Huahai Qingke: The 1000th CMP equipment has officially rolled off the production line.
Huahai Qingke (688120.SH) announced that its 1,000th CMP (Chemical Mechanical Polishing) machine was recently shipped to a leading domestic integrated circuit company. Currently, the company's CMP equipment has been mass-produced and deployed on advanced domestic production lines, with some core technical indicators surpassing international advanced levels. As a core process for achieving nanometer-level surface flatness control, CMP's application scenarios and process requirements are continuously expanding in advanced logic, advanced memory, and advanced packaging fields.
From breaking the monopoly to maintaining a leading position
Since launching China's first commercial 12-inch CMP equipment, breaking the long-standing monopoly of international giants, Huahai Qingke has been committed to providing key equipment support for the security of my country's integrated circuit industry chain. Huahai Qingke's domestic market share has rapidly surpassed that of international giants and continues to expand its leading advantage. This achievement stems from the continuous improvement of product performance and the accumulation of a strong reputation. Huahai Qingke has demonstrated the competitiveness of domestically produced high-end equipment with solid data.
In terms of application areas, Huahai Qingke's CMP equipment has achieved comprehensive coverage and is widely used in fields such as integrated circuits, power semiconductors, 3D integration and advanced packaging, compound semiconductors, new displays, and substrate materials. It has successfully achieved extensive coverage of domestic integrated circuit manufacturing production lines and serves global customers.
From mature processes to high-end breakthroughs
Starting with achieving domestic substitution and serving mature processes, Huahai Qingke relies on continuous series iterations and independent innovation. The company's products have not only entered the domestic advanced process production lines in batches, but have also successfully surpassed the international advanced level in some core technologies, completing a key leap from keeping pace to leading the way.
The company's continuous improvement in technological capabilities stems from its long-term commitment to innovation and R&D and its unwavering pursuit of independent control over core technologies. Huahai Qingke has established a core independent intellectual property system covering CMP equipment, providing solid support for the continuous advancement of process nodes. Huahai Qingke is using independent innovation to overcome bottlenecks and inject core momentum into industrial upgrading.
From single-point breakthroughs to coordinated development
Following its significant success in the CMP equipment field, Huahai Qingke is extending its technological capabilities to more key process stages. The company has successfully expanded into a series of high-end semiconductor equipment, including thinning equipment, ion implantation equipment, scribing equipment, edge polishing equipment, and wet processing equipment. Simultaneously, it has also developed businesses in wafer regeneration, key consumables, and maintenance services, building a platform-based development strategy of "equipment + services." The synergistic effects of this strategy are rapidly unfolding, driving other equipment and service businesses into a phase of rapid development. In the future, the company will continue to empower integrated circuit manufacturing lines through a diversified product portfolio and integrated service capabilities, providing customers with more efficient and complete system solutions.
Future emerging demand will drive growth
Currently, the rapid development of cutting-edge fields such as artificial intelligence and high-performance computing is placing higher demands on chip performance and integration, making nanoscale surface control capabilities crucial for process development. The more advanced the chip, the higher the requirements for flatness, CMP (Chip Motion Processing) has become a key support for advanced manufacturing-whether it's advanced logic, advanced memory, or advanced packaging, the process steps and technical difficulty of CMP are continuously increasing. Leveraging its extensive experience in the CMP field, Huahai Qingke has made forward-looking strategic deployments, forming complete solutions covering key process stages, and is ushering in new development opportunities driven by both industrial upgrading and expanding demand.
Huahai Qingke consistently upholds the corporate spirit of "Self-reliance Achieves Excellence, Innovation Shapes the Future," facing the forefront of global science and technology, adhering to integrity and innovation, continuously strengthening the foundation of semiconductor industry equipment, and contributing to the security, reliability, and independent control of the industrial chain. In the future, the company will continue to prioritize meeting major national needs, further increase R&D investment, continuously improve and enrich its product portfolio, and work hand in hand with upstream and downstream partners to jointly promote the sustainable and high-quality development of the semiconductor industry.
