Chinese semiconductor thread II

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Preparation method and processing equipment of extreme ultraviolet light source collecting mirror​

Changchun Institute of Optics Fine Mechanics and Physics of CAS

CN117891139A​

Abstract​

The invention relates to a preparation method and processing equipment of an extreme ultraviolet light source collecting mirror, wherein the method comprises the following steps: manufacturing a mirror blank; preliminary processing of the surface of the substrate; preparing a silicon modified layer; polishing the surface of the silicon modified layer; detecting the surface type precision and roughness of the collecting mirror; photoetching a grating structure on the surface of the collecting mirror; detecting the machining precision of the grating structure; coating a film on the surface of the grating structure; parameters of the collection mirror are detected. According to the invention, the collecting mirror substrate is made of the silicon carbide material, so that the thermal deformation of the collecting mirror substrate in the working process is reduced, silicon is used for modifying the surface of the substrate, and the consistency of the linear expansion coefficients of the collecting mirror substrate and the modified layer is improved. The photoetching is adopted to process the surface grating structure of the collecting mirror, so that the requirement on ultra-precise processing equipment is reduced, and the problem of insufficient precision of the surface grating structure of the collecting mirror which is processed by an ultra-precise lathe and modified by silicon is solved. The special curved surface exposure equipment is designed and used, so that the curved surface exposure problem is solved, and the processing precision of the grating structure is further improved.​

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BOE Huacan Optoelectronics Zhuhai MicroLED wafer manufacturing and packaging test base project process equipment ceremony was successfully held​


On May 28, the process equipment move-in ceremony of BOE Huacan Optoelectronics Zhuhai MicroLED wafer manufacturing and packaging and testing base project was successfully held in Jinwan District, Zhuhai City, marking a milestone step for the project to be lit up and put into production.

Those attending the ceremony included Li Junxia, Deputy Director of Zhuhai Investment Promotion Agency, Ao Wei, Deputy Mayor of Jinwan District, leaders of various bureaus, committees and offices of Jinwan District; Zhang Zhaohong, Chairman of BOE HC SemiTek and members of the company's executive committee, Ye Qingxian, General Manager of BOE HC SemiTek (Guangdong) Co., Ltd. and employee representatives; leaders of various equipment manufacturers and participating units, etc., all witnessed this exciting moment together.

Ye Qingxian, General Manager of BOE HC SemiTek (Guangdong) Co., Ltd. presided over the ceremony. He said that this ceremony is an exciting and important moment for the BOE HC SemiTek Zhuhai MicroLED Wafer Manufacturing and Packaging Test Base Project, which is inseparable from the strong support of leaders at all levels, including Zhuhai City, Jinwan District and Huafa Group, and all participating units and partners. The project team will continue to work hard to promote the project to achieve mass production as soon as possible.

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Yongsi Electronics: Raised 1.2 billion yuan to invest in multi-dimensional heterogeneous advanced packaging projects​


On May 27, Yongsi Electronics issued an announcement stating that the company plans to issue convertible corporate bonds to unspecified objects with a total amount of funds raised not exceeding 1.2 billion yuan. The net amount of funds raised after deducting issuance expenses will be used for multi-dimensional heterogeneous advanced packaging technology research and development and industrialization projects, to supplement working capital and repay bank loans.

The total investment of Yongsi Electronics for this project is 146,400 yuan, and the planned investment amount of raised funds is 900 million yuan. The implementation site is located in the company's Phase II factory in Ningbo, Zhejiang. At that time, it will purchase temporary health equipment, mechanical grinding equipment, chemical grinding machines, dry silicon engraving machines, chemical vapor deposition machines, wafer-level molding machines, flip-chip placement machines, flux cleaning machines, automatic grinding machines and other advanced R&D testing and packaging and testing production equipment, and at the same time introduce high-precision technology and production talents in the industry to build a R&D platform and advanced packaging production line that are compatible with the company's development strategy.

Yongsi Electronics will carry out research and development and industrialization in the fields of "wafer-level reconstruction packaging technology (RWLP)", "multi-layer wiring connection technology (HCOS-OR)", "high copper pillar connection technology (HCOS-OT)", "silicon via connection board technology (HCOS-SI)" and "silicon via connection board technology (HCOS-AI)", and after full production, it will form an annual production capacity of 90,000 pieces of multi-dimensional heterogeneous advanced packaging products such as fan-out packaging (Fan-out) series and 2.5D/3D series. The implementation of this project will further deepen the company's business layout in the field of advanced packaging and continuously enhance the company's core competitiveness.

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Dinglong shares: CMP polishing pad business revenue in Q1 was 135 million yuan, a year-on-year increase of 110%​

Dinglong Co., Ltd. disclosed the latest research minutes, saying that in the first quarter of 2024, the company's CMP polishing pad business achieved product sales revenue of 135 million yuan, a year-on-year increase of 110.08%, laying a good foundation for the continued quarterly increase in the polishing pad business this year. At present, the company's CMP polishing pad products have deeply penetrated the mainstream domestic wafer fab customers and have become the first supplier for some customers; since 2023, the key development of logic wafer fab customers has gradually achieved results. This year, the company will continue to pay attention to the market work of CMP polishing pad products and strive to maintain the year-on-year growth trend of the CMP polishing pad business.
It further stated that the company has been planning CMP polishing pads for 12 years, and started to sell them in large quantities and achieve scale profitability since 2021. It has now established itself as a leading domestic supplier of CMP polishing pads and has formed strong comprehensive competitiveness in this product field.
In addition, Dinglong's CMP polishing liquid and cleaning liquid business has entered a rapid expansion stage, with product sales revenue of RMB 77 million in 2023, a year-on-year increase of 330.84%; sales revenue of RMB 35.92 million was achieved in the first quarter of 2024, a month-on-month increase of 24.31% and a year-on-year increase of 206.00%. The company continues to promote the layout and verification of all models of CMP polishing liquid products, and accelerate the speed of increasing the volume of products on sale.

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LeadMicro: High performance growth, full orders, and continued expansion of semiconductor business​


The company released its 2023 annual report and 24Q1 quarterly report. In 2023, the company expects to achieve operating income of 1.68 billion yuan, a year-on-year increase of 145.4%. The net profit attributable to the parent company was 270 million yuan, a year-on-year increase of 399.3%, and the net profit after deducting non-recurring items was 188 million yuan, a year-on-year increase of 849.9%; the revenue in 2023Q4 was 658 million yuan, a year-on-year increase of 119.8%, the net profit attributable to the parent company was 115 million yuan, a year-on-year increase of 100.89%, and the net profit attributable to the parent company after deducting non-recurring items was 73 million yuan, a year-on-year increase of 95.0%; the revenue in 2024Q1 was 171 million yuan, a year-on-year increase of 125.3%.

Semiconductor field continues to expand. The types of ALD and CVD processes entering the industrialization verification stage are increasing. The processes currently developed include HKMG technology, columnar capacitors, metallized thin film deposition technology, high aspect ratio 3D DRAM, TSV technology, etc., and are continuing to develop new processes such as IGZO and Nb2O5 that meet customer needs. Customer types cover logic, storage, compound semiconductors, silicon-based OLED, etc., of which more than 75% of incremental orders come from the storage field (new storage, 3D NAND and DRAM). The demand of important customers in the industry is strong, and the total amount of repeated orders has exceeded 500 million yuan.​

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Huasuo Technology:

SiC equipment supplied to BYD.

Huasuo Technology announced that they had successfully entered the equipment supply chain for the silicon carbide substrate processing project of Shenzhen BYD Research Institute, and the two parties signed a substrate processing equipment contract worth tens of millions of yuan .

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"Insiders Talk About Three and a Half Generations" learned that as early as 2020, the Third Generation Semiconductor Research Center of BYD Central Research Institute had successfully mastered the full-link process and equipment manufacturing technology of silicon carbide wafer substrates, and the performance of 4-inch silicon carbide wafers has reached the world's advanced level. We speculate that this equipment purchase is to prepare for further mastering the development and mass production of large-size substrates .


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Sanan Semiconductor:

SiC products enter Europe

According to foreign media reports, Sanan Semiconductor recently signed a distribution agreement with distributor Finepower GmbH to sell Sanan's SiC products in Europe .

Finepower said that with Sanan, their already strong power device product portfolio has been perfectly supplemented. Silicon carbide is the semiconductor material for future high-voltage applications. Sanan offers the world's largest production capacity with excellent quality levels. They are very proud to cooperate with Sanan in this growing market.

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tokenanalyst said:
Huasuo Technology:

SiC equipment supplied to BYD.

Huasuo Technology announced that they had successfully entered the equipment supply chain for the silicon carbide substrate processing project of Shenzhen BYD Research Institute, and the two parties signed a substrate processing equipment contract worth tens of millions of yuan .

View attachment 130274
"Insiders Talk About Three and a Half Generations" learned that as early as 2020, the Third Generation Semiconductor Research Center of BYD Central Research Institute had successfully mastered the full-link process and equipment manufacturing technology of silicon carbide wafer substrates, and the performance of 4-inch silicon carbide wafers has reached the world's advanced level. We speculate that this equipment purchase is to prepare for further mastering the development and mass production of large-size substrates .


​
Sanan Semiconductor:

SiC products enter Europe

According to foreign media reports, Sanan Semiconductor recently signed a distribution agreement with distributor Finepower GmbH to sell Sanan's SiC products in Europe .

Finepower said that with Sanan, their already strong power device product portfolio has been perfectly supplemented. Silicon carbide is the semiconductor material for future high-voltage applications. Sanan offers the world's largest production capacity with excellent quality levels. They are very proud to cooperate with Sanan in this growing market.

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W/ Sanan entering Europe, does that mean China SiC MOSFET demand outside of BYD is not enough to fill the Changsha 12k wpm fab? Wonder what this will mean for MOSFET pricing when they ramp to 40k wpm and won't this be in direct competition with their JV w/ STM?
 
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camdencap said:
W/ Sanan entering Europe, does that mean China SiC MOSFET demand outside of BYD is not enough to fill the Changsha 12k wpm fab?
Click to expand...
Companies try to expand their markets all the times.
camdencap said:
Wonder what this will mean for MOSFET pricing when they ramp to 40k wpm and won't this be in direct competition with their JV w/ STM?
Click to expand...
I don't know if this movement is with ST Microelectronics.
 
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