Chinese semiconductor thread II

tokenanalyst

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After a decade of dedicated development, Zhixin has completed its Pre-A round of financing, accelerating the large-scale application of MEMS micromirror arrays in the field of optical interconnects for AI data centers.​


Suzhou Zhixin Sensing Technology has successfully completed its Pre-A round of financing, attracting investors such as iFlytek Venture Capital and Suzhou Venture Capital. The capital raised will be strategically directed toward expanding production capacity for MEMS micromirror arrays, advancing next-generation research, and strengthening the company's market dominance in critical optical interconnect components for AI data centers.

Driven by surging demands from AI and cloud computing, traditional electrical switching architectures are facing significant bottlenecks regarding bandwidth, power consumption, and latency. In response, Optical Connectivity Systems (OCS) utilizing MEMS micromirror arrays have emerged as the industry-standard solution. These devices offer superior performance with millisecond response speeds, low insertion loss below 1dB, and high integration, making them ideal for building efficient, flexible optical networks in modern data centers.

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Zhixin has pioneered domestic mass production of these components, achieving a stable yield over 90% at significantly lower costs than imported alternatives due to robust supply chain control. Currently supplying leading industry customers, the company's existing 300×300 and 320×320 mirror specifications meet current medium-to-large data center needs. Looking ahead, Zhixin plans to scale up to 1024×1024 ports to handle the massive routing demands of future intelligent computing centers while maintaining an energy efficiency advantage of approximately 40% over traditional electrical solutions by enabling direct optical signal routing.
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As the global OCS market is projected to exceed $10 billion by 2030, Zhixin is positioned to capitalize on a crucial development window driven by domestic infrastructure expansion and supply chain self-sufficiency initiatives. By continuing to invest heavily in R&D and deepening industry collaborations, the company aims not only to secure its role as a core component supplier but also to promote the global transition toward more efficient, green, and intelligent optical network infrastructures.

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tokenanalyst

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Sanan Optical Communication breaks through three major barriers! High-end optical chips accelerate their entry into the new blue ocean of AI and automobiles.​


Amidst surging demand for AI computing power and the shift toward high-speed data standards (800G/1.6T), Sanan Optoelectronics has achieved simultaneous breakthroughs in three key areas: high-speed optical chips, overseas market expansion, and automotive optical communication. These milestones mark a significant shift from domestic substitution to global leadership, addressing the long-standing supply-demand gap where international giants like Coherent and Lumentum previously dominated.

The company successfully launched its 100G Electro-Absorption Modulator (EML) chip, compatible with mainstream 800G optical modules. This represents full self-sufficiency from design to manufacturing, offering a critical domestic alternative for next-generation AI networks.

Sanan's Continuous Wave (CW) light source products have received certification from leading international customers. These products cover essential power specifications (70mW/100mW) required for optical modules ranging from 400G to 1.6T, proving their ability to compete with established foreign manufacturers.

Leveraging the needs of autonomous driving, Sanan has entered the automotive market by developing specialized chips that meet rigorous environmental and reliability standards. The company has also secured strategic partnerships in the wide-temperature VCSEL & PD industry chain.

With mass production capabilities for high-speed digital photoelectric sensors (PDs) and a pipeline ready for large-scale delivery of its optical solutions, Sanan's progress signifies a move from the "layout phase" to the "harvest phase." This development underscores the critical importance of domestic optical chips in supporting both AI infrastructure growth and the rising bandwidth demands of intelligent transportation.

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tokenanalyst

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Shandong Liguan has achieved a significant breakthrough in the field of 8-inch gallium oxide HVPE epitaxial equipment.​

In April 2026, Shandong Liguan Microelectronics Equipment Co., Ltd. achieved a significant technological breakthrough in the field of gallium oxide HVPE epitaxial equipment.

In this breakthrough, Shandong Liguan's professional doctoral process technology team successfully verified the uniformity of film thickness and surface morphology in gallium oxide HVPE epitaxial growth using an 8-inch sapphire substrate. Test results showed that the film thickness exceeded 20 μm, with a thickness uniformity (based on maximum deviation) better than 20%, and the best batch uniformity reaching within 5%, comparable to the epitaxial level of 4-inch HVPE equipment; the growth rate remained stable at 10~20 μm/h; and the heteroepitaxial morphology uniformity on the sapphire substrate was excellent. These data fully demonstrate that the 8-inch HVPE epitaxial growth process possesses excellent controllability and consistency.

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tphuang

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成都芯谷园区企业成都华微电子科技股份有限公司近日发布全球首款10位128GSPS单芯片超高速ADC芯片,打破国外垄断、填补国内空白。

据悉,该芯片每秒可完成1280亿次采样,能在极宽频带内精准捕获信号,确保转换后的数字信息不丢失、不失真。

“这款芯片是我们全自主正向设计的成果,从整体架构到多通道非线性校正算法,均拥有多项突破性专利。同时,采用国内成熟的28nm先进工艺,从设计到制造完全摆脱对外技术依赖。”手持这款封装尺寸仅26mm×24mm的“超级芯片”,成都华微相关负责人介绍。
this came out last month. Again, very important since CSMT's product now cover 8 GSPS to 128 GSPS. Uses mature 28nm process.

What is the number of layers mean and how does it compare to those from south korea?
more layers, higher speed. HBM3E is 12-layers everywhere.
 

tphuang

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中科四点零科技 launches New Dual-Form-Factor N2x20 Series. Operates product covering 10 MHz to 20 GHz

With its wide frequency coverage, high dynamic range, and dual USB/PXIe form-factor design, the N2x20 series of modular vector network analyzers offers a solution that combines both performance and flexibility for high-frequency testing scenarios—such as those found in 5G communications and satellite internet applications. By integrating the concurrently released PXIe-1011 chassis, PXIe-88C0 controller, and RC series electronic calibration units, Zhongke 4.0 has established a comprehensive high-frequency testing ecosystem—spanning everything from core measurement instrumentation and system support to standard accessories. We are committed to continuous optimization; please feel free to contact us for further details.
All of this seem related. supporting high end network analyzers which are critical for 5G and satellite internet apps.
 

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Southchip launches new generation fully integrated, dual-input, bidirectional synchronous buck-boost charging chip: the SC8984. it supports a wide output voltage range of 3V–22V and an output current of up to 5A. The chip features specific efficiency optimizations tailored for 2-to-4-series lithium-ion battery applications.
 
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