<I. Technological Revolution in Domestic Lithography Machines
China's domestically produced lithography machines, employing laser-induced discharge plasma (LDP) technology, are expected to enter trial production in the third quarter of 2025. Featuring a compact design and a 40% reduction in energy consumption, this marks a significant step towards true self-reliance in the most cutting-edge semiconductor manufacturing field. This breakthrough may alter the traditional chip industry chain structure of "design abroad, manufacturing in East Asia, and application in China."
ASML, a traditional lithography machine giant, uses laser-induced plasma (LPP) technology in its EUV lithography machines. This technology relies on expensive and complex high-energy lasers to bombard tin droplets to generate plasma, and its control system is based on a precision FPGA. In contrast, the core of China's LDP technology lies in vaporizing the tin material between the electrodes and then converting it into a plasma state through high-voltage discharge. This "directional explosion" approach may be simpler and more efficient.
The Hyperion-1 prototype exhibits exciting features, such as a design that is one-third the size of ASML's, significantly reduced power consumption, and a clear manufacturing cost advantage. Although its power consumption is lower (50W vs. ASML's 250W), it has already achieved small-batch production of 5-3 nanometer nodes. Currently, its production capacity is approximately 10 wafers per hour, focusing on R&D and X-series chips. The plan is to launch Hyperion-2 by 2026, increasing production capacity to 150W/hour and achieving commercial production.>
----------------China's domestically produced lithography machines, employing laser-induced discharge plasma (LDP) technology, are expected to enter trial production in the third quarter of 2025. Featuring a compact design and a 40% reduction in energy consumption, this marks a significant step towards true self-reliance in the most cutting-edge semiconductor manufacturing field. This breakthrough may alter the traditional chip industry chain structure of "design abroad, manufacturing in East Asia, and application in China."
ASML, a traditional lithography machine giant, uses laser-induced plasma (LPP) technology in its EUV lithography machines. This technology relies on expensive and complex high-energy lasers to bombard tin droplets to generate plasma, and its control system is based on a precision FPGA. In contrast, the core of China's LDP technology lies in vaporizing the tin material between the electrodes and then converting it into a plasma state through high-voltage discharge. This "directional explosion" approach may be simpler and more efficient.
The Hyperion-1 prototype exhibits exciting features, such as a design that is one-third the size of ASML's, significantly reduced power consumption, and a clear manufacturing cost advantage. Although its power consumption is lower (50W vs. ASML's 250W), it has already achieved small-batch production of 5-3 nanometer nodes. Currently, its production capacity is approximately 10 wafers per hour, focusing on R&D and X-series chips. The plan is to launch Hyperion-2 by 2026, increasing production capacity to 150W/hour and achieving commercial production.>
I know that post is controversial, but I think there are already EUV pilot lines in China, that is not just a EUV research lab, EUV pilot lines, a step closer to production, of course I think that the current systems are not even close to ASML, probably a few dozens wafers per hour like the post says, but the goal of 80 or even 100 wafers per hour by 2027 is a very high probability.
I think people inside this development in China already know where things are going and institutions and their companies are RUSHING to be first in the commercialization of EUV. I think, that most traditional supplier of lithography sub-systems like RS-Laser and Guowang Optical are now focus on KrF, ArF and ArFi, so they have to move fast.
