Chinese semiconductor thread II

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Biwin Storage's revenue is projected to reach 11.3 billion yuan in 2025, with net profit increasing by 429% year-on-year!​

Biwin Storage reported outstanding financial results for 2025, with operating revenue reaching 11.3 billion yuan, marking a significant year-on-year growth of 68.82%. The company's net profit attributable to shareholders surged by 429%, rising to RMB 853 million, while its core business profit after non-recurring items jumped even higher at 1072.25%. Capitalizing on the storage industry's upward trend and the AI revolution, Biwin Storage successfully expanded its global customer base, securing a position as the world's largest supplier of semiconductor storage solutions for emerging AI edge computing according to Frost & Sullivan.

The company has achieved substantial market penetration across key sectors including smart mobile devices (Oppo, Vivo, Honor), PCs (Lenovo, Xiaomi), enterprise servers, and over 20 leading automotive OEMs in the smart car field. Driven by its expertise in low-power, fast-response AI edge computing products like ePOP, which are now used in devices from Meta to Google, Biwin Storage saw revenue from this segment alone reach approximately RMB 1.75 billion. Additionally, the company launched high-performance upgrades such as the ePOP5x and won TIME magazine's "Best Inventions of the Year" for its Mini SSD, highlighting its technological leadership through continuous innovation in product design and efficiency.

Looking ahead, Biwin Storage is heavily investing in R&D, with expenses increasing by 41% to RMB 632 million as it develops domestic chip controllers like eMMC and UFS while expanding into advanced wafer-level packaging and testing. Backed by a robust inventory position secured through long-term agreements with global suppliers, the company adheres to its "5+2+X" strategy to dominate five major application markets and two growth engines: chip design and advanced packaging. With new manufacturing projects in Dongguan ramping up capacity, Biwin Storage aims to solidify its status as a world-class manufacturer serving the entire AI-driven device-edge-cloud ecosystem by 2026 and beyond.

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ALD precursor manufacturer AndecoMed plans to list on the Science and Technology Innovation Board.​


Anhui Andekeming Semiconductor Technology Co., Ltd. (Andekeming), a prominent manufacturer of ALD precursors for electronic-grade semiconductor thin film deposition, has officially submitted IPO guidance filing materials to the Anhui Securities Regulatory Bureau with plans to list on the Science and Technology Innovation Board. Guided by China International Capital Corporation, the company aims to capitalize on its growing role in the domestic supply chain. Established in 2018 and headquartered in Hefei, Andekeming has rapidly expanded into a key player in advanced semiconductor material production, focusing heavily on high-dielectric constant (High-K) and rare earth metal-based precursors while serving as an independent supplier rather than relying solely on agency business for overseas manufacturers.

The company operates within a highly specialized market containing over 200 types of commercialized precursor products globally, categorized mainly into silicon-based, High-K, and metal-based lines. While mature process materials are widely available, Andekeming is strategically focusing on advanced process nodes where metal-based precursors are critical. Currently valued at approximately $500 million in the domestic market for 2025, this sector faces intense competition; however, Andekeming has positioned itself as a vital mass production supplier by achieving over 100% year-on-year revenue growth for three consecutive years. With two major production bases established in Tongling and Jingzhou, the company reached an annual capacity of 210 tons of high-purity materials by mid-2025, with its seven products officially entering mass production and supply to leading domestic IC manufacturers.
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Leadership at Andekeming is anchored by Wang Qiongyu, a veteran semiconductor executive with extensive experience in battery technology and Apple's product development cycle before founding the company in 2018. His team of overseas-trained PhDs drives the firm's innovation, which has already attracted significant backing through seven rounds of equity financing from major institutional investors including TCL, Changxin Technology Group, and Walden International. Notably, a recent stake acquisition by Changxin Chip Investment a subsidiary of China's DRAM giant highlights Andekeming's deep integration into the local semiconductor ecosystem, serving as both an important material supplier and a strategic partner for domestic memory chip manufacturing.

Looking ahead, industry analysts project that the demand for ALD precursors will surge significantly between 2027 and 2028 as new production capacity for advanced logic and storage chips in China is gradually released. As high-K materials are essential for logic processes at 14nm and below and critical for DRAM memory expansion, domestic manufacturers stand to benefit immensely from the recovery of the memory chip industry cycle. However, analysts warn that failure to secure volume increases during this critical growth window could limit future opportunities, positioning Andekeming's successful listing as a potential catalyst for its continued dominance in China's nascent advanced semiconductor material supply chain.

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Wuyuan Semiconductor, a leading wafer-level advanced packaging company, has secured Series A funding.​

Wuyuan Semiconductor Technology, a prominent Qingdao-based enterprise specializing in advanced wafer-level packaging, has successfully completed its Series A financing round. This capital injection marks a significant milestone in the company's development trajectory, particularly regarding its expertise in 3D integrated semiconductors and hybrid bonding technology. The funding brings together a diverse group of strategic investors led by Shengjing Jiachang Venture Capital, with key participants including Huatai Investment, Renjun Capital, Shandong Finance and Investment Group, and notable funds such as Yongwan Capital and Jingming Capital.

Founded in May 2022, Wuyuan Semiconductor has positioned itself as a critical player in China's next-generation information technology industry chain. The company focuses on mid-process technologies like wafer-to-wafer (WoW) and chip-to-wafer (CoW), leveraging hybrid bonding to develop custom 3D integrated circuits for diverse applications including AI computing, memory chips, and automotive electronics. Distinctively, Wuyuan has constructed China's first large-scale mass production line dedicated to hybrid bonding technology, establishing a strong foundation for industrial expansion.
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Beyond securing funding, the company is actively driving regional economic goals, as its project was explicitly highlighted in the 2025 Shandong Provincial Government Work Report as essential for local industrial upgrading. With its existing technological advantages being consolidated, Wuyuan Semiconductor is already reporting commercial orders from leading domestic computing chip customers. Looking forward, the firm aims to deepen cooperation across the industry chain and help build a robust ecosystem for 3D integrated circuit production in Qingdao.

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Phytium's Nanjing R&D and Innovation Center is inaugurated! A leading domestic CPU company completes a key strategic move in the Yangtze River Delta region.​


Phytium Information, a leading domestic CPU company and core subsidiary of China Electronics Corporation (CEC), inaugurated its Nanjing R&D and Innovation Center. This marks a key strategic move expanding the company's footprint in the Yangtze River Delta region.

The center serves as Phytium's East China regional headquarters, focusing on chip technology R&D, market expansion, and developing core intellectual property (IP) for AI computing platforms and processors. Wang Guirong of CEC described the initiative as a dual effort to seize artificial intelligence opportunities and deepen central-local government cooperation. The center aims to become a hub for technological breakthroughs, technology transfer, and talent attraction within the cybersecurity and IT sectors.

Located in Nanjing a "China Software City" and national AI innovation pilot zone the location offers immense industrial support. The city's software and information service industry has surpassed 1 trillion yuan in scale, providing a complete ecosystem from chip design to terminal applications. Local authorities (Jianye District) pledged active support for Phytium's domestic IT substitution roadmap, accelerating the integration of its products with urban governance systems and HarmonyOS solutions.

This launch positions Nanjing as a critical node in China's semiconductor ecosystem, specifically tailored to drive next-generation AI computing power development under CEC's leadership.

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Dinglong's high-end wafer photoresist and core ceramic electrostatic chuck project went into production on the same day.​

On March 20, a significant milestone was achieved for China's semiconductor supply chain as Dinglong Technology and Hubei Xintao jointly launched their production facilities for critical "bottleneck" materials. This synchronized event marked the transition from pilot phases to full-scale commercial operations for two high-value projects located in Wuhan's Economic and Technological Development Area (WETDA): a 300-ton-per-year high-end wafer photoresist facility by Dinglong Technology and an advanced electrostatic chuck production line by Hubei Xintao.

The dual launch was designed to address long-standing domestic gaps, significantly enhance industrial supply chain resilience, and catalyze the growth of emerging new materials industries in Wuhan. The ceremony took place at a main venue in WETDA with video-linked branch venues in Qianjiang and Xintao, attended by senior government officials and industry leaders from national and provincial levels.

High-End Wafer Photoresist
The new facility is designed to produce 300 tons of high-end wafer photoresist annually, specifically targeting ArF/KrF grades. These products are essential for advanced lithography. The project aims to cover all process technology nodes used by domestic semiconductor foundries, meeting the full requirements for both logic chips and memory chips. Prior to this launch, China relied heavily on imports for such materials with a production rate of less than 10%. As the "chokepoint" material in semiconductor manufacturing, this project represents a breakthrough across technology, supply chain processes, and verification stages.

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Core Electrostatic Chuck
Located within WETDA's Comprehensive Bonded Zone, this project involves an investment exceeding 1 billion yuan. It plans for annual output of 1,500 high-end electrostatic chucks and 500 high-temperature heating plates. The team overcame core challenges in ceramic substrate preparation, electrostatic adsorption mechanisms, and temperature control uniformity. This allows the facility to produce chucks compatible with advanced process nodes of 7nm and below. Upon completion, Hubei Xintao will become the only domestic enterprise capable of controlling the entire production chain independently from raw core ceramic powders through electrode slurry and porous ceramics to final bonding adhesives.
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Liu Ziqing, Standing Committee Member of the Wuhan Municipal Party Committee, praised Dinglong as an outstanding example nurtured in WETDA. He outlined the district's vision to build a comprehensive "Automotive Valley" ecosystem and highlighted the strategic priority on cultivating semiconductor materials and automotive-grade chips. Zhu Shuangquan (Chairman of Dinglong) described the launch as a manifestation of a "demand-driven + forward-looking" innovation strategy. He emphasized that while production begins, the company will maintain high standards to promote integrated development along the entire industrial value chain.

This coordinated production launch signifies a major stride for China's semiconductor material industry. By achieving full-chain independent control over photoresist and core functional components like electrostatic chucks, Dinglong Technology and Hubei Xintao are not only resolving long-standing import dependencies but also establishing WETDA as a key hub for high-tech innovation and industrial upgrading.
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