Eilenx 16nm SiP FPGA
Eilensil (Elitestek) has launched a new lineup of System-in-Package (SiP) FPGA products based on its mature 16nm Titanium Series, designed to address growing engineering challenges in embedded vision, edge computing, and smart devices where rising compute demands clash with tight constraints on board space, power, and supply chain complexity. By integrating FPGAs with memory (DRAM, HyperRAM, Flash) into a single compact package, these SiP solutions eliminate complex board-level storage wiring, shorten interconnect paths for higher-speed data transfer, and significantly reduce PCB footprint delivering smaller, higher-performance, and simpler-to-design systems.
The product matrix includes five tailored offerings: the Ti125M225 (8×8mm, with SPI Flash + dual HyperRAM) for IoT and robotics; the TJ135D576SX (16×16mm, 2Gb LPDDR4x + 16Gbps SerDes) for video processing and automotive ADAS; the TJ180A484S (15×15mm, 176K logic cells + LPDDR4x) balancing performance and power for visual systems; the ultra-compact Ti60F100S3F2 (5.5×5.5mm, HyperRAM + SPI Flash) for multi-sensor and thermal imaging applications; and the FL60 (12×12mm, DDR3L-integrated) for AIoT and mobile edge devices. Key advantages across the lineup include SEU error correction, support for high-speed interfaces (MIPI, LVDS, PCIe Gen4, 10GbE), ultra-low power consumption (1–2W), and built-in security and reliability features.
