Stop gaslighting. Nobody ever said that. People said there are domestic firms that can perform maintenance on the machines.Now the Under Secretary of Commerce for Industry and Security Alan Estevez has come to the Netherlands with the specific task of pressuring the Dutch to stop ASML to servicing their machines in China. This will happen the Dutch won't be able to resist this pressure.
Now people here are convinced that Chinese ASML machines will be fine without servicing. I hope you guys are right.
Two years ago the US banned their own companies from servicing US made equipment, the big three, KLA, LAM and AMAT. These machines should already be, how Alan put it? "ossified" but for some reason there is no indication that this has stopped Chinese fabs from producing and some of these machines,especially KLA machines are as complicate to service as ASML DUV scanners. What gives?Now the Under Secretary of Commerce for Industry and Security Alan Estevez has come to the Netherlands with the specific task of pressuring the Dutch to stop ASML to servicing their machines in China. This will happen the Dutch won't be able to resist this pressure.
Now people here are convinced that Chinese ASML machines will be fine without servicing. I hope you guys are right.
It's almost like technological industries are built around interdisciplinary ecosystems.
Overlap between precision machine tool industry and semi tool industry. Haozhi makes key components for machine tools and has recently started making grinding/thinning spindles for wafers.
Close collaboration between semi tool makers and machine tool makers in China. Naura uses this company’s ultrasonic machining tech to machine their hard/brittle components like glass and ceramic parts
So many questions - how is internal moisture managed with the vaporization of enough water to carry away MW level heat loads? how to manage corrosion? is this chip integrated, if so how is further packaging handled? etc etc.
New progress in adaptive microfluidic heat dissipation for microelectronics chipsThe team of researcher Jiao Binbin from the Microsystem Technology Laboratory of the New Technology Development Department of the Institute of Microelectronics has made new progress in the field of chip adaptive microfluidic heat dissipation. This study was inspired by the evaporation of sweat from animals through pores to enhance heat dissipation. Based on the bionic principle, a temperature-sensitive valve body structure and a working medium evaporation area were prepared in a silicon-based microfluidic cold plate. When the chip is working under extremely high power consumption conditions and its temperature rises sharply, the temperature-sensitive valve body opens and releases the cooling fluid to the evaporation area to achieve adaptive heat dissipation enhancement of the cold plate. This research provides a feasible heat dissipation method for adaptive microfluidic heat dissipation of high-power density chips.
As Moore's Law slows down, artificial intelligence and high-performance computing (HPC) chips are becoming increasingly popular. Currently, the power consumption level of a single chip has jumped from hundreds of watts to kilowatts. Under the trend of increasing integration and shrinking size, the average chip power density will reach 500W/cm 2 , posing severe challenges to heat dissipation and reliability. Microfluidic heat dissipation introduces cooling fluid into micro-nanoscale channels and quickly transfers chip heat through forced convection heat transfer. It is a new and efficient heat dissipation method. To meet reliability requirements, a constant thermal power threshold is often calculated based on the extreme high power consumption of the chip. However, the operating time under extreme power consumption conditions is less than 10%, which will lead to idleness and waste of cooling resources. Therefore, designing a method to adaptively adjust the heat dissipation power threshold based on the power consumption characteristics of high-power chips is of great significance to improve system energy efficiency.
This study proposes an adaptive dynamic threshold heat dissipation method to replace the traditional constant threshold heat dissipation method. When the chip is working in extremely high power consumption conditions, this method uses bionic sweating behavior to provide additional heat dissipation capability by sacrificing cooling fluid. The silicon-based microfluidic cold plate prepared by this method can achieve a fixed threshold through microchannel forced convection and a dynamic threshold through adaptive evaporation, and use the memory alloy temperature-sensitive valve body structure to control the opening and closing of "pores" and adjust the working fluid. "Evaporate sweat" in the evaporation zone to achieve dynamic regulation of the heat dissipation power threshold. Compared with the traditional microfluidic heat dissipation structure, this cold plate can not only meet the heat dissipation requirements of extremely high power consumption, but also effectively reduce the consumption of heat dissipation resources under normal power consumption, and all the energy required for the adaptive control process comes from the heat generated by the chip itself. , without consuming additional energy. Experiments show that under extreme chip power consumption conditions, adaptive evaporation can increase heat dissipation capacity by 80% and reduce junction temperature by 22.3°C. By further optimizing the hydrophilicity adjustment of the evaporation zone, liquid drainage control and phase change state control, the power density of the chip can be increased by 208W/cm 2 at the rated operating temperature .
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I imagine they could use a coolant like solutions like ethylene glycol with corrosion inhibitors.So many questions - how is internal moisture managed with the vaporization of enough water to carry away MW level heat loads? how to manage corrosion? is this chip integrated, if so how is further packaging handled? etc etc.