The Nantong Haimen Advanced Packaging Substrate High-Performance Multilayer Film Project has been completed, with its main structure capped successfully, marking the final concrete pour. The smart factory will have an annual production capacity of 600,000 square meters of high-performance built-in film (BUF), featuring two coating lines. This breakthrough product breaks foreign technological monopolies and enables China’s first domestic supply of ABF-type packaging substrate materials critical for securing the integrated circuit industry.
Jiangsu Xingnan Chuangxin Materials Technology Co., Ltd. (a subsidiary of Nanya New Materials Technology Co., Ltd.) is behind the project, specializing in BUF development for advanced IC packaging, including ultra-low loss (XN-L102) and low-loss (XN-L041) materials used in CPUs, GPUs, baseband chips, and RF components.
In March 2024, Nanya New Materials signed a major investment deal in Haimen’s Development Zone under its "Shanghai R&D + Haimen Manufacturing" model. The first phase of the high-end electronic circuit substrate project involves 1.2 billion yuan in investment, focusing on industrializing key IC substrate and copper-clad laminate materials. Nanya New Materials is a leading private Chinese innovator in composite materials, listed on the Sci-Tech Innovation Board since 2020 and recognized as a national "specialized and innovative little giant" enterprise.
