Chinese semiconductor thread II

[supersnoop]

Looks like they are having really trouble hiring people.

I dont know what job a 10 day training guy can do in a fab that cannot be automated and some of these guys have almost zero knowledge in Electric Engineering, fabrication tools parts maintenance, chemical and process control, I would understand hiring technicians or trading school graduates but my guess is that the training mostly includes "green light good, red light bad"

For example TSMC Dresden program is basically two months of training.

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And SMIC is basically 1-6 months,

I'm thinking a 10 day training program is probably just a extended screening process to make sure the people are:
1. Smart enough to handle a job
2. Not going to quit after a week because they don't like it
3. Not totally hooked on opioids that it will affect their job performance

The real training will probably be done by the company after hiring.

What I find crazy is that no one is saying this is a sign of trouble in the economy in the US, but definitely China is about to implode.

 

[proelite]

If they do massive tech layoffs this year I’ve got a backup plan. I may not be top notch but at least I’ve got legit clean room experience a decade ago, an EE degree from a highly ranked Engineering school, and operational experience of expensive equipment like electron microscopes. All of which beats burger flipping in my humble opinion.

I have an EE CS dual major, know semiconductor basic, and watched a bunch of Asianometry videos on semiconductors.

I think I can out-compete burger boys for a spot if needed.

 

[tokenanalyst]

I'm thinking a 10 day training program is probably just a extended screening process to make sure the people are:
1. Smart enough to handle a job
2. Not going to quit after a week because they don't like it
3. Not totally hooked on opioids that it will affect their job performance

Nope, in the article says after 10 days you are ready for work, that why i said that program is probably teaching "green light good, red light bad" "call the manager", I guess a good process supervisor needs at least know the process and the different components on it. A mass flow controller, valves, vacuum, the gases, plasma spectrum readings, electric frequencies, pressures and so on. Learning a superficial level of knowledge of fab processes, I would say that the training has to be at least 3 months or more and that would be a person with a vocational level of EE, process control or chemistry.​

 

[supersnoop]

Nope, in the article says after 10 days you are ready for work, that why i said that program is probably teaching "green light good, red light bad" "call the manager", I guess a good process supervisor needs at least know the process and the different components on it. A mass flow controller, valves, vacuum, the gases, plasma spectrum readings, electric frequencies, pressures and so on. Learning a superficial level of knowledge of fab processes, I would say that the training has to be at least 3 months or more and that would be a person with a vocational level of EE, process control or chemistry.​

It said "qualified pre-apprentice"

Also typical of crap Business Insider quality article (the website was started by a convicted fraudster, Henry Blodget), the course goes from 10 days to 10 weeks, it's not clear which is the correct one.

 

[tokenanalyst]

It said "qualified pre-apprentice"

Also typical of crap Business Insider quality article (the website was started by a convicted fraudster, Henry Blodget), the course goes from 10 days to 10 weeks, it's not clear which is the correct one.

10 Weeks is more acceptable.

 

[latenlazy]

Nope, in the article says after 10 days you are ready for work, that why i said that program is probably teaching "green light good, red light bad" "call the manager", I guess a good process supervisor needs at least know the process and the different components on it. A mass flow controller, valves, vacuum, the gases, plasma spectrum readings, electric frequencies, pressures and so on. Learning a superficial level of knowledge of fab processes, I would say that the training has to be at least 3 months or more and that would be a person with a vocational level of EE, process control or chemistry.​

Realistically actual training is probably a multi year process. They probably start you on the easy stuff and you matriculate into more complex parts of the workflow as you develop more experience.

 

[FairAndUnbiased]

Nope, in the article says after 10 days you are ready for work, that why i said that program is probably teaching "green light good, red light bad" "call the manager", I guess a good process supervisor needs at least know the process and the different components on it. A mass flow controller, valves, vacuum, the gases, plasma spectrum readings, electric frequencies, pressures and so on. Learning a superficial level of knowledge of fab processes, I would say that the training has to be at least 3 months or more and that would be a person with a vocational level of EE, process control or chemistry.​

I would not trust an engineer or senior technician without at least a BS in chemistry, physics, materials science or chemical engineering or an AS and 2 years of experience as a junior.

It is just too hard to fully explain and a BS holder has 2x the academic training time as a AS holder.

 

[tokenanalyst]

With a total investment of 500 million yuan, the R&D and production project of Shouxin Semiconductor Thin Film Deposition Equipment has been capped​

According to micronet news, recently, the topping-out ceremony of the main structure of the production plant of Jiangsu Shouxin Semiconductor Project was held.
According to information from CLP II, Jiangsu Shouxin’s semiconductor thin film deposition equipment R&D and production project is located in Jiangyin High-tech Zone, Wuxi. It is a headquarters base integrating the R&D, production and sales of high-end semiconductor front-end process thin film deposition equipment, with a total investment of 500 million yuan. , scheduled to be put into production in June 2024.
On October 12, 2023, Jiangsu Shouxin Semiconductor Thin Film Deposition Equipment Project held a groundbreaking ceremony in Jiangyin High-tech Zone.
Jiangsu Shouxin Semiconductor Technology Co., Ltd. was established in February 2023. Its main business is the research and development, production, sales and technical services of thin film deposition equipment. Its main products are chemical vapor deposition, physical vapor deposition, atomic layer deposition and other thin film deposition equipment. The company's products will be widely used in semiconductors, flat panel displays, new energy and other fields.

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[tokenanalyst]

Leading the forefront, Changdian Technology (JCET) breaks through 5G millimeter wave chip packaging module testing problems​

As a leading company in the field of chip packaging and testing, Changdian Technology has successfully broken through a series of challenges in 5G millimeter wave chip packaging module testing. With its advanced AiP antenna packaging technology and professional test platform laboratory, it provides 5G applications and ecological partners with innovative solutions.

As the core component of 5G millimeter wave equipment, millimeter wave chips place high demands on packaging and testing technology. Currently, more and more 5G millimeter wave devices use AiP antenna packaging technology to reduce system size and cost and improve radio frequency performance. Changdian Technology's AiP antenna packaging technology adopts advanced radio frequency design and optimization to ensure the stability and reliability of signal transmission.

AiP packaging technology not only improves signal transmission efficiency, but also greatly reduces signal loss, enabling efficient signal transmission in a very small package volume, which is crucial for miniaturization and performance optimization of device design. Changdian Technology's breakthrough test solution can comprehensively evaluate the performance of 5G millimeter wave chip packaging modules, accurately extract the characteristic parameters of packaging materials, and accurately measure frequency and bandwidth to ensure that it can operate stably in high-frequency and high-speed communication environments.

Overall, the testing of 5G millimeter wave chip packaging modules involves multiple key indicators:

Frequency: The requirement for high frequency requires the test process to deal with complex signal transmission and processing to ensure stability and reliability in the millimeter wave frequency band.

Bandwidth: Changdian Technology ensures the excellent performance of the module in a high-bandwidth environment through sophisticated testing methods and innovative technologies.

OTA (over-the-air): During the test process, attention needs to be paid to signal stability and coverage, which provides reliable technical support for practical applications.

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[tokenanalyst]

New breakthrough in devices! The team of Professor Chen Jing of Hong Kong University of Science and Technology successfully developed an experimental transistor that combines the advantages of gallium nitride and silicon carbide!​

Core Tip: This question prompted a team of 16 researchers from the Hong Kong University of Science and Technology and three other institutions in China to think continuously. After years of hard work, they finally succeeded in making a transistor they called a hybrid field-effect transistor (HyFET).



These silicon carbide crystals are almost always produced synthetically.
These are exciting times in power electronics. After decades of silicon dominance, two newer materials—silicon carbide and gallium nitride—have begun to capture a multibillion-dollar market. For example, silicon carbide is now the semiconductor of choice for electric vehicle inverters and chargers. If you've recently purchased a wall charger for your smartphone or laptop, chances are it's powered by gallium nitride.

New materials based on wide-bandgap semiconductors have many superior properties and are taking over the market for chargers and other power electronics applications. However, wide bandgap technology still has fundamental weaknesses. A big problem for silicon carbide transistors is the relatively low mobility of electrons in the channel, the area beneath the gate of the device through which current flows between the source and drain. This low mobility prevents SiC transistors from switching at high speeds. This in turn limits their efficiency in applications such as converting between alternating current and direct current. Gallium nitride transistors, on the other hand, have a property called "dynamic on-resistance," which means that when the device conducts current, the resistance of the device depends on the voltage—higher voltage means higher on-resistance. Another issue with GaN is that the physical size of the device and therefore its cost increases with its voltage blocking capability, which is not feasible for devices where the turn-on and turn-off voltages are expected to be many times higher than the internal voltage (e.g., a a major flaw for a typical computer).

What if GaN and SiC could be combined in a single device, minimizing each's shortcomings and maximizing their advantages? This question prompted a team of 16 researchers from the Hong Kong University of Science and Technology and three other institutions in China to ponder. After years of hard work, they finally succeeded in making a transistor they called a hybrid field-effect transistor (HyFET). They described their findings in a paper presented at the IEEE International Electronic Devices Conference in San Francisco in December.

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