Chinese semiconductor thread II

[tokenanalyst]

Yingjie Electric: In terms of RF power supply models, the company is currently actively promoting research and development, with the goal of achieving a comprehensive breakthrough within this year.​

Yingjie Electric stated at an investor relations event that through previous exchanges, everyone also learned that the company’s radio frequency power supply has already achieved import substitution and volume for some models of semiconductor equipment. Production will begin in September 2023 and will begin to be supplied to major customers in batches, and cooperation with major customers will continue to deepen. The company now has a professional high-level clean workshop for radio frequency power supply. The original one production line has been upgraded to three production lines, and the production capacity is gradually expanding. Looking back at the history of radio frequency power supply research and development, the company's cooperation with major customers began 3-4 years ago. Therefore, the company is not an opportunist. It saw this market opportunity earlier. Under the severe situation of foreign supply restrictions, the company The research and development progress is also accelerating. The company's team worked very hard and quickly achieved a breakthrough in the research and development of one of the important models, which is now available in batches. In terms of RF power supply models, there are more models. The company is currently actively promoting research and development, with the goal of achieving a comprehensive breakthrough within this year. It can be said that the company started from scratch in this industry. The current R&D breakthroughs achieved by the company are inseparable from the R&D support given by customers to the company. At the same time, the company has accumulated experience in the application of power technology platforms built over decades and a large number of industrial power application fields. The technical analysis solution has provided great help to the company's breakthrough in the radio frequency power industry.

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[tokenanalyst]

Million Euro investment in Chemical Semiconductor Manufacturing Co., Ltd., Heraeus targets diamond materials​

On March 21, Chemical Semiconductor Manufacturing Co., Ltd. (Xiamen) Semiconductor Technology Co., Ltd. (hereinafter referred to as: Chemical Semiconductor Manufacturing Co., Ltd.) officially announced that the company has recently received strategic investment from the Heraeus Group. At the same time, members of the Heraeus Group Management Committee and global semiconductor and electronics businesses Dr. Steffen Metzger, head of the platform, will serve as a director of Chemical Semiconductor Manufacturing Co., Ltd.

Is reported that the Heraeus Group is a world-renowned family business and technology company with diversified businesses. It is mainly active in four major business areas: precious metals and recycling, semiconductors and electronics, medical health, and industrial applications. This investment is the Heraeus Group's first strategic investment in a start-up company in mainland China. The financing funds will be used for the construction of large-size polycrystalline diamond mass production lines and the research and development of new products.

According to the official website information, Chemical Semiconductor Manufacturing Co., Ltd. is a high-tech enterprise focusing on the research, development, production and sales of wide bandgap semiconductor substrate materials and devices. Its core products include polycrystalline diamond (wafer-level diamond, diamond heat sink, diamond windows, diamond-based heterogeneous integrated composite substrates), single crystal diamond (thermal grade, optical grade, electronic grade) and aluminum nitride films, etc., mainly used in aerospace, power electronics, optical communications, new energy photovoltaics, new Energy vehicles, sensors, Al, IGBT, high-speed rail and other fields.

Diamond has ultra-high thermal conductivity and can help power electronic devices, power devices, and radio frequency devices achieve high density, miniaturization, and lightweight in high-temperature, high-frequency, high-power and other scenarios;

Diamond has high breakdown field strength and high carrier mobility, which can significantly reduce losses, quickly dissipate heat and extend device life;

Diamond is a superhard material with a small friction coefficient and strong chemical stability. It can remain stable in extreme and harsh environments and has important applications in high-tech fields;

Diamond has excellent optical properties, with good transmittance in all wavebands from X-rays, deep ultraviolet to microwaves, and can be used to prepare high-performance optical components.

Regarding this strategic investment in Chemical Semiconductor Manufacturing Co., Ltd., Dr. Steffen Metzger said: "Heraeus continues to invest in start-ups with leading materials technology. On this basis, this cooperation also highlights the group's strategic focus on the semiconductor market. With the help of Chemical Semiconductor Manufacturing Co., Ltd. "With Semiconductor Manufacturing Company's superior wafer-level diamond technology, we are expected to set new standards in the industry, accelerate the development of artificial intelligence and cloud computing, and revolutionize the inverter architecture of electric vehicles."​

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[interestedseal]

Just digging this up again because it seems like this guy is somewhat accurate. I heard Bytedance is placing huge GPU order with Huawei. We know about Baidu already. Alibaba isn't a surprise either.

The part about new TSV200 core may already have been validated by that toms hardware article (who called it a new TSV120, which is likely not the right name since TSV120 is the one used on current generation kunpeng)

Again, HBM3 is the limiting factor right now

Expect N+2B this year for Mate70's SoC - TSMC N6 level

expecting huge sales with this chip and Mate 70 and X6

Now waiting for Kirin 7 line of SoC for Enjoy series to further validate his credibility. But very interesting stuff

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Here is the complete screenshot of this tensorunit guy. A lot of wild claims like euv N5 in 2025.

 

[tokenanalyst]

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Here is the complete screenshot of this tensorunit guy. A lot of wild claims like euv N5 in 2025.

I got all confused with the cartoon characters until I scrolled down.

 

[henrik]

they basically talked about Photoresist and materials ... China almost caught up Japan in this sector. same happened in OLED materials and supply chain like ink jet printer ... China decisively broke Japan monopoly ..

anything come from western media is garbage and they deliberately change actual statement just to degrade China.. West cannot accept that, China is now technological capable to produce any machine or material ..

Any recommendation of Chinese brands for consumer laser printers?

 

[tphuang]

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Here is the complete screenshot of this tensorunit guy. A lot of wild claims like euv N5 in 2025.

that actually is quite plausible based on what we've seen. Both @latenlazy and I think they will have prototype unit at SMIC next year to start test and validation of EUV process. I'm more unconvinced of his claim of CFET. That seems really far fetched

 

[sunnymaxi]

I'm more unconvinced of his claim of CFET. That seems really far fetched

what other things required for CEFT process. by 2026 EUV prototype will be in full scale testing .. you meant there is not enough R&D for CFET process yet ? i think we have seen some Chinese institutes exploring this tech ..

 

[staplez]

that actually is quite plausible based on what we've seen. Both @latenlazy and I think they will have prototype unit at SMIC next year to start test and validation of EUV process. I'm more unconvinced of his claim of CFET. That seems really far fetched

Well, in fairness he was very confident about EUV, but only said CFET is likely by 2026.

What I'm more surprised about is his claim that Huawei Ascend 920 is going to be H100 levels as well as to be made on N+2 and not N+3. Kind of strange that they can get that performance without going to 5nm.

 

[curiouscat]

Well, in fairness he was very confident about EUV, but only said CFET is likely by 2026.

What I'm more surprised about is his claim that Huawei Ascend 920 is going to be H100 levels as well as to be made on N+2 and not N+3. Kind of strange that they can get that performance without going to 5nm.

Could be it would have the same performance with way higher power consumption.

 

[tphuang]

Well, in fairness he was very confident about EUV, but only said CFET is likely by 2026.

What I'm more surprised about is his claim that Huawei Ascend 920 is going to be H100 levels as well as to be made on N+2 and not N+3. Kind of strange that they can get that performance without going to 5nm.

N+2B he said, which is expected to be N6 performance. that seems reasonable expectation. It is not unreasonable to assume that Ascend 920 might achieve something close to H100 in performance. After all, 910 has been around for 4 years. Having something that 2x/3x its performance should be not so difficult.

The big issue with 910B is the chip-to-chip interconnect speed. That's apparently it's weakness vs H20. So they need to fix that up. That would require improve serdes chip technology as well as PHY chip & they need to get enough supply of HBM3