUV synchrotron facilities where they pattern wafers using IL-EUV, I think the wafer loader receive the wafers create the vacuum and put the wafers inside the projection machine where a robot put it in the "wafer stage", i think the same would apply for FEL or SSMB.FEL may not require collector optics but will require beam expander and beam splitter optics. Synchrotron may drive a hole in the mirrors. Also hydrogen is also there for hydrogen on the projection optics. The wafer is in a hydrogen ambient. The synchrotron and the lithography machine will be in two different vacuum which is not possible.
Interference lithography is for resist and process development. It cannot be used for HVM. Hydrogen is there to scrub the hydrocarbon on the optics and photomask.China has EUV synchrotron facilities where they pattern wafers using IL-EUV, I think the wafer loader receive the wafers create the vacuum and put the wafers inside the projection machine where a robot put it in the "wafer stage", i think the same would apply for FEL or SSMB.
Also high-na euv depth of focus is 100nm or less. Good luck with etching that.
Hmmmm...its very telling that even after US sanctions most Chinese companies still want to stick with American products like Ndivia. There must be a reason for such a weird obsession (decision) I guess?very interesting
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We know now that Huawei's Ascend chips are in very high demand, but looks like it started to sell its chips back in 2021 and only government data centers would use its chips (I think there are charts of this)
Nobody would use something other than Nvidia. I remember back in 2022 when Chinese chipmakers like Biren came out wit their products, Huawei was advising all the chipmakers to stick together and come up with a unified standard, but that was ignored by others. But here is what i looked like, nobody wanted Ascend chips. This only started to turn around in early 2023
Seems Huawei is lucky the US is stopping Chinese companies from buying US chips, that way Huawei can finally dominate the Chinese AI chip market with its Ascend chips.
Do I ever said that IL-EUV was for ICs HVM? I said that concept of vacuum connection between the source, the patterning machine and the wafer loader is going to be the same for FEL or SSMB.Interference lithography is for resist and process development. It cannot be used for HVM. Hydrogen is there to scrub the hydrocarbon on the optics and photomask.
Also high-na euv depth of focus is 100nm or less. Good luck with etching that.
Although is mainly use for gratings, there is a team working on using IL-EUV for IC manufacturing, I posted their research here.
That's what happens when you have a good brand name. It's all about the image people have of your brand. So brand building is one of the most important things. Else apple won't be selling and making so much money in China and the world even today despite their phones being more expensive than most of their rivals. Plus their ecosystem is unmatched to be honest. Hard to leave once you join Apple.Except when you buy Huawei you look cool, IPhone is boring from the last 6 years after the Huawei chip ban the dammed phone hadn't change much, not a single new innovation just a slow incremental improvement which they charge you an arm and a leg for it.
Jiangsu Luxin Semiconductor Project Tops Out
Jianyuan Co., Ltd., on June 6, the topping-out ceremony for the new factory building and supporting facilities project of Jiangsu Luxin Semiconductor Technology Co., Ltd. was successfully held.It is reported that the Luxin Semiconductor project is located in Suzhou Industrial Park. According to previous news, it plans to invest 2 billion yuan and cover an area of 74 acres. After completion, it will have an annual production capacity of about 35,000 semiconductor masks, with a technology node of 28nm, which can be widely used in high-performance computing, artificial intelligence, mobile communications, smart grids, high-speed rail transportation, new energy vehicles and many other industries involving integrated circuit semiconductor chip manufacturing, packaging and other fields. The project is divided into two phases. The first phase plans to produce node masks of 45nm and above; the second phase plans to produce node masks of 28nm and above, and mass production is expected to be achieved in 2025.
According to the information, Jiangsu Luxin Semiconductor Technology Co., Ltd. was established on May 18, 2023. It is a technology company focusing on the research and development and production of semiconductor masks. It has a semiconductor mask production line with a process node of 130nm-28nm. In the future, it will focus on high-end analog chips in the automotive and communications fields to make up for the shortcomings of domestic high-end chips.
According to the information, Jiangsu Luxin Semiconductor Technology Co., Ltd. was established on May 18, 2023. It is a technology company focusing on the research and development and production of semiconductor masks. It has a semiconductor mask production line with a process node of 130nm-28nm. In the future, it will focus on high-end analog chips in the automotive and communications fields to make up for the shortcomings of domestic high-end chips.
Rongda Photosensitive: Zhuhai photoresist project is expected to be completed and put into production by the end of the year
Rongda Photosensitive stated on an interactive platform that the company's new photoresist and supporting chemical project in Zhuhai is being promoted in an intense and orderly manner. It is expected to be completed and put into production before the end of this year. It is estimated that after the project reaches full production, it will add 120 million square meters of Photosensitive dry film and 15,300 tons of display photoresist/semiconductor photoresist production capacity.Recently, Rongda Photosensitive plans to issue stocks to specific objects through simplified procedures to raise no more than 245 million yuan, which will be used for the construction of high-end photosensitive circuit dry film photoresist projects, IC substrate solder mask dry film photoresist and semiconductor photoresist research and development capacity improvement projects, as well as to supplement working capital.