Two companies recently announced their transmission electron microscopes. China used to have a decent domestic TEM industry in the 60s and 70s which disappeared in the 90s due to various reasons. So now China has to start from scratch and basically relearn what it had achieved in the 60s and 70s.
Chinese semiconductor thread II
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Two companies recently announced their transmission electron microscopes. China used to have a decent domestic TEM industry in the 60s and 70s which disappeared in the 90s due to various reasons. So now China has to start from scratch and basically relearn what it had achieved in the 60s and 70s.
Also E-Beam lithography is some sort of lost art.
Chinese semiconductor industry
Chongqing Zhenbao Industrial Co., Ltd. is located in the Xipeng Development Zone, Jiulong Po, Chongqing City. It is a high-tech manufacturing enterprise established in February 2016. The company's registered capital is 89.47 million yuan. The first phase of the project has an investment of 200...
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China's first STM was developed so much earlier, in the late 80s.
Yunmai Xinlian completed a new round of 100 million yuan in financing
Shanghai Yunmai Xinlian Technology Co., Ltd. (referred to as "Yunmai Xinlian") completed a new round of financing worth 100 million yuan, jointly funded by Shanghai Pudong Innovation Investment Development (Group) Co., Ltd. and Shanghai Zhang Keyaokun Venture Partners Joint investment by investment partnerships (limited partnerships) will be mainly used to accelerate the research and development and large-scale application of core products.
Yunmai Xinlian is a leading provider of domestic network chips in the field of cloud data center and intelligent computing interconnection in China. The core team has more than 20 years of research and development experience in integrating high-end chips in the industry with cloud network infrastructure of first-tier Internet manufacturers. Since its establishment in 2021, Yunmai Xinlian has been adhering to technological innovation, taking the lead in the industry to break through the AI large model high-performance network core technology, supporting ultra-large-scale clusters, and self-developed chip-level congestion control algorithm programmable technology to provide enterprises with It provides flexible customization space, can meet the performance requirements of large-scale cluster training, and supports core functions such as I/O virtualization, network, and storage offload acceleration.
In terms of ecological construction, Yunmai Xinlian has completed adaptation with domestic mainstream GPUs, CPUs, servers, operating systems, etc., to provide users with a better and more convenient experience. At present, Yunmai Xinlian has launched the metaFusion series of DPUs for cloud computing and intelligent computing scenarios and the metaConnect series of smart network card products focusing on RDMA high-performance networks, and the market feedback has been excellent.
TEM is very important for R&D but IDK, is it necessary for fab operations? It's definitely not an inline process tool since it requires destructive sample preparation. Something like TXRF would be more directly related to semiconductors (yes I know China has that too now).
Pretty big deal. Transmission electron microscopes were listed as one of 35 choke point technologies by sci-tech daily in 2018.
Huahai Qingke 2023 performance forecast: full-year net profit rose 31.38% year-on-year to 54.31%
Huahai Qingke released a performance forecast, predicting that the attributable net profit for 2023 will be 659 million yuan to 774 million yuan, an increase of 31.38% to 54.31% year-on-year.
Huahai Qingke is the leading manufacturer of domestic CMP equipment. CMP equipment is a key equipment to achieve wafer surface planarization. With the evolution of the process, there is an increasing demand for CMP equipment. The main driving force comes from the device characteristic size (CD). Microminiaturization, multi-layer wiring introduced by technology upgrades and the emergence of some new materials. From the perspective of process coverage, the company's CMP equipment has achieved full coverage of all processes in the 28nm process and has been supplied in batches. Several key process CMP equipment in the 14nm process have been simultaneously verified on the client side. In addition to evolving to more advanced processes, the company is also actively exploring markets such as advanced packaging, large silicon wafers, and compound semiconductors.
During the reporting period, the company actively seized the market opportunities brought by the demand driven by the integrated circuit industry, continued to increase R&D investment and production capacity building, and enhanced the company's core competitiveness. The company's CMP products are one of the key process equipment for the front-end manufacturing of integrated circuits. First, market share and sales scale continue to increase; at the same time, the development of new businesses such as wafer regeneration, CDS and SDS has begun to show results, increasing the company's revenue and profit scale.