I read some time ago that Gigadevice is able to offer multiple MCUs with the same ARM core chips with differing amounts of SRAM and Flash memory by placing these chips separate on the same package. You can basically get one ARM chip design license and one set of masks to make all the variants with different storage capacity. While STMicro basically has a different mask for each variant. This way Gigadevice is able to offer variants with more storage for the same price.
Chinese semiconductor thread II
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Accelerate silicon carbide research and development! Jingsheng Electromechanical expects net profit to increase by up to 70% year-on-year in 2023
Jingsheng Electromechanical released its 2023 performance forecast, stating that the net profit attributable to shareholders of listed companies in 2023 is expected to be approximately 4.385 billion yuan to 4.97 billion yuan, a year-on-year increase of 50% to 70%; after deducting non-recurring gains and losses, Net profit was 4.22 billion yuan to 4.705 billion yuan, a year-on-year increase of 50.36% to 71.70%.Jingsheng Electromechanical said that during the reporting period, the company focused on the dual-engine sustainable development strategy of "advanced materials and advanced equipment", continued to deepen the collaborative industrial layout of "equipment + materials", and built a three-dimensional business and product system with reasonable gradients. This business has achieved rapid development.
Jingsheng Electromechanical said that the company has strengthened R&D innovation, actively launched innovative photovoltaic equipment, and extended the layout of high-end equipment products in the semiconductor industry chain; accelerated the production capacity improvement of advanced materials business such as quartz crucibles, diamond wires, and silicon carbide; strengthened supply chain management, and created digital leanness manufacturing plants; vigorously explore the international market and improve organizational management capabilities; the company has achieved rapid year-on-year growth in operating performance.
Since 2017, Jingsheng Electromechanical has started research and development of SiC crystal growth equipment and processes, and has successfully developed 6-inch and 8-inch SiC crystals and substrate wafers. It is one of the few domestic companies that can supply 8-inch substrate wafers.
In terms of SiC equipment, on February 4, 2023, Jingsheng Electromechanical successfully released 6-inch dual-chip SiC epitaxial equipment. Compared with single-chip equipment, the new equipment's single-unit production capacity increases by 70%, and the single-chip operating cost can be reduced by more than 30%.
In terms of SiC materials, on November 4, 2023, Jingsheng Electromechanical’s “annual production capacity of 250,000 6-inch and 50,000 8-inch silicon carbide substrate projects” was officially signed and launched. The total investment in the contracted project reached 2.12 billion yuan.
On December 5, 2023, Jingsheng Electromechanical Research Minutes stated that the company has officially entered the mass production stage of the 6-inch SiC substrate project. On the 19th of the same month, Jingsheng Electromechanical stated on the investor interaction platform that the company's silicon carbide (SiC) growth equipment is self-developed and used for its own use, and SiC epitaxial equipment is sold externally. The profits of SiC substrates and epitaxial wafers are affected by factors such as their market prices and comprehensive costs. As the company continues to optimize its crystal growth and processing technology and cost control, it is expected that future profits will benefit from this.
Tuojing Technology expects net profit to increase by 62.84% year-on-year to 95.38% in 2023
Tuojing Technology released a performance forecast on the evening of January 22, 2024, stating that the net profit in 2023 is expected to be approximately 600 million to 720 million yuan, a year-on-year increase of 62.84% to 95.4%.
The company expects its annual performance in 2023 to increase significantly compared with the same period last year. The main reasons are as follows:
1. The company’s operating income increased by approximately 52.44% to 64.17% year-on-year, mainly due to the company’s continued high-intensity investment in research and development, breakthroughs in core technologies, and important results achieved in the process of promoting industrialization and iteratively upgrading various product series. The company has achieved remarkable results in new process application and new product development. PECVD equipment, ALD equipment, and SACVD equipment continue to expand processes, mass production scale continues to expand, and sales revenue increases significantly; HDPCVD equipment and hybrid bonding equipment performed well and passed the test successfully. Client industrial verification realizes industrial application. The company has been very effective in developing new customers. The coverage of customer groups has been further expanded and sales orders have continued to grow. At the end of 2023, the amount of sales orders on hand will exceed 6.4 billion yuan (excluding demo orders), providing guarantee for subsequent performance growth.
2. The company continues to increase investment in research and development, the field of industrial application continues to expand, the scale of operations grows rapidly, and the scale effect gradually emerges. The net profit attributable to the owners of the parent company and the net profit attributable to the owners of the parent company after deducting non-recurring gains and losses Significant year-on-year growth.
From the perspective of the industrial structure, overseas manufacturers occupy the main market for thin film deposition equipment, and there is broad room for domestic substitution of equipment.
Jiangsu Province key project, Xinsheng Semiconductor RF filter chip project started
On January 20, the groundbreaking ceremony for the Xinsheng Semiconductor RF filter chip project was held in Suzhou High-tech Zone. Advanced production lines for high-end semiconductor chip projects will be introduced and the Xinsheng Semiconductor headquarters will be built.
Xinsheng Semiconductor is a high-tech company specializing in the research, development, and manufacturing of semiconductor filter chips and radio frequency module products in the communications field. Its products are mainly used in the wireless communications terminal market.
According to news released by Suzhou High-tech Zone, Xinsheng Semiconductor has developed more than 30 products based on fully independent technological intellectual property rights and achieved market sales. The Xinsheng Semiconductor Headquarters project covers an area of 38 acres. It is a key project in Jiangsu Province. The total investment in the first phase is 670 million yuan. It will establish a vertically integrated high-end filter wafer factory and filter and RF front-end module packaging and testing production lines. The round factory will all produce filter products based on Xinsheng Semiconductor's own advanced technology. After the project is completed, it will achieve an annual output of 3.6 billion RF filter chips.
Xinsheng Semiconductor is a high-tech company specializing in the research, development, and manufacturing of semiconductor filter chips and radio frequency module products in the communications field. Its products are mainly used in the wireless communications terminal market.
According to news released by Suzhou High-tech Zone, Xinsheng Semiconductor has developed more than 30 products based on fully independent technological intellectual property rights and achieved market sales. The Xinsheng Semiconductor Headquarters project covers an area of 38 acres. It is a key project in Jiangsu Province. The total investment in the first phase is 670 million yuan. It will establish a vertically integrated high-end filter wafer factory and filter and RF front-end module packaging and testing production lines. The round factory will all produce filter products based on Xinsheng Semiconductor's own advanced technology. After the project is completed, it will achieve an annual output of 3.6 billion RF filter chips.
China’s chip equipment imports will increase by 14% to nearly US$40 billion in 2023
Looking at the graph, last year China fabs imported a record number of litho machines, more than 2 times of 2022. This should be enough for the whole 2024...while SMEE moves from pre-production to mass production...
Jiangling's "core" journey | New generation 5D wafer inspection equipment shipment, packaging and testing giant
Jiangling Technology (Shanghai) Co., Ltd.
On January 16, 2024, Jiangling Technology launched the world's leading 5D wafer inspection technology, once again reaching a new technological peak. Through strict technical verification by customers, it successfully delivered the innovative first HIMA series 5D wafer inspection equipment to China's sealing industry. Leading measurement company.
HIMA series equipment adopts multi-dimensional structured light detection technology ( MST technology), which can effectively suppress the impact of noise on the surface of an object and achieve high-precision and highly repeatable 3D measurement of bump height and coplanarity . At the same time, this technology can support high-speed parallel acquisition, parallel processing and transmission of multi-channel images, and perform topography construction and analysis through a unique 3D fusion algorithm, thus combining "high precision + high speed" 3D detection performance .
Jiangling Technology MST technology has the following characteristics :
High-precision measurement : With MST technology, 3D measurement with sub-micron level accuracy can be achieved. Through advanced optical systems, precise structured light control technology and unique 3D fusion algorithms, more accurate three-dimensional data can be obtained to achieve measurement of extremely small bumps as low as 5um in height.
Multiple reflection suppression : MST technology can effectively suppress multiple reflections on the surface of the target object, reducing the impact of reflection interference on the measurement results. By controlling the projection angle and collection range of light, MST technology can more accurately capture the characteristic data of the bump surface.
High-speed scanning processing : MST technology has extremely fast scanning speed and processing speed, and can quickly acquire and process a large amount of data in a short time, making the detection speed more than 50% higher than similar competing products.
Complete 3D and 2D measurements at the same time : Using MST technology, 3D and 2D measurement results can be obtained simultaneously in a single scan, without the need for multiple scans, which greatly improves measurement efficiency.
Adaptive function : MST technology has an adaptive function and can adapt to the measurement of different target surface materials and textures. Whether the target surface is shiny, dark or highly reflective, MST technology provides reliable measurement results.
High stability : MST technology has high adaptability and stability to changes in environmental conditions and external interference. The MST system can still work normally in complex environments where lighting changes, vibrations or other interference factors exist.
no, Honor and Huawei are completely separated... but Starlight-Xingyao is another departure...Veering off topic just a little bit for one post, the strangest thing I find in this whole episode of tech US government versus Huawei, was the sale of the Honor unit by Huawei.
It has only been like 2 to 3 years, and Huawei got the money from that deal, and now debuting roughly the same phones.
Can Honor sell itself back to Huawei? Do not think that will happen.
Someone is the big sucker here.
IIRC, some state entities on the provincial level were involved in that deal. Those comrades should not be promoted. Even Donald Trump would fire them.
