The amazing thing is that when the dust settles China may end up being the only country with a completely independent supply chain for advanced semi-conductor.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
The amazing thing is that when the dust settles China may end up being the only country with a completely independent supply chain for advanced semi-conductor.
Is going to be even better than that because this companies will probably want to expand the scope of their business beyond China and they will going to find ways to establish themselves in the global supply chain, in fact is already happening, so for much of the dismay of the stooges in D.C. instead of having less China they going to have more China.
The National Key Research And Development Plan "Robot Controller Special Chip R&D And Application" Project Was Launched.
Recently, the launch and implementation plan demonstration meeting of the "Robot Controller Special Chip R&D and Application" project of the National Key Research and Development Plan "Intelligent Robots" was held at the Intelligent Robot Research Institute of the Industrial Research Institute of Fudan University. The project aims to use domain-specific chip architecture to solve key technical issues such as intelligent robot planning and decision-making, collaborative control, and multi-modal perception.
It is reported that this project will focus on the development of special chips for integrated sensing, computing and control controllers for robots to meet the requirements of low latency, high energy efficiency and high reliability. At the same time, the project will develop operators and operator libraries dedicated to robot control to achieve hardware acceleration of perception, calculation, and control tasks, thereby forming an overall optimization of the software and hardware system and providing universal control for intelligent robots, especially humanoid robots and other applications. Provides critical support.
research for higher resolution dry etching
Electron collision cross section data in plasma etching modeling
Abstract
Semiconductor chips are the cornerstone of the information age, which play a vital role in the rapid development of emerging technologies such as big data, machine learning, and artificial intelligence. Driven by the growing demand for computing power, the chip manufacturing industry has been committed to pursue higher level of integration and smaller device volumes. As a critical step in the chip manufacturing processes, the etching process therefore faces great challenges. Dry etching (or plasma etching) process based on the low-temperature plasma science and technology is the preferred solution for etching the high-precision circuit pattern. In the low-temperature plasma, electrons obtain energy from the external electromagnetic field and transfer the energy to other particles through collision process. After a series of complex physical and chemical reactions, a large number of active particles such as electrons, ions, atoms and molecules in excited states, and radicals are finally generated, providing the material conditions for etching the substrate. Dry etching chamber is a nonlinear system with multiple space-time dimensions, multiple reaction levels and high complexity .
Facing such a complex system, only by fully understanding the basic physical and chemical reaction of the etching process can we optimize the process parameters and improve the etching conditions, so as to achieve precision machining of the semiconductor and meet the growing demand of the chip industry for etching rate and yield. In the early days, the process conditions of dry etching were determined through the trial-and-error method, which is characterized by high cost and low yield. However, with the help of plasma simulation, nowadays people have been able to narrow the scope of experiment to a large extent, and find out efficiently the optimal process conditions in a large number of parameters. In this review, we first introduce the basic theory of the mostly used models for plasma simulation including kinetic, fluid dynamic, hybrid and global models, in which the electron collision cross sections are the key input parameters. Since the formation of the low-temperature plasma is driven by the electron-heavy particle collision processes, and the active species for plasma etching are generated in the reactions induced by electron impact, the accuracy and completeness of the cross-section data greatly affect the reliability of the simulation results. Then, the theoretical and experimental methods of obtaining the cross-section data of etching gases are summarized. Finally, the research status of the electron collision cross sections of etching atoms and molecules is summarized, and the future research prospect is discussed.
Facing such a complex system, only by fully understanding the basic physical and chemical reaction of the etching process can we optimize the process parameters and improve the etching conditions, so as to achieve precision machining of the semiconductor and meet the growing demand of the chip industry for etching rate and yield. In the early days, the process conditions of dry etching were determined through the trial-and-error method, which is characterized by high cost and low yield. However, with the help of plasma simulation, nowadays people have been able to narrow the scope of experiment to a large extent, and find out efficiently the optimal process conditions in a large number of parameters. In this review, we first introduce the basic theory of the mostly used models for plasma simulation including kinetic, fluid dynamic, hybrid and global models, in which the electron collision cross sections are the key input parameters. Since the formation of the low-temperature plasma is driven by the electron-heavy particle collision processes, and the active species for plasma etching are generated in the reactions induced by electron impact, the accuracy and completeness of the cross-section data greatly affect the reliability of the simulation results. Then, the theoretical and experimental methods of obtaining the cross-section data of etching gases are summarized. Finally, the research status of the electron collision cross sections of etching atoms and molecules is summarized, and the future research prospect is discussed.
A bit of history about the drama in D.C. about semiconductor export controls to China.
Year 2002, 9-11 happened, Taliban "defeated", lord of the ring and some guys here learning to walk.
Some guys in D.C start becoming paranoid that the gap between China and the US is closing.
sound familiar?
That China goals is to become auto-sufficient.
Sound familiar?
Muh military
And the US should control what other countries sell in the Wassenaar agreement, because will be bad if US companies loose money to their competitors every time US deny a export license to a Chinese company.
Two decade ago.
Year 2002, 9-11 happened, Taliban "defeated", lord of the ring and some guys here learning to walk.
Some guys in D.C start becoming paranoid that the gap between China and the US is closing.
sound familiar?
That China goals is to become auto-sufficient.
Sound familiar?
Muh military
And the US should control what other countries sell in the Wassenaar agreement, because will be bad if US companies loose money to their competitors every time US deny a export license to a Chinese company.
Two decade ago.
They still goofed it up. China was not supposed to get the latest machine tools for semiconductors. I think the original goal was to keep China permanently two generations behind. And yet they almost sold EUV machines to China. If it wasn't for Trump (maybe with a little help from the CIA) it would have happened. The Western machine tool vendors just found the Chinese market irresistible and lobbied to drop the trade barriers.
The current effort to sabotage the Chinese semi industry with what are basically retroactive sanctions, which make machines China has already bought from them unserviceable is really crappy and shouldn't be allowed to happen. All this based on some artificial limit set by that government commission headed by Eric Schmidt which seems to think FinFET is some kind of magic amazing sauce (it isn't).
The current effort to sabotage the Chinese semi industry with what are basically retroactive sanctions, which make machines China has already bought from them unserviceable is really crappy and shouldn't be allowed to happen. All this based on some artificial limit set by that government commission headed by Eric Schmidt which seems to think FinFET is some kind of magic amazing sauce (it isn't).
Here they were probably referring to Veeco vs Aixtron MOCVD tool sales in China. Two decades ago China had no commercialized mocvd. Today amec is either the largest or second largest mocvd maker.
Quickie
Colonel
aptmind said:
----
Currently, Dutch company ASML is believed to still be providing such services to Chinese buyers. Per ASML’s financial report, during Q1, machine revenue from the Chinese market increased significantly from the previous quarter’s 39% to 49%.
---
This shows how far some of these mainstream media would spin the news out of context.
We have discussed this previously over here. The percentage increase in the Chinese market belies the fact that there was a 25% decrease in the quarter's Chinese revenue value (and a 50% value decrease in the rest of the market).
----
Currently, Dutch company ASML is believed to still be providing such services to Chinese buyers. Per ASML’s financial report, during Q1, machine revenue from the Chinese market increased significantly from the previous quarter’s 39% to 49%.
---
This shows how far some of these mainstream media would spin the news out of context.
We have discussed this previously over here. The percentage increase in the Chinese market belies the fact that there was a 25% decrease in the quarter's Chinese revenue value (and a 50% value decrease in the rest of the market).
Last edited:
Kangzhi 20Gbps automotive high-definition video transmission chip successfully lit up
Kangzhi Integrated Circuit (Shanghai) Co., Ltd. (hereinafter referred to as: Kangzhi) officially released its latest product - a 20Gbps automotive high-definition video transmission chip. The chip has been successfully lit and completed the first phase. Chip testing, the test results are consistent with simulation expectations.
This 20Gbps automotive-grade SerDes chip is based on the third-generation AHDL (Automotive High-Definition Link) protocol independently developed by Kangzhi. It uses a 22nm process and meets and exceeds IEC61000-4-2 ESD and national electromagnetic compatibility automotive regulatory requirements. The channel can achieve video transmission rates of 10Gbps (NRZ) and 20Gbps (PAM4), and can support up to 32 million pixel video transmission @30fps and 4K+ screen. Samples are expected to be available by the end of 2024.
Chip-level magnetic sensor supplier CMC Technology starts listing guidance
The China Securities Regulatory Commission recently disclosed the Guotai Junan Securities Co., Ltd.'s report on the initial public offering and listing guidance filing of Anhui Xici Technology Co., Ltd. (referred to as "Xici Technology").
According to the data, CMC Technology is a chip-level magnetic sensor manufacturing company based on TMR technology. The company has a R&D team of more than 40 people with returned PhDs and experts as the core, covering talents in TMR chip design, MEMS, magnetic circuit design, circuit design and other fields. The company insists on independent innovation and owns all intellectual property rights for the existing current sensors, magnetic recognition sensors, magnetic image recognition sensors, thickness detection sensors, gear sensors and other series of products. The products can be widely used in current detection, non-destructive testing, financial anti-counterfeiting, biological Medical, angular displacement detection and other fields.
CMC Technology invested in the construction of the "Sensor Microelectronic Chip Industry Project" in Bengbu, Anhui Province, acquired the German SENSITEC company as a wholly-owned subsidiary of CMC Technology, built a new TMR chip production line, carried out TMR chip production, increased production capacity, and added SMT 1 production line, adding equipment such as solder paste printing machine, placement machine, reflow soldering machine, and depanel machine. 2 new semiconductor production lines were added, and professional equipment such as crystal bonding machines, plasma cleaning machines, wire bonding machines, and customized dispensing machines were purchased.
According to the data, CMC Technology is a chip-level magnetic sensor manufacturing company based on TMR technology. The company has a R&D team of more than 40 people with returned PhDs and experts as the core, covering talents in TMR chip design, MEMS, magnetic circuit design, circuit design and other fields. The company insists on independent innovation and owns all intellectual property rights for the existing current sensors, magnetic recognition sensors, magnetic image recognition sensors, thickness detection sensors, gear sensors and other series of products. The products can be widely used in current detection, non-destructive testing, financial anti-counterfeiting, biological Medical, angular displacement detection and other fields.
CMC Technology invested in the construction of the "Sensor Microelectronic Chip Industry Project" in Bengbu, Anhui Province, acquired the German SENSITEC company as a wholly-owned subsidiary of CMC Technology, built a new TMR chip production line, carried out TMR chip production, increased production capacity, and added SMT 1 production line, adding equipment such as solder paste printing machine, placement machine, reflow soldering machine, and depanel machine. 2 new semiconductor production lines were added, and professional equipment such as crystal bonding machines, plasma cleaning machines, wire bonding machines, and customized dispensing machines were purchased.