Chinese semiconductor thread II

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gelgoog

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This is news from last December.

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"HP, aka Hewlett Packard, is one of the most well-known tech companies in the world. They produce nearly every product you can think of: laptops, desktops, printers, enterprise hardware, and solid-state drives.

For their SSD storage products, HP teamed up with BIWIN Storage, a large Chinese OEM for SSD solutions with 25 years of experience in the storage and microelectronics business. BIWIN were granted authorization from HP to produce SSDs in their name.
...
The HP FX700 is the first solid-state-drive we have tested that's built using QLC NAND flash from YMTC, in the new 232-layer variant, which is an impressive technological feat, because China's flash memory manufacturing has caught up with Micron and Hynix. For the controller the Maxiotech MAP1602 is used—we've seen it on several highly affordable drives recently. As expected, a DRAM cache chip is not included, just like on other MAP1602 drives, to reach the targeted price point."
 
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tokenanalyst

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Coating in the thermal field of semiconductor silicon single crystals​



The coated parts in semiconductor silicon single crystal hot field are generally coated by CVD method, including pyrolytic carbon coating, Silicon Carbide coating and Tantalum Carbide coating, each with different characteristics.

Common points: the substrate are high-purity isostatic graphite, generally less than 5ppm ash; coating are used CVD method; coating is basically 100% carbon or Silicon Carbide; after coating the surface is relatively dense, the gas, especially the furnace silicon vapor or silicon oxide gas can basically be blocked; its own dust volatilization is also very little.

Differences: the standard thickness of the coating, pyrolytic carbon coating is generally about 40um; Silicon Carbide coating is generally done about 100um, but according to the different needs of customers, can be done 30um~150um, including one coating and two coatings; tantalum carbide coating is generally 35±15um.

Pyrolytic carbon coating, its density is equivalent to that of non-porous graphite, which is about 2.2. It has low resistivity and high thermal conductivity in the parallel direction of the surface, so it can keep the consistency of the surface temperature, and it also has a low coefficient of thermal expansion and a high modulus of elasticity. In the perpendicular direction of the surface, the coefficient of thermal expansion is larger and the thermal conductivity is lower.

For Silicon Carbide coated products, the elastic modulus of the coating is very high, tens of times higher than the elastic modulus of the internal graphite substrate, so in order to avoid product rupture, it needs to be handled gently.

Pyrolytic carbon coating and Silicon Carbide coating of all the impurity content is less than 5ppm, where the main metal element content is less than 0.1 or 0.01ppm, the more difficult to deal with the boron element is 0.01 or 0.15ppm.

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tokenanalyst

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Silicon Carbide Heating Elements​


In the world of high-temperature heating, achieving precision and reliability in extreme conditions is paramount. To meet these challenges, innovative materials and designs have been developed to push the boundaries of what's possible. One such advancement is the Silicon Carbide (SiC) coated graphite heating element. SiC coated graphite heating elements represent a remarkable fusion of materials engineering and cutting-edge design. They are designed to excel in environments that demand high temperatures, resistance to corrosion, and the ability to withstand harsh gases and vacuums.

The growth of high-quality crystals plays a pivotal role in numerous scientific and industrial applications, ranging from semiconductor production to advanced materials research. Achieving crystal growth at high temperatures requires sophisticated equipment and materials, and one of the key components in this process is the SiC coated graphite heating element.

Crystal growth is the process of creating highly ordered, repeating atomic structures, known as crystals, from a liquid or gaseous precursor material. This meticulous process is governed by temperature, pressure, and the selection of suitable substrates and growth methods.

SiC coated graphite heating elements are the unsung heroes of crystal growth, enabling advancements in industries ranging from semiconductors to materials research. With their exceptional temperature capabilities, resistance to corrosion, and compatibility with diverse gases and high vacuum environments, these elements are pivotal in the creation of high-quality crystals. As technology and materials science continue to advance, SiC coated graphite heating elements will remain at the forefront of crystal growth, empowering innovation and discovery in countless applications.

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tokenanalyst

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Xinchi Technology’s automotive chips have shipped more than 3 million pieces in total​

2024 Xinchi Technology New Year Talk" was held in Beijing. Zhang Qiang, chairman of Xinchi Technology, shared the layout and mass production process of Xinchi's "all-scenario intelligent car core" , focusing on the three core application scenarios of smart cabin, smart driving, and smart control, Xinchi has obtained nearly 200 mass production appointments, and its customers cover more than 90% of domestic automotive OEMs, setting a record of cumulative mass production and shipment of more than 3 million pieces. Achievements, covering nearly 40 mainstream models.

Data from the China Association of Automobile Manufacturers shows that the sales volume of self-owned brand passenger cars in 2023 will reach 14.596 million units, an increase of 24.1% from the same period last year, and the market share will rise to 56%, an increase of 6.1 percentage points from the previous year. Xinchi Technology has contributed innovative power to the rapid development of independent brands . According to Xinchi Technology, among the top 15 self-owned brand SUV best-selling cars in 2023, 40% of the models are equipped with Xinchi products; the top 3 in the medium and large SUV field All mass-produced models are equipped with Xinchi cores.

Moreover , the Xinchi X9 cabin series has become the mainstream choice for China's car-grade smart cockpit chips, with dozens of blockbuster designated models. In April 2023, Xinchi released the latest generation smart cockpit chip X9SP, a new member of the X9 series family. As a full-scenario cockpit processor for future mainstream smart cockpit applications, its CPU, GPU and AI computing power have been greatly improved, and it has rich capabilities. Application scenarios enable one chip to cover all functions of future smart cockpits.

Looking forward to 2024, Xinchi will also launch a number of innovative products such as next-generation integrated cabin and driver chips and next-generation high-performance MCUs for regional controllers.

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tokenanalyst

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Maike Technology's "High Aspect Ratio Glass Through-Hole Laser Efficient Manufacturing Technology R&D and Industrialization" project was approved as a national key R&D plan project​


Key R&D plan "Additive Manufacturing and Laser Manufacturing". The national key R&D plan is led by Chengdu Maike Technology Co., Ltd. and participated by Wuhan Dier Laser Technology Co., Ltd. The technology-based small and medium-sized enterprise project "Research and Industrialization of High Aspect Ratio Glass Through-hole Laser Efficient Manufacturing Technology" (Project No.: 2023YFB4606800) was approved. The project leader is Professor Zhang Jihua, founder and chairman of Maike Technology. The approval of this project marks that Maike Technology represents the national level in TGV ultra-fine aperture research and development, and fully highlights the advancement and engineering feasibility of Maike Technology in TGV3.0 equipment development and process level.

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In January 2022, the Ministry of Science and Technology issued the "Notice on Creating a Better Environment to Support the Research and Development of Technology-based Small and Medium-sized Enterprises". Among the key projects of the National Key R&D Plan, a certain budget will be separately allocated to fund the research and development activities of technology-based small and medium-sized enterprises to accurately support qualified technologies. Small and medium-sized enterprises undertake national scientific and technological tasks, carry out research on key core technologies, guide innovation elements to gather in enterprises, and accelerate the cultivation of a group of "four subjects" with obvious characteristics such as strong R&D capabilities, high technical level, intensive scientific and technological talents, and the ability to form core technology products. Technology-based small and medium-sized enterprises.In response to the urgent need for efficient manufacturing technology of high aspect ratio glass through-holes for three-dimensional packaging of integrated circuits, this project carries out R&D and industrialization research on high aspect ratio TGV laser efficient manufacturing technology, and promotes the development of China's integrated circuits from the one-sided pursuit of characteristic line width to system integration. , balance and narrow the manufacturing generation gap, and lay the equipment and technical foundation for China's integrated circuit packaging technology to change lanes and overtake.

Maike Technology is an enterprise that transforms the achievements of the University of Electronic Science and Technology of China, a national high-tech enterprise, a "specialized, special and innovative" small and medium-sized enterprise in Sichuan Province, and the leading unit of the national key R&D plan project. It was the first in the industry to propose TGV3.0, breaking through sub-10 micron through-hole and filling technology for the first time, and was identified as overall internationally advanced. It is the advocate and leader of domestic TGV technology. Focusing on advanced packaging solutions such as glass-based three-dimensional integrated substrates, 3D glass and chiplet three-dimensional integration, it can provide substrate materials and integration technologies for 3D-SIP, integrated passive devices IPD, folding screens, Micro LED, and microfluidics. It has been established The TGV three-dimensional packaging pilot platform (Triassic (Guangdong) Technology Co., Ltd.) was launched and became an advanced packaging base with significant characteristics and advantages.

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