The link for this article fails to mention SIOM, HIT, CIOMP and others...
Chinese semiconductor thread II
- Thread starter vincent
- Start date
#National Integrated Circuit Industry Investment Fund Increases Stake in SMIC#
According to information from the Hong Kong Stock Exchange, the National Integrated Circuit Industry Investment Fund Co., Ltd.'s shareholding in SMIC's H shares increased from 4.79% to 9.25% on December 29.
I saw the rumors a few days ago, now it's confirmed.
The National Integrated Circuit Industry Investment Fund (Big Fund) did not directly increase its stake in SMIC. Instead, SMIC acquired a 51% stake in SMIC Northern, making it a wholly-owned subsidiary. The Big Fund then replaced its existing holdings in SMIC Northern with these new shares.
According to information from the Hong Kong Stock Exchange, the National Integrated Circuit Industry Investment Fund Co., Ltd.'s shareholding in SMIC's H shares increased from 4.79% to 9.25% on December 29.
I saw the rumors a few days ago, now it's confirmed.
The National Integrated Circuit Industry Investment Fund (Big Fund) did not directly increase its stake in SMIC. Instead, SMIC acquired a 51% stake in SMIC Northern, making it a wholly-owned subsidiary. The Big Fund then replaced its existing holdings in SMIC Northern with these new shares.
Hesai Technology expects to deliver over 1.6 million units in 2025, with several new products to be showcased at CES 2026.
Hesai Technology announced its full-year delivery data for 2025, with total deliveries exceeding 1.6 million units, including approximately 1.4 million ADAS products and over 200,000 robotic products. The company's blockbuster product, ATX, achieved a remarkable first-year delivery volume exceeding 1 million units.
Data shows that Hesai's total delivery volume of all LiDAR products has exceeded 2.4 million units, with 2 million units delivered in 2024, demonstrating a continuous expansion in delivery scale.
The steady growth in delivery volume is attributed to strong production capacity, and Hesai is embracing a new era of multi-line growth with its super-capacity. It is reported that Hesai's self-built highly automated LiDAR production line adopts advanced intelligent manufacturing technology in the industry, utilizes a large number of intelligent industrial robots, and achieves 100% automation in core processes. Currently, it has achieved a high-efficiency production capacity of one LiDAR unit every 10 seconds.
Notably, Hesai Technology will be showcasing its products at CES 2026 in Las Vegas from January 6th to 9th, 2026. At the exhibition, Hesai will present several star products, including the recently updated ATX LiDAR featuring the Fermi C500 chip and photonic isolation technology, the next-generation L3 automotive-grade LiDAR solution (including the ET series for long-range LiDAR and the FT series for short-range blind spot coverage), and the JT series of miniature, high-performance 3D LiDARs for robotics.
Data shows that Hesai's total delivery volume of all LiDAR products has exceeded 2.4 million units, with 2 million units delivered in 2024, demonstrating a continuous expansion in delivery scale.
The steady growth in delivery volume is attributed to strong production capacity, and Hesai is embracing a new era of multi-line growth with its super-capacity. It is reported that Hesai's self-built highly automated LiDAR production line adopts advanced intelligent manufacturing technology in the industry, utilizes a large number of intelligent industrial robots, and achieves 100% automation in core processes. Currently, it has achieved a high-efficiency production capacity of one LiDAR unit every 10 seconds.
Notably, Hesai Technology will be showcasing its products at CES 2026 in Las Vegas from January 6th to 9th, 2026. At the exhibition, Hesai will present several star products, including the recently updated ATX LiDAR featuring the Fermi C500 chip and photonic isolation technology, the next-generation L3 automotive-grade LiDAR solution (including the ET series for long-range LiDAR and the FT series for short-range blind spot coverage), and the JT series of miniature, high-performance 3D LiDARs for robotics.
Semiconductor equipment such as ALD coating and ion implantation: Sirui Intelligent raises hundreds of millions of yuan in Series C funding, filling a gap in the market.
Qingdao Sirui Intelligent Technology Co., Ltd. (Sirui Intelligent) has raised hundreds of millions of yuan in Series C funding, led by the China Development Bank Manufacturing Transformation and Upgrading Fund and the China State-owned Enterprise Restructuring Fund, with participation from CMB International, BOC Asset Management, and Optics Valley Financial Holdings.
Founded in 2018, Sirui Intelligent specializes in semiconductor front-end equipment particularly atomic layer deposition (ALD) and ion implantation (IMP)—with R&D centers in Beijing, Shanghai, and a headquarters in Qingdao. The company has achieved key breakthroughs, including the development of China's first domestically produced 8MeV high-energy ion implanter in 2023, matching international advanced standards and breaking European and American market monopolies.
Sirui now offers a full range of ion implanters for silicon and third-generation semiconductors (like SiC), used in high-end chips such as CIS, memory, and RF devices. It has also strengthened its ALD capabilities through the acquisition of PENIX (Finland’s ALD technology pioneer), enabling joint R&D and global market leadership in niche applications.
Awarded the national "Little Giant" title for innovation, Sirui serves over 500 customers across 40 countries, positioning itself as a mid-to-high-end semiconductor equipment supplier with strong international reach. The funding supports further technological advancement and market expansion.
Founded in 2018, Sirui Intelligent specializes in semiconductor front-end equipment particularly atomic layer deposition (ALD) and ion implantation (IMP)—with R&D centers in Beijing, Shanghai, and a headquarters in Qingdao. The company has achieved key breakthroughs, including the development of China's first domestically produced 8MeV high-energy ion implanter in 2023, matching international advanced standards and breaking European and American market monopolies.
Sirui now offers a full range of ion implanters for silicon and third-generation semiconductors (like SiC), used in high-end chips such as CIS, memory, and RF devices. It has also strengthened its ALD capabilities through the acquisition of PENIX (Finland’s ALD technology pioneer), enabling joint R&D and global market leadership in niche applications.
Awarded the national "Little Giant" title for innovation, Sirui serves over 500 customers across 40 countries, positioning itself as a mid-to-high-end semiconductor equipment supplier with strong international reach. The funding supports further technological advancement and market expansion.
Chinese GPU manufacturer Hanbo Semiconductor completes IPO preparation; valuation reaches 10.5 billion yuan.
On January 1, it was reported that Hanbo Semiconductor (Shanghai) Co., Ltd., a domestic high-end GPU chip manufacturer, recently completed its IPO tutoring work, with CITIC Securities Co., Ltd. as the tutoring institution.
Hanbo Semiconductor launched its IPO on July 18, 2025. After two phases of guidance work, it has now officially completed the guidance phase.
Hanbo Semiconductor was founded in 2018. Its founder and CEO, Qian Jun, once led the AMD team to design and mass-produce the industry's first 7nm GPU.
Founder and CTO Zhang Lei has over 25 years of experience in high-end chip design and previously served as an AMD Fellow, responsible for the overall chip design and development in AMD's AI acceleration and video fields.
In terms of products, the company focuses on providing full-stack chip solutions for intelligent core computing power and graphics rendering, and has independently developed core IP and two generations of GPU chip products.
In 2021, it released its first server-grade AI inference chip, SV102. In 2023, at the World Artificial Intelligence Conference, it released its second-generation full-featured GPU, SG100, and launched the Nanyu series of GPU accelerator cards, VG1600, VG1800, VG14, as well as several AI accelerator cards.
In terms of capital, Hanbo Semiconductor has completed six rounds of financing in the six years since its establishment, with a total financing amount of over 2.5 billion yuan. In the 2025 Hurun Global Unicorn List, Hanbo Semiconductor was valued at 10.5 billion yuan, ranking 898th.
Hanbo Semiconductor launched its IPO on July 18, 2025. After two phases of guidance work, it has now officially completed the guidance phase.
Hanbo Semiconductor was founded in 2018. Its founder and CEO, Qian Jun, once led the AMD team to design and mass-produce the industry's first 7nm GPU.
Founder and CTO Zhang Lei has over 25 years of experience in high-end chip design and previously served as an AMD Fellow, responsible for the overall chip design and development in AMD's AI acceleration and video fields.
In terms of products, the company focuses on providing full-stack chip solutions for intelligent core computing power and graphics rendering, and has independently developed core IP and two generations of GPU chip products.
In 2021, it released its first server-grade AI inference chip, SV102. In 2023, at the World Artificial Intelligence Conference, it released its second-generation full-featured GPU, SG100, and launched the Nanyu series of GPU accelerator cards, VG1600, VG1800, VG14, as well as several AI accelerator cards.
In terms of capital, Hanbo Semiconductor has completed six rounds of financing in the six years since its establishment, with a total financing amount of over 2.5 billion yuan. In the 2025 Hurun Global Unicorn List, Hanbo Semiconductor was valued at 10.5 billion yuan, ranking 898th.
Huahong Company: Plans to acquire 97.5% stake in Huali Microelectronics for 8.3 billion yuan.
Huahong Corporation (688347.SH) announced that it plans to acquire 97.4988% equity of Shanghai Huali Microelectronics Co., Ltd. (hereinafter referred to as "Huali Micro") from four shareholders, namely Shanghai Huahong (Group) Co., Ltd., Shanghai Integrated Circuit Industry Investment Fund Co., Ltd., National Integrated Circuit Industry Investment Fund Phase II Co., Ltd., and Shanghai Guotou Pioneer Integrated Circuit Private Equity Investment Fund Partnership (Limited Partnership), through the issuance of shares. The transaction price (excluding the amount of supporting funds raised) is RMB 8.268 billion.The company will issue shares to no more than 35 eligible specific investors to raise supporting funds.
The issue price for the shares issued to acquire assets is RMB 43.34 per share. The number of shares issued in this share issuance to acquire assets is 191 million shares, raising a total of RMB 7.556 billion in supporting funds.The target company primarily provides 12-inch integrated circuit wafer foundry services to customers and offers complete technical solutions for terminal applications such as communications and consumer electronics.Both the target company and the listed company possess 65/55nm and 40nm process foundry technologies. Through this transaction, the listed company will further enhance its 12-inch wafer foundry capacity. The two companies' advantageous process platforms can achieve deep complementarity, jointly building a wafer foundry and supporting services that cover a wider range of application scenarios and more complete technical specifications, enabling them to provide customers with more diverse technical solutions and enrich their product portfolio.
The issue price for the shares issued to acquire assets is RMB 43.34 per share. The number of shares issued in this share issuance to acquire assets is 191 million shares, raising a total of RMB 7.556 billion in supporting funds.The target company primarily provides 12-inch integrated circuit wafer foundry services to customers and offers complete technical solutions for terminal applications such as communications and consumer electronics.Both the target company and the listed company possess 65/55nm and 40nm process foundry technologies. Through this transaction, the listed company will further enhance its 12-inch wafer foundry capacity. The two companies' advantageous process platforms can achieve deep complementarity, jointly building a wafer foundry and supporting services that cover a wider range of application scenarios and more complete technical specifications, enabling them to provide customers with more diverse technical solutions and enrich their product portfolio.
The pilot plant for photoresist resin has commenced construction, adding new strength to the battle for breakthroughs in domestically produced high-end materials!
Shangsai Group has launched construction of a 500-million-yuan pilot plant in Huanggang’s Chemical Industrial Park to produce 1,000 tons per year of high-end photoresist resin and advanced optoelectronic materials. This initiative marks a major step toward reducing China’s dependence on foreign suppliers, particularly Japanese and U.S. firms that dominate over 80% of the global high-end photoresist market. The plant will integrate five key platforms from resin polymerization to ultra-high-purity purification and quality control designed to bridge the gap between laboratory research and industrial-scale production.
Collaborative innovation models are accelerating progress. Partnerships between material suppliers and chipmakers such as Nanda Optoelectronics with Yangtze Memory have slashed verification cycles from two years to six months and enabled bulk orders of domestically produced ArF photoresist at 15% lower cost. Regional clusters like Qianjiang Microelectronics Park have further reduced material costs by over 20% through integrated supply chains. These models are now being replicated in Huanggang, creating a replicable blueprint for domestic semiconductor material ecosystems.
Technological breakthroughs are also gaining momentum. Bayi Space has launched China’s first 100-ton KrF resin line, Xingfu Electronics achieved domestic production of high-end photoinitiators, and Dinglong Technology now controls the full chain from monomers to purified resins. Meanwhile, Peking University’s cryo-electron tomography technique reduced photoresist defects by 99%, enabling 99.7% yield on SMIC’s 7nm line a landmark achievement proving China’s capacity for cutting-edge process-level innovation.
With the National Integrated Circuit Industry Investment Fund planning over 50 billion yuan in new investments especially for EUV and advanced resins and local governments offering subsidies, tax breaks, and land incentives, China is building a robust policy backbone for material self-reliance. The Huanggang pilot plant represents a systemic shift from fragmented R&D to integrated industrial innovation. If scaled successfully, China could achieve full self-sufficiency in mature-node photoresists by 2030 and emerge as a leader in advanced packaging and next-generation optoelectronic materials.
This was almost 4 years ago.
I would just ignore the SMIC north part of this.
It seems like gov't is just making a major investment into SMIC to make sure it has enough funding needed for all the expansion projects it needs to do in this AI race. After all, they injected $7.8 into the SMSC JV recently. So, I'm not surprised if they also bought into SMIC itself to provide SMIC with more liquidity. Maybe part of the agreement is that they need to use more domestic equipments.