PE Ti and PE Co probably stand for plasma enhanced Ti and Co ALD. But this is also confusing because most metal ALDs are thermal not plasmaThe AMEC slides you posted mentioned they are designing PE Ti, PE Co MO TiN machine tools. PE likely means plasma etching.
So I think they are still developing new etching tools.
SMIC doubled the floorspace at their FinFET fab. This was discussed here. My guess is they already had purchased the equipment before the latest US sanctions kicked in.
There are still no reports of Chinese 28nm litho tools being in production use anywhere. But this is likely less of a problem than it used to be.
I think China should retaliate against attempts to renege on deals with regards to imported tool maintenance and spare parts supplies.
But this seems unlikely to happen.
Intel tried to do 5nm with DUV for many, many years, and failed. They had to bite the bullet and buy EUV machines earlier than they wanted to. If SMIC manages to do this they will have succeeded where Intel failed.
I think one of those US customers for SMIC used to be Qualcomm. Maybe Qualcomm needs to get in the Chinese blacklist similar to Micron since their chips have known backdoors in them.