Chinese semiconductor thread II
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To the experts what is a "brute force" method? And if effective why don't other leading FAB producer used this method?
57 minutes ago — Huawei Technologies Co. and a secretive chipmaking partner in China have filed patents for a low-tech but potentially effective way to make ...
57 minutes ago — Huawei Technologies Co. and a secretive chipmaking partner in China have filed patents for a low-tech but potentially effective way to make ...
broadsword
Brigadier
The other fabs, non-Chinese, can get EUV machines?
Given Bloomberg’s track record with semiconductor tech the writer probably thought that China used microscopic fairies to carve the patterns manually.
there is nothing secretive about SAQP. If SMIC can actually proficient do SAQP throughout its entire process, then it will be able to make N5 level chips without using EUV. But none of this is easy. These articles are written by people and are also interviewing people without industry knowledge. So, they are not helpful at all.
NAURA is launching new 12-inch products for logic and DRAM market.
Has Scaler HK430 in mass production for CVD
Also launching etching equipment PSE V300 and have received validation with many 12-inch fabs. It is the main machine for TSV mass production. Can be expanded to be used in CIS power modules and such.
looks like German firm PVA TePla is looking to grow their SiC growth business in China by building a factory in China for its production. I think the Chinese options for this come from NAURA and crystal growth.
Machine is called SICN
Not saying this is necessarily a good thing. SiC production is growing in China and Chinese SMEs may or may not benefit from additional competition.
Machine is called SICN
Not saying this is necessarily a good thing. SiC production is growing in China and Chinese SMEs may or may not benefit from additional competition.
Semiconductor diamond wire slicer exported to Europe for the first time!
Recently, Gaoche Technology Co., Ltd. signed a new order for its 8-inch semiconductor diamond wire slicer. After the equipment is delivered, it will be shipped to a European semiconductor company. This is the first overseas customer for the company's semiconductor equipment.
The customer of this cooperation is the largest local monocrystalline silicon plate manufacturer and one of the leading manufacturers of ultraviolet medical equipment and LED equipment. Gaoche will provide it with an 8-inch semiconductor diamond wire slicer with leading performance and stable quality parameters . , small loss of silicon material, high cutting efficiency, low other advantages, helping customers reduce costs and increase efficiency.
As early as 2018, Gaoche Co., Ltd. began to lay out the technology exploration and research and development of semiconductor equipment, and officially introduced diamond wire cutting into the field of semiconductor silicon materials. At present, the company's products developed for the semiconductor industry mainly include: semiconductor single wire cutting machines, semiconductor diamond wire slicing machines, semiconductor grinding machines, semiconductor special diamond wires and chamfering grinding wheels, spheronizing grinding wheels and thinning grinding wheels. By providing the industry with full-category solutions of "cutting equipment, cutting consumables, and cutting processes", we promote the development and innovation of the semiconductor industry. Up to now, the company has formed a sustained and stable cooperation with leading customers in the industry. Both semiconductor slicing machines and cutting machines have been sold in batches, basically covering the demand for new semiconductor diamond wire slicing production capacity.
Next, Gaoche will continue to leverage its professional and technical advantages in the field of cutting highly hard and brittle materials to provide the industry with more reliable and advanced semiconductor cutting solutions, help customers reduce costs and increase efficiency, and promote the localization of semiconductor equipment.
by the way, I think the bigger deal here is that Huawei through SiCarrier is pushing ahead in its goal of advanced chipmaking. IIRC, SMIC had its patent/research on 5nm in DUVi back in 2022. Huawei is likely progressing very faster here since according to hvpc, it already figured out 28nm and is looking to qualify domestic equipment for 14nm. Maybe it's getting closer there or ready for limited production. The next step is getting into 7nm and researching into 5nm.
If Huawei can do its own 7-14nm, then that will free up a lot more capacity at SMIC