Chinese semiconductor thread II

tokenanalyst

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Huahai Qingke Integrated Circuit Equipment R&D and Manufacturing Base Project Landed in Lingang​


Huahai Qingke was established in 2013. It is a high-end semiconductor equipment manufacturer with core independent intellectual property rights. Its main products are CMP equipment, thinning equipment, etc. Huahai Tsingke started from the State Key Laboratory of Tribology at Tsinghua University and was successfully listed on the Science and Technology Innovation Board in June 2022. It is a model for the exploration of the industrialization model of scientific and technological achievements in universities in my country and the deep integration of "industry, academia, research and application". Huahai Qingke's main business revenue in 2023 is 2.508 billion yuan, a year-on-year increase of 52.11%.
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Since the establishment of the Lingang New Area in 2019, after five years of development, the Lingang integrated circuit industry has become the core industry with the largest investment scale, the strongest cluster effect, and the most complete industrial chain layout in the new area. At present, it has gathered more than 260 influential integrated circuit companies at home and abroad, covering areas such as chip design, wafer manufacturing, key raw materials, core components, high-end equipment, and advanced packaging and testing. It has introduced wafer manufacturing companies such as SMIC, Jita, and Wingtech, key semiconductor equipment manufacturing companies such as AMEC, Tuojing, and Xinyuan Micro, and semiconductor packaging and testing companies such as Changdian, Huatian, and Hualing, and has also cultivated We have learned about the rising star enterprises in the industry that have grown up locally, such as Shuibang, Zefeng, and Hongge. Today, Lingang New Area has become the place with the highest concentration of integrated circuit industry in Shanghai, the Yangtze River Delta and even China.

Huahai Qingke is the first listed company in China that focuses on integrated circuit CMP equipment incubated by Tsinghua University. Huahai Qingke will build an integrated circuit equipment R&D and manufacturing base project in the new area to carry out research, development, production and sales of integrated circuit special equipment and related parts and consumables. After the project reaches full production, it can achieve an annual output value of no less than 1 billion yuan. The Lingang base will also serve as Huahai Qingke's regional headquarters radiating to the Yangtze River Delta region, improving the service level of surrounding customers and focusing on advanced processes and the company's platform development. The research and development of the project solves the "stuck neck" problem in the integrated circuit field and enhances the company's development level and radiation area.

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tokenanalyst

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Huahong : It is advancing the construction of its second 12-inch factory as planned. It will complete the construction and start trial production before the end of the year.​


Q: Considering the current overcapacity situation in the market, please explain whether the company's current capital expenditure plan will be adjusted?

A: We are advancing the construction of our second 12-inch factory as planned. We will complete the construction and start trial production before the end of the year. The market is expected to recover in 2025, and we can also actively promote the ramp-up of 12-inch production capacity. In terms of capital expenditure, from a PR/PO perspective, the capital expenditure for the three 8-inch fabs this year is about US$200-300 million, and the new 12-inch fab is about US$2 billion, mainly for the construction of factory facilities and the first phase of about 40,000 pieces. Equipment investment in production capacity.

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tokenanalyst

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The main structure of the first phase project of "Xinluzhou" Integrated Circuit Industrial Park has been capped​


It was learned from the Hefei Luyang Economic Development Zone that the main structure of all multi-story factories in the first phase of the "Xinluzhou" integrated circuit industrial park project has been capped, and the construction of all main structures is expected to be completed in November this year. At present, the project has reached agreements with a number of well-known semiconductor and integrated circuit-related companies to settle in the project.

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The construction content of the first phase of the "Xinluzhou" integrated circuit industrial park project includes a 5-story factory building, a 24-story high-rise factory building (including a podium building) and 1 supporting building. The project will focus on the overall idea of building the "Xinluzhou" integrated circuit industrial park, focusing on key aspects of the integrated circuit industry such as chip design, components, advanced packaging and testing, and characteristic IDM industries.​

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tokenanalyst

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SiX2 (X = S, Se) Nanowire Gate-All-Around MOSFETs for Sub-5 nm Applications​


Abstract​

The gate-all-around (GAA) field-effect transistor (FET) holds great potential to support next-generation integrated circuits. Nanowires such as carbon nanotubes (CNTs) are one important category of channel materials in GAA FETs. Based on first-principles investigations, we propose that SiX2 (X = S, Se) nanowires are promising channel materials that can significantly elevate the performance of GAA FETs. The sub-5 nm SiX2 (X = S, Se) nanowire GAA FETs exhibit excellent ballistic transport properties that meet the requirements of the 2013 International Technology Roadmap for Semiconductors (ITRS). Compared to CNTs, they are also advantageous or at least comparable in terms of gate controllability, device dimensions, etc. Importantly, SiSe2 GAA FETs show superb gate controllability due to the ultralow minimum subthreshold swing (SSmin) that breaks “Boltzmann’s tyranny”. Moreover, the energy-delay product (EDP) of SiX2 GAA FETs is significantly lower than that of the CNT FETs. These features make SiX2 nanowires ideal channel material in the sub-5 nm GAA FET devices.

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Wahid145

Junior Member
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Huahong : It is advancing the construction of its second 12-inch factory as planned. It will complete the construction and start trial production before the end of the year.​


Q: Considering the current overcapacity situation in the market, please explain whether the company's current capital expenditure plan will be adjusted?

A: We are advancing the construction of our second 12-inch factory as planned. We will complete the construction and start trial production before the end of the year. The market is expected to recover in 2025, and we can also actively promote the ramp-up of 12-inch production capacity. In terms of capital expenditure, from a PR/PO perspective, the capital expenditure for the three 8-inch fabs this year is about US$200-300 million, and the new 12-inch fab is about US$2 billion, mainly for the construction of factory facilities and the first phase of about 40,000 pieces. Equipment investment in production capacity.

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Can you post the full interview? Can't seem to access the link
 

sndef888

Captain
Registered Member
Do we know which fab exactly makes Huawei's Kirin 9000s/9010 chips? Is there an exact company name or gps coordinate for it?

I've heard some people say Huawei actually owns the fab with tech from SMIC?
 

jli88

Junior Member
Registered Member
This Nikkei report states government nudging to get localization rate to 20-25%.

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I am really surprised the localization rate currently is only 10%. I thought EV semiconductors would already be localized by now. What are China's alternatives to Infineon, Texas Instruments, STMicroelectronics, NXP and Renesas?
 
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