Recently, Jiwei.com learned that Shanghai Yibo Semiconductor Co., Ltd. has successfully developed a new chiplet packaging technology that is the first in China and has an industry-leading level based on its own patents. To find out more, Jiweiwang made a special trip to the headquarters of IB Semiconductor located in the Robot Industrial Park in Baoshan District, Shanghai, and conducted an exclusive interview immediately.
Dr. Li Wenqi, Vice President of IB Semiconductor, said that the new chiplet packaging technology launched by IB Semiconductor this time was not achieved overnight, but a long-term process of accumulation. The founding team has been paying close attention to the development trends of integrated circuit technology since 2019, and has a deep understanding that as Moore's Law slows down, the importance of advanced packaging will increase day by day. In the post-Moore era, the characteristic size of chips has approached the physical limit, and its complexity and development and manufacturing costs have become constraints for the chip to continue to improve performance and yield. Advanced packaging technology integrates multiple chips heterogeneously into a high-density package. In vivo is the only way to further improve chip performance.
"Since its establishment, IB Semiconductor has fully invested in the research and development of multi-chip integrated packaging technology. In particular, it has proposed and developed a series of solutions for the pain points and difficulties in packaging design and manufacturing, and has applied for more than 110 applications in major packaging technology countries and regions. Invention patents, 45 of which have been authorized, have basically completed the strategic layout of core intellectual property rights in the advanced packaging field." Dr. Li Wenqi said, "The two breakthrough 2.5D Chiplet packaging technologies COORS-R and COORS-R launched by Yibo this time are COORS-V was successfully developed on its own R&D and production lines based on several of its own core patents and owns all intellectual property rights."
It is reported that several of IB Semiconductor's advanced packaging core patented technologies have been evaluated by an authoritative third-party technology review agency and concluded that "a number of design and process technology indicators have reached domestic leading and internationally advanced levels, filling the domestic gap." Dr. Li Wenqi pointed out that the domestic advanced packaging industry as a whole is still in its early stages of development, focusing on following and imitating and striving to catch up with international standards. However, in the current context of increasingly fierce international technology competition and the rapid development of large-scale artificial intelligence, domestic high-computing chip companies have an urgent need for advanced packaging technology, especially 2.5D Chiplet packaging technology. The two packaging technologies COORS-R and COOR-V launched by Yibo can be said to have emerged at the right time, providing one-stop service solutions from packaging design, simulation, development to mass production for high computing power chips.
