Chinese semiconductor thread II

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Fujian signed 500 million yuan semiconductor materials project​

On March 18, the signing ceremony for the semiconductor materials project of Fujian Zhangping Jiuding Fluorochemical Co., Ltd. (hereinafter referred to as "Jiuding Fluorochemical") was held, and the project was officially launched in Yizhang Economic Development Zone.
It is reported that the semiconductor materials project of Jiuding Fluorochemical Co., Ltd. has a total investment of 500 million yuan. After the project reaches full production capacity, it will not only inject strong momentum into the regional economic development, but also attract upstream and downstream supporting enterprises to gather, promote the formation of a good industrial ecosystem in Yizhang Economic Development Zone, and further consolidate the foundation for the development of the fluorine lithium new materials industrial cluster.
Yu Dinghui, Chairman and General Manager of Jiuding Fluorochemical Co., Ltd., said that Yizhang has a solid industrial foundation and an excellent business environment, making it an ideal place for enterprises to take root, develop, and grow stronger. The company is full of confidence in this cooperation and will go all out to promote the project construction, strive for the project to be put into production and achieve results as soon as possible, and achieve a win-win situation and common development between the government and enterprises.

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Rongda Photosensitive's high-end dry film photoresist production line will begin trial production in the second half of 2026.​


On March 17, Rongda Photosensitive Materials Co., Ltd. stated on its interactive platform that the company's first high-end photosensitive circuit dry film photoresist production line is expected to be completed and enter the trial production stage in the second half of 2026. At present, the project is still under construction and there are no specific orders yet.

In the display and semiconductor photoresist business, the company maintains stable cooperative relationships with customers such as TCL CSOT, Laibao Hi-Tech, Sanan Optoelectronics, GCL Optoelectronics, and Jilin Huawei.

According to the company's 2024 annual report, the company's revenue from photoresist for display and semiconductor applications was RMB 33.3605 million in 2024.
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The high-end photosensitive circuit dry film is an upgraded version of the company's existing commercial photosensitive circuit dry film photoresist products, and its gross profit margin is expected to be higher than that of existing products.

Regarding KrF photoresist, the company has completed the configuration of core equipment, including photolithography machines, and related R&D work is currently progressing actively according to plan.

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The Tsinghua team has made a significant breakthrough in storage technology.​


On March 16, 2026, at the Zhongguancun Forum's "Beijing Basic Research and Technological Breakthrough Achievements" release event, Professor Song Cheng's team from the School of Materials Science and Engineering at Tsinghua University announced a major breakthrough in novel magnetic storage technology. This achievement lays a core scientific foundation for developing a new generation of magnetic storage devices featuring ultra-high density, ultra-fast read/write speeds, and low power consumption. The research focus centers on interlaced magnets and chiral antiferromagnetic materials, which were selected as one of Beijing's first batch of non-consensus disruptive innovation projects and received funding from the National Natural Science Foundation of China.

For years, magnetic storage technology has faced a fundamental dilemma where ferromagnetic materials are easy to read and write electrically but suffer from limited storage density due to stray fields, while antiferromagnetic materials have no stray fields and offer terahertz dynamics but present extreme difficulty in electrical reading and writing. Chiral antiferromagnetic materials, with their non-collinear spin arrangement, represent an ideal solution to break through this bottleneck. Against the backdrop of explosive global data growth rendering traditional storage capacity unsustainable, technologies with ultra-high density, ultra-high speed, and ultra-low power consumption have become essential requirements for next-generation information technology development.

The team's achievements unfolded across several milestones over recent years. In 2022, they conducted the first experimental verification of the interlaced spin splitting torque effect of interlaced magnets, recognized by the international academic community as an original experiment verifying the material system, which later helped these materials rank among the top ten scientific breakthroughs of 2024 according to Science magazine. By 2025, the team clearly identified crystal symmetry as the core characteristic of interleaved magnets and became the first in the world to achieve all-electrical read/write capability. Now in 2026, related technologies have further bridged the critical gap between basic research and application, propelling novel magnetic storage toward industrialization.

In their most recent breakthrough, the team achieved deterministic complete reversal of chiral antiferromagnetic order under zero magnetic field conditions through a homojunction design strategy, resulting in a significant leap in reversal efficiency while cracking the efficiency code of chiral antiferromagnetic electrical reversal. Currently, the team is accelerating the development of applications for both material types in spintronic prototype devices, which are expected to be deployed in the fields of next-generation storage, high-sensitivity sensors, terahertz communication, and artificial intelligence systems in the near future.​

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Yuwei Semiconductor is accelerating its deployment of semiconductor quality inspection equipment.​


• Mask substrate manufacturing: The Halo series mask substrate inspection equipment features high precision and high defect detection rate, is compatible with multiple types of templates, and enables fully automated defect review and analysis.

• Mask manufacturing: Building a full lifecycle quality monitoring system. The i6R series covers the entire process monitoring; the Raptor series mask pattern defect detection equipment has a 100% detection rate for key defects; the APEX-R1 series industrial-grade atomic force microscope achieves high-precision nano-morphological characterization and low-damage repair; the mask surface defect detection equipment features a unique "detection + cleaning" integration, achieving a 100% detection rate for difficult defects such as water stains and fingerprints.

• Chip Manufacturing: The i12-U series provides full-surface inspection for patternless wafers, while the i12-F series patterned wafer defect inspection equipment has been delivered in batches to leading customers. The i12-F300, in particular, supports simultaneous bright and dark field inspection and wafer-free formulation functionality, significantly improving production line efficiency and shortening NPI cycles. The HOUYI series overlay metrology equipment is widely used in domestic logic and memory chip production lines. The APEX-X1 series atomic force microscope metrology equipment specializes in complex three-dimensional structures such as FinFETs and 3D NAND. Combined with the Raptor series products, defect source control can be achieved.

• Advanced Packaging: The i12-F series patterned wafer defect inspection equipment supports various material types such as frames, warped wafers, and transparent/semi-transparent wafers, and can detect defect sizes down to 0.12um, meeting the inspection requirements of advanced packaging TSV, front-side metal processing, back-side processing, stacking processes, and other procedures; the i12-FEB5 series high-precision wafer edge and back-side defect inspection equipment can capture edge defects as small as 0.125μm, and integrates multiple contour measurement and defect classification functions, perfectly meeting the stringent requirements of HBM and 3D packaging hybrid bonding.

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Microwave instability study in a high-current electron storage ring​

Abstract​

In modern storage rings, microwave instability frequently represents a critical performance-limiting factor. A storage ring-based coherent light source (SRCLS) generally requires high average current to generate coherent extreme ultraviolet (EUV) radiation, featuring exceptionally strong damping capabilities and high beam current operation. To achieve high average power, this kind of light source maintains beam parameters characterized by high intensity, short bunch length, and a reduced momentum compaction factor, which heightens the significance of microwave instability. Notably, when particles propagate through bending magnets, there are substantially stronger coherent synchrotron radiation (CSR) effects compared to conventional light sources. Furthermore, the implementation of multiple damping wigglers to achieve short damping times produces intense coherent wiggler radiation (CWR). Given these considerations, a thorough investigation of microwave instability becomes imperative. This paper provides a comprehensive characterization of the dominant short-range wake fields in the storage ring and investigates the corresponding microwave instability thresholds.

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Numerical study of nucleation dynamics during tin vapor blast expansion​

Abstract​

This study numerically investigates the generation of tin nanoparticles following vapor expansion in an Extreme Ultraviolet (EUV) light source vessel, where the condensation process is driven by the evolution of a finite spherical blast. A multi-component compressible flow model coupled with classical nucleation theory is employed to simulate the tin vapor blast expansion and subsequent particle formation under EUV conditions. The effects of the initial tin vapor temperature on the supersaturation ratio, nucleation rate, and total particle count are systematically analyzed. Results indicate that lower initial temperatures lead to continuous particle generation over both short- and long-term timescales. Conversely, higher initial temperatures restrict nucleation primarily to the energy release stage, eventually suppressing particle formation entirely. Furthermore, the radial distribution of particles is shown to be governed by the gas contact discontinuity and secondary shock waves. These findings provide critical insights into controlling particulate contamination in EUV systems by coupling flow dynamics with condensation nucleation.​

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