Chinese semiconductor thread II

[tphuang]

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Hunan Sanan which first entered production in June 2021 is now about to complete phase 2.

Which would bring SiC substrate production to 500k 6-inch wpy

They've signed LTA with new customers

Sanan's 1200V MOSFET has been testing with customers and will be installed on mass produced models this year

 

[GiantPanda]

Personally I dont really see this as a problem. Biren’s talent and IP will just go to other companies. It sad to see this company go under but in grander scheme of things its no big deal.

They would have been a great company in another time and place. Just as HiSilicon who in 2018 was about to crush Qualcomm if the world were different place.

It is what it is. Huawei and HiSilicon are big enough to pivot. China itself is big enough to pivot. Biren was not. Biren provides a lesson to Chinese startups who entertain building things with Western tech and standards.

 

[tokenanalyst]

Bozhong Semiconductor's fully automatic high-precision eutectic placement machine was successfully delivered to international customers​

According to Bozhong Semiconductor’s official WeChat account, recently, the Xingwei series EH9721 fully automatic high-precision eutectic placement machine independently developed by Suzhou Bozhong Semiconductor Co., Ltd. passed the strict technical verification of international customers in the optical communications industry and successfully completed delivery.

It is reported that Xingwei series EH9721 eutectic patch machine equipment has excellent performance in patch accuracy, UPH, modular design, etc. The comprehensive patch accuracy reaches ±3μm, and can be used in COC, COS, Gold Box, etc. A kind of placement process, through the use of nano-scale absolute value double feedback gantry structure, multiple transfer stations (8), 2x2"/4x4" gel pack/waffle pack, and automatic loading and unloading of magazine cache. Equipped with a horizontal turret placement head, it can realize dynamic and automatic replacement of 12 nozzles during the placement process, significantly improving the speed and productivity of the machine. It has a wider range of application products and is more suitable for mass production of products.

The Xingwei series EH9721 eutectic patch machine equipment delivered this time is the first international project delivery case in 2024, marking a big step forward in the globalization process of Bozhong Semiconductor. In the future, at the product level, Bozhong Semiconductor will continue to keep close to the market demand, focus on semiconductor process equipment, and carry out technological innovation and upgrade iterations; at the business level, it will continue to strengthen the construction of the international team, build a safe and reliable supply chain, and strengthen internationalization. Development exploration and practice.

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[tokenanalyst]

With a total investment of 1.5 billion yuan, Ruihong signed a contract for the high-end photoresist headquarters project for integrated circuits​

Wuzhong Economic and Technological Development Zone recently held a centralized signing ceremony for investment projects, and six projects with a total investment of 6.3 billion yuan were successfully settled. Among them, the high-end photoresist headquarters project for Ruihong integrated circuits was signed.

It is reported that Ruihong (Suzhou) Electronic Chemicals Co., Ltd. was established in 1993 and is one of the largest professional photoresist companies in China. The company has built an international-level high-end photoresist production line and R&D test platform. It is the only professional domestic photoresist manufacturer that has a full range of ultraviolet wide spectrum, g-line, i-line, KrF, and ArF lithography machine testing and experimental platforms. Photoresist R&D and production enterprise. The company plans to invest a total of 1.5 billion yuan to acquire new land to build semiconductor photoresist and supporting reagent projects.

Previously, Jingrui Electronics announced that its holding subsidiary Ruihong (Suzhou) Electronic Chemicals Co., Ltd. has raised a total of RMB 850 million through a private issuance of shares to meet its business development needs. The funds raised will be used for Ruihong Suzhou’s research and development, procurement, production, sales and related investments in advanced process technology semiconductor photoresist and supporting reagent business.

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[Phead128]

There was a post in the past thread of certain company buying and refurbishing Nikon Immersion scanners that different from ASML are more hardware than software so those are easier to modify, with another domestic company that refurbish these scanners" . That coincide with the pretty fast development of interferometry in China.

Chinese semiconductor industry

Updates from CR Micro https://xueqiu.com/1126660216/262076447 1、目前，华润微的IDM和晶圆代工收入占比约为1:1。我们预计今年四季度保持这个比例。我们预计明年产品收入占比有望进一步提升至60%及以上。 2、目前，华润微的产品还是以中低压的MOSFET为主。但是，公司的更高毛利率的屏蔽栅MOSFET（SGT...

www.sinodefenceforum.com

The part of 5nm FinFet reaching the performance of 3nm GAAFET is almost impossible to verify without insider information, but we all know that they are developing 5nm FinFET as we speak, we will have to wait until more information come out.

So you don't have a source, because you just cited your own post from 4 months ago to a dead video link... Where did you copy/paste from?

 

[tokenanalyst]

Speaking of SMIC lets have an update in what they are working:

1- Looks they speeding their research in 3D transistors.





2-As I posted before as they go further into more advanced nodes 5nm and gate around looks like they was having trouble with selective etching, looks like the ICP etching equipment that they have was given them lower yield so it looks like they are trying to solve that by collaborating into develop more advance selective etching equipment for these advance nodes.

"Technical field
The present application relates to the field of semiconductor technology, and in particular to an etching equipment.

Background technique
As the field of semiconductor technology continues to update and the manufacturing size of integrated circuits gradually shrinks, the process requirements for etching process equipment are also getting higher and higher. Etching equipment based on inductive coupling generally uses single-port gas delivery on the upper electrode, which can easily cause uneven etching of wafers in advanced processes, leading to the end of the later process and the failure of the electrical test of the final product. This is undoubtedly fatal for products with advanced semiconductor processes.
Therefore, it is necessary to provide more effective and reliable technical solutions to improve the uniformity of wafer etching."



3- They are getting deeper into 2.5/3D packaging with hybrid bonding, last time I remember they associated with U-Precision for the development of advanced HB equipment. Although Piotech is also developing HB equipment.

​

 

[Wahid145]

Speaking of SMIC lets have an update in what they are working:

1- Looks they speeding their research in 3D transistors.

View attachment 124340



2-As I posted before as they go further into more advanced nodes 5nm and gate around looks like they was having trouble with selective etching, looks like the ICP etching equipment that they have was given them lower yield so it looks like they are trying to solve that by collaborating into develop more advance selective etching equipment for these advance nodes.

"Technical field
The present application relates to the field of semiconductor technology, and in particular to an etching equipment.

Background technique
As the field of semiconductor technology continues to update and the manufacturing size of integrated circuits gradually shrinks, the process requirements for etching process equipment are also getting higher and higher. Etching equipment based on inductive coupling generally uses single-port gas delivery on the upper electrode, which can easily cause uneven etching of wafers in advanced processes, leading to the end of the later process and the failure of the electrical test of the final product. This is undoubtedly fatal for products with advanced semiconductor processes.
Therefore, it is necessary to provide more effective and reliable technical solutions to improve the uniformity of wafer etching."

View attachment 124338

3- They are getting deeper into 2.5/3D packaging with hybrid bonding, last time I remember they associated with U-Precision for the development of advanced HB equipment. Although Piotech is also developing HB equipment.

View attachment 124339​

View attachment 124341

As @tphuang and many other mentioned before, Lithography machine does not seem to be the constraints which is preventing expansion of 7nm++ Fab in Mainland. Is it the Etching and Deposition equipments by AMAT & Lam? AFAIK Etching equipments are not a problem for SMIC since AMEC have a good portfolio into 5nm++ Etching equipments. But when it comes to Deposition tools, I looked at Naura portfolio and most of their IC Deposition tools are for like 6-8 in Wafer. They cant possibly be used for 12in Wafer used to manufacture 7nm++ Chips by SMIC

Also anyone knows what's the progress of HuaHong 14nm FinFet? I still think it is of paramount importance that HuaHong also becomes as competitive as SMIC. The Chinese government should put their focus on HuaHong. Sometimes I feel like Liang Mong Song should make a final jump to HuaHong to get them upto speed of SMIC before he retires

 

[tokenanalyst]

It's just a wait game and let see what come out.

A lot people don't like to read the previous posts in the past thread but some things that naysayers here were previously dismissing as just rumors have turn out the be true. Is not far fetched to think that a company with deeper pockets than established companies like SMEE will ever have, a company who is one of the more innovative companies in the world and with a strong will for survival decide to go along with partners non conventionally into IC manufacturing.
​

Huh? I'm not mad at him at all. I was cracking a joke and taking a friendly jab at him. The fact that his original source was himself from 4 months ago, posting a video which is no longer online. There was some definite amusement to be had there.

Ha ha, I watched the video a few days ago, looks like the original poster remove the video, there was some lab footage.

 

[tphuang]

With a total investment of 1.5 billion yuan, Ruihong signed a contract for the high-end photoresist headquarters project for integrated circuits​

Wuzhong Economic and Technological Development Zone recently held a centralized signing ceremony for investment projects, and six projects with a total investment of 6.3 billion yuan were successfully settled. Among them, the high-end photoresist headquarters project for Ruihong integrated circuits was signed.

It is reported that Ruihong (Suzhou) Electronic Chemicals Co., Ltd. was established in 1993 and is one of the largest professional photoresist companies in China. The company has built an international-level high-end photoresist production line and R&D test platform. It is the only professional domestic photoresist manufacturer that has a full range of ultraviolet wide spectrum, g-line, i-line, KrF, and ArF lithography machine testing and experimental platforms. Photoresist R&D and production enterprise. The company plans to invest a total of 1.5 billion yuan to acquire new land to build semiconductor photoresist and supporting reagent projects.

Previously, Jingrui Electronics announced that its holding subsidiary Ruihong (Suzhou) Electronic Chemicals Co., Ltd. has raised a total of RMB 850 million through a private issuance of shares to meet its business development needs. The funds raised will be used for Ruihong Suzhou’s research and development, procurement, production, sales and related investments in advanced process technology semiconductor photoresist and supporting reagent business.

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back last year, an update still showed jingrui s developing Arf photoresists. It looks like they may have moved to production now? I'd be curious how much they can produce in their new project of 1.5B RMB

The existing producers just don't have enough capacity to supply all of China's needs

 

[Quickie]

How could a 7nm finfet match the performance of 3nm gaa？ Seem a bit far fetched

That probably has to do with the progress made with increasing the "fin height" related to increased performance due to the increased contact area with the gate. Mr. Question talked about this in one of his videos. Then again there is only so much they can go without affecting too much on the manufacturing difficulty/yield.